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New logic circuits have response times no longer than 10 nanoseconds and drain only milliwatts of power. The family includes AND and NAND gates and forms the basis of all logic functions. The basic circuits are used in various types of digital-data-processing systems.
Decoder circuit with complementary-symmetry circuit configuration composed of MOS and n-p-n bipolar devices minimizes power consumption. Emitter-follower drive scheme results in low power dissipation and high speed operation.
Composite circuit uses both n-p-n bipolar and p-channel MOS transistors /BIMOS/. The BIMOS driver provides 1/ ease of integrated circuit construction, 2/ low standby power consumption, 3/ bidirectional current pulses, and 4/ current-pulse amplitudes and rise times independent of active device parameters.
Switching circuit utilizing silicon controlled rectifier reduces input power requirements normally associated with testing power semiconductors in an operational type mode. Circuit alleviates problems of inaccessibility, lack of large amounts of power, physical size of power resistors, wiring, and heat generation.
Circuit using dual control amplifiers and dual position demand potentiometers powered from separate sources is used for reliable hydraulic valve controller that prevents closure of valve when control circuits fail, and maintains valve control to close tolerance for more common modes of controller failure.
Circuit, using a bialkali photomultiplier tube and liquid scintillator, eliminates disadvantages of Owen circuit. It distinguishes between recoil protons /energies of 200 keV/ and Compton electrons /energies of 20 keV/.
Selective gold diffusion on monolithic silicon chips for switching and nonswitching amplifier devices and circuits and linear and digital logic circuits
Counter-divider circuit for accuracy and reliability in binary circuits
MTRAC program for transient analysis of circuits with square loop magnetic cores based on linearization of nonlinear circuit elements and Kirchhoff current law
Circuit includes two data channels and one shared precision power supply installed on a single 11.4 cm square circuit card. The unit is relatively inexpensive, compact, and suitable for most tests where low-noise and high-gain signal processing is required.
Design equations for hysteresis circuit are based on the following assumptions: amplifier input impedance is larger than source impedance; amplifier output impedance is less than load impedance; and amplifier switches state when differential input voltage is approximately zero. Circuits are designed to any given specifications.
Simple integrated circuit located at transducer, enables use of single coaxial cable for both input and output connections. Circuit is sensitive to changes in RC time constant, has much improved sensitivity characteristics, and is unaffected by changes in cable capacitance effects.
Circuit design and mask development sequence are improved by using general purpose computer with interactive graphics capability establishing efficient two way communications link between design engineer and system. Interactive graphics capability places design engineer in direct control of circuit development.
Two-wire IC pressure transducer bridge circuit performance features based on circuit analysis
Circuit with single operational amplifier conditions input signals for data acquisition systems by applying offset voltage correction signal to feedback circuit instead of one of the input terminals of operational amplifier.
Circuit elements are grouped on functional basis in rectangular two-dimensional planar arrays or modules. Another interconnection method brings all connections out to module edge. For smaller fluidic circuits, manifold and interconnections are fabricated as single blocks. Advantages of methods are given.
Development of electric discharge circuit damping element which increases in resistance with current and time is described. Damping element is resistor made of tungsten wire which has large resistance-temperature coefficient. Specifications of tungsten resistor and incorporation into circuit are explained.
Development of packaging system for mounting beam lead integrated chip circuit on lead frame is discussed. Process for fabricating large scale integration circuits is described. Diagrams illustrating method of construction are included.