Engineering Papers⌕ Search

SEARCH · Engineering Papers

Results for “SILICONES”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 1,045 records · Page 58
All sourcesNASA NTRSDOE OSTI
NASA NTRS1981

Material and processing needs for silicon solar cells in space

The technical concerns of NASA in the area of space grade solar cells are summarized. Solar power needs are projected through 1987. The degradation of solar cell performance due to the effects of radiation on impurities and crystal defects and the improved performance of float zone silicon are illustrated. The reduction of oxygen and carbon in float zone silicon allows for much faster low temperature annealing of the defects. The effects of improved crystal purity on cell performance are summarized.

Brandhorst, H. W., Jr.↗
NASA NTRS1981

Air Force future technical requirements for silicon

Technical requirements for silicon-based bulk materials are presented, and related work on other materials and on thin layer silicon is summarized. Programs supported by the Wright-Patterson materials laboratory and the capabilities of the materials laboratory in house characterization facility are listed.

Hemenger, P. M.↗
NASA NTRS1981

Ground based silicon zoning program

The preparation of building flight hardware and carrying out experiments in space was investigated. The ground based investigation phase A/B of the experimental float zoning of silicon is outlined. The overall program goals, leading to recommending experiments to be done in phase C/D are spelled out. Thermophysical properties which must be accurately known to compare thermophysical models to experimental zoning of silicon are listed.

Kern, E. L.↗
NASA NTRS1982

Silicon dendritic web material

The development of a low cost and reliable contact system for solar cells and the fabrication of several solar cell modules using ultrasonic bonding for the interconnection of cells and ethylene vinyl acetate as the potting material for module encapsulation are examined. The cells in the modules were made from dendritic web silicon. To reduce cost, the electroplated layer of silver was replaced with an electroplated layer of copper. The modules that were fabricated used the evaporated Ti, Pd, Ag and electroplated Cu (TiPdAg/Cu) system. Adherence of Ni to Si is improved if a nickel silicide can be formed by heat treatment. The effectiveness of Ni as a diffusion barrier to Cu and the ease with which nickel silicide is formed is discussed. The fabrication of three modules using dendritic web silicon and employing ultrasonic bonding for interconnecting calls and ethylene vinyl acetate as the potting material is examined.

Meier, D. L.↗
NASA NTRS1982

Method of protecting a surface with a silicon-slurry/aluminide coating

A low cost coating for protecting metallic base system substrates from high temperatures, high gas velocity oxidation, thermal fatigue and hot corrosion is described. The coating is particularly useful for protecting vanes and blades in aircraft and land based gas turbine engines. A lacquer slurry comprising cellulose nitrate containing high purity silicon powder is sprayed onto the superalloy substrates. The silicon layer is then aluminized to complete the coating. The Si-Al coating is less costly to produce than advanced aluminides and protects the substrate from oxidation and thermal fatigue for a much longer period of time than the conventional aluminide coatings. While more expensive Pt-Al coatings and physical vapor deposited MCrAlY coatings may last longer or provide equal protection on certain substrates, the Si-Al coating exceeded the performance of both types of coatings on certain superalloys in high gas velocity oxidation and thermal fatigue. Also, the Si-Al coating increased the resistance of certain superalloys to hot corrosion.

Deadmore, D. L.↗
NASA NTRS1982

Effects of processing and dopant on radiation damage removal in silicon solar cells

Gallium and boron doped silicon solar cells, processed by ion-implantation followed by either laser or furnace anneal were irradiated by 1 MeV electrons and their post-irradiation recovery by thermal annealing determined. During the post-irradiation anneal, gallium-doped cells prepared by both processes recovered more rapidly and exhibited none of the severe reverse annealing observed for similarly processed 2 ohm-cm boron doped cells. Ion-implanted furnace annealed 0.1 ohm-cm boron doped cells exhibited the lowest post-irradiation annealing temperatures (200 C) after irradiation to 5 x 10 to the 13th e(-)/sq cm. The drastically lowered recovery temperature is attributed to the reduced oxygen and carbon content of the 0.1 ohm-cm cells. Analysis based on defect properties and annealing kinetics indicates that further reduction in annealing temperature should be attainable with further reduction in the silicon's carbon and/or divacancy content after irradiation.

Weinberg, I.↗
NASA NTRS1982

On the cause of the flat-spot phenomenon observed in silicon solar cells at low temperatures and low intensities

A model is presented that explains the "flat-spot" (FS) power loss phenomenon observed in silicon solar cells operating deep space (low temperature, low intensity) conditions. Evidence is presented suggesting that the effect is due to localized metallurgical interactions between the silicon substrate and the contact metallization. These reactions are shown to result in localized regions in which the PN junction is destroyed and replaced with a metal-semiconductor-like interface. The effects of thermal treatment, crystallographic orientation, junction depth, and metallurization are presented along with a method of preventing the effect through the suppression of vacancy formation at the free surface of the contact metallization. Preliminary data indicating the effectiveness of a TiN diffusion barrier in preventing the effect are also given.

Weizer, V. G.↗
NASA NTRS1981

Multiple EFG silicon ribbon technology as the basis for manufacturing low-cost terrestrial solar cells

Mackintosh et al. (1978) have reported on the development of a multiple ribbon furnace based on the 'edge defined film fed growth' (EFG) process for the fabrication of silicon ribbon. It has been demonstrated that this technology can meet the requirements for a silicon substrate material to be used in the manufacture of solar panels which can meet requirements regarding a selling price of $0.70/Wp when certain goals in terms of throughput and quality are achieved. These goals for the multiple ribbon technology using 10 cm wide ribbon require simultaneous growth of 12 ribbons by one operator at average speeds of 4 to 4.5 cm/min, and 13% efficient solar cells. A description is presented of the progress made toward achieving these goals. It is concluded that the required performance levels have now been achieved. The separate aspects of technology must now be integrated into a single prototype furnace.

Mackintosh, B.↗
NASA NTRS1981

Silicon solar cells with nickel/solder metallization

The use of nickel plus solder is shown to be feasible for contact metallization for silicon solar cells by offering a relatively inexpensive method of making electrical contact with the cell surfaces. Nickel is plated on silicon solar cells using an electroless chemical deposition method to give contacts with good adhesion, and in some cases where adhesion is poor initially, sintering under relatively mild conditions will dramatically improve the quality of the bond without harming the p-n junction of the cell. The cells can survive terrestrial environment stresses, which is demonstrated by a 1000 hour test at 85 C and 85% relative humidity under constant forward bias of 0.45 volt.

Petersen, R. C.↗
NASA NTRS1981

Analytical calculation of thickness versus diameter requirements of silicon solar cells

It may be more cost-effective to produce larger diameter silicon Cz solar cells. However, greater thickness is anticipated to be necessary for larger diameter wafers to withstand wafering, cell processing and handling. No material standard for these dimensional requirements is practical or cost-effective for cell manufacturers. The equations relating wafer thickness and diameter were derived by using fracture mechanics analysis. An analytical model was used as a guideline to estimate thickness versus diameter requirements of silicon solar cells in terms of fracture mechanics parameters.

Chen, C. P.↗
NASA NTRS1982

Fabrication of turbine components and properties of sintered silicon nitride

This paper presents a status report on the injection molding of sinterable silicon nitride at GTE Laboratories. The effort involves fabrication of single axial turbine blades and monolithic radial turbine rotors. The injection molding process is reviewed and the fabrication of the turbine components discussed. Oxidation resistance and strength results of current injection molded sintered silicon nitride as well as dimensional checks on sintered turbine blades demonstrate that this material is a viable candidate for high temperature structural applications.

Neil, J. T.↗
NASA NTRS1982

Fracture of directionally solidified multicrystalline silicon

Fracture toughness data is given for multicrystalline silicon which has been prepared by directional solidification. Results indicated a plane-strain fracture toughness of 0.8 to 0.87 MN/m to the 3/2 power, which is consistent with data for single-crystal silicon.

Chen, C. P.↗
NASA NTRS1982

Fabrication of sinterable silicon nitride by injection molding

Transformation of structural ceramics from the laboratory to production requires development of near net shape fabrication techniques which minimize finish grinding. One potential technique for producing large quantities of complex-shaped parts at a low cost, and microstructure of sintered silicon nitride fabricated by injection molding is discussed and compared to data generated from isostatically dry-pressed material. Binder selection methodology, compounding of ceramic and binder components, injection molding techniques, and problems in binder removal are discussed. Strength, oxidation resistance, and microstructure of sintered silicon nitride fabricated by injection molding is discussed and compared to data generated from isostatically dry-pressed material.

Quackenbush, C. L.↗
NASA NTRS1982

On the cause of the flat-spot phenomenon observed in silicon solar cells at low temperatures and low intensities

A model is presented that explains the 'flat-spot' power-loss phenomenon observed in silicon solar cells operating under deep space (low temperature, low intensity) conditions. Evidence is presented suggesting that the effect is due to localized metallurgical interactions between the silicon substrate and the contact metallization. These reactions are shown to result in localized regions in which the PN junction is destroyed and replaced with a metal-semiconductor-like interface. The effects of thermal treatment, crystallographic orientation, junction depth, and metallization are presented along with a method of preventing the effect through the suppression of vacancy formation at the free surface of the contact metallization. Preliminary data indicating the effectiveness of a TiN diffusion barrier in preventing the effect are also given.

Weizer, V. G.↗
NASA NTRS1982

Investigating reliability attributes of silicon photovoltaic cells - An overview

Reliability attributes are being developed on a wide variety of advanced single-crystal silicon solar cells. Two separate investigations: cell-contact integrity (metal-to-silicon adherence), and cracked cells identified with fracture-strength-reducing flaws are discussed. In the cell-contact-integrity investigation, analysis of contact pull-strength data shows that cell types made with different metallization technologies, i.e., vacuum, plated, screen-printed and soldered, have appreciably different reliability attributes. In the second investigation, fracture strength was measured using Czochralski wafers and cells taken at various stages of processing and differences were noted. Fracture strength, which is believed to be governed by flaws introduced during wafer sawing, was observed to improve (increase) after chemical polishing and other process steps that tend to remove surface and edge flaws.

Royal, E. L.↗
NASA NTRS1981

Damage and coefficients and thermal annealing of irradiated silicon and GaAs solar cells

Electron and proton damage coefficients have been measured for several types of silicon cells of recent manufacture using 1 MeV electrons and protons with energies of 8.3, 17.5 and 40 MeV. LPE (AlGa)As-GaAs cells were also irradiated and pseudodamage coefficients derived under the assumption that the irradiation changes the diffusion length in only one of the n- or p-type layers. After irradiation the cells were annealed isochronally up to 450 C. The damage coefficient and annealing data for silicon cells are in substantial agreement with previous work. The GaAs cells have pseudo-damage coefficients which are dependent on fluence, and have about the same energy dependence as Si damage coefficients.

Anspaugh, B. E.↗
NASA NTRS1981

Improved performance from solar cells made from candidate sheet silicon materials

Performance of solar cells made from various candidate silicon sheets is updated and the results are presented. Solar cells were fabricated using a baseline process and other process variations, and tested under AM1 conditions. Performance of the baseline solar cells indicates that remarkable improvements in material quality have been achieved for most of the sheets, showing efficiencies close to that of the control cells made from conventional CZ silicon. Process variations (or additions), in general, have resulted in significant improvements in all performance with a degree of change dependent on the process chosen and to a certain extent the sheet quality.

Yoo, H. I.↗