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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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JSC Reliability Capabilities and the Role of the Receiving Inspection and Test Facility (RITF)
No abstract available
Operations Support Officer In Space Inspection Experience and Needs
No abstract available
The Surface-Tension Method of Visually Inspecting Honeycomb-Core Sandwich Plates
When one face of a metal-honeycomb-core sandwich plate is heated or cooled relative to the other, heat transfer through the core causes the temperature on each face at the lines of contact with the core to be slightly different from that on the rest of the face. If a thin liquid film is applied to the face, the variation of surface tension with temperature causes the liquid to move from warmer to cooler areas and thus to develop a pattern corresponding to the temperature pattern on the face. Irregularities in the pattern identify the locations where the core is not adequately bonded to the face sheet. The pattern is easily observed when a fluorescent liquid is used and illumination is by means of ultraviolet light. Observation in ordinary light is also possible when a very deeply colored liquid is used. A method based on the use of a thermographic phosphor to observe the temperature pattern was found to be less sensitive than the surface-tension method. A sublimation method was found to be not only less sensitive but also far more troublesome.
Scintillating Quantum Dots for Imaging X-rays (SQDIX) for Aircraft Inspection
Scintillation is the process currently employed by conventional x-ray detectors to create x-ray images. Scintillating quantum dots or nano-crystals (StQDs) are a novel, nanometer-scale material that upon excitation by x-rays, re-emit the absorbed energy as visible light. StQDs theoretically have higher output efficiency than conventional scintillating materials and are more environmental friendly. This paper will present the characterization of several critical elements in the use of StQDs that have been performed along a path to the use of this technology in wide spread x-ray imaging. Initial work on the SQDIX system has shown great promise to create state-of-the-art sensors using StQDs as a sensor material. In addition, this work also demonstrates a high degree of promise using StQDs in microstructured fiber optics. Using the microstructured fiber as a light guide could greatly increase the capture efficiency a StQDs based imaging sensor.
Composite Overwrapped Pressure Vessel (COPV) Liner and Thin Wall Metallic Pressure Vessel Inspection Scanner Development and Assessment
No abstract available
Scintillating Quantum Dots for Imaging X-Rays (SQDIX) for Aircraft Inspection
Scintillation is the process currently employed by conventional X-ray detectors to create X-ray images. Scintillating quantum dots (StQDs) or nano-crystals are novel, nanometer-scale materials that upon excitation by X-rays, re-emit the absorbed energy as visible light. StQDs theoretically have higher output efficiency than conventional scintillating materials and are more environmentally friendly. This paper will present the characterization of several critical elements in the use of StQDs that have been performed along a path to the use of this technology in wide spread X-ray imaging. Initial work on the scintillating quantum dots for imaging X-rays (SQDIX) system has shown great promise to create state-of-the-art sensors using StQDs as a sensor material. In addition, this work also demonstrates a high degree of promise using StQDs in microstructured fiber optics. Using the microstructured fiber as a light guide could greatly increase the capture efficiency of a StQDs based imaging sensor.
Computed Tomography Inspection and Analysis for Additive Manufacturing Components
No abstract available
Printed Circuit Board Inspection and Quality Control - PCB Failure Causes and Cures
This two day workshop will discuss a range of topics, including root cause analysis, physics-of-failure principles and failure mechanisms in printed circuit boards. Printed circuit boards (PCBs) are the baseline for electronics manufacturing upon which electronic components are mounted and formed into electronic systems. PCBs are used in a variety of electronic circuits from simple one-transistor amplifiers to large super computers. A PCB serves three main functions: 1) it provides the necessary mechanical support for the components in the circuit 2) it provides the necessary electrical interconnections, and 3) it bears some form of legend which identifies the components it carries. The failure modes on the PCBs can be categorized in a hierarchical structure, in which the mechanisms and causes are site or location dependant. Specimen preparation techniques, non-destructive and destructive analysis, and materials characterization will also be discussed. The first day of the workshop will present methodologies for identifying potential failure mechanisms in electronics based on the failure history and, systematic approaches to root cause analysis. The second day will cover failure analysis techniques geared towards various failure mechanisms, along with numerous component and PCB assembly failure analysis case studies that illustrate the techniques and analysis. Failure analysis case studies will be used to illustrate the techniques and analysis principles to arrive at the root cause(s) of field failures on printed circuit boards, active components, and assemblies.