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NASA NTRS1997

Attachment of Free Filament Thermocouples for Temperature Measurements on CMC

Ceramic Matrix Composites (CMC) are being developed for use as enabling materials for advanced aeropropulsion engine and high speed civil transport applications. The characterization and testing of these advanced materials in hostile, high-temperature environments require accurate measurement of the material temperatures. Commonly used wire Thermo-Couples (TC) can not be attached to this ceramic based material via conventional spot-welding techniques. Attachment of wire TC's with commercially available ceramic cements fail to provide sufficient adhesion at high temperatures. While advanced thin film TC technology provides minimally intrusive surface temperature measurement and has good adhesion on the CMC, its fabrication requires sophisticated and expensive facilities and is very time consuming. In addition, the durability of lead wire attachments to both thin film TC's and the substrate materials requires further improvement. This paper presents a newly developed attachment technique for installation of free filament wire TC's with a unique convoluted design on ceramic based materials such as CMC's. Three CMC's (SiC/SiC CMC and alumina/alumina CMC) instrumented with type IC, R or S wire TC's were tested in a Mach 0.3 burner rig. The CMC temperatures measured from these wire TC's were compared to that from the facility pyrometer and thin film TC's. There was no sign of TC delamination even after several hours exposure to 1200 C. The test results proved that this new technique can successfully attach wire TC's on CMC's and provide temperature data in hostile environments. The sensor fabrication process is less expensive and requires very little time compared to that of the thin film TC's. The same installation technique/process can also be applied to attach lead wires for thin film sensor systems.

Lei, Jih-Fen↗

NASA NTRS2004

An Apparatus for Monitoring the Health of Electrical Cables

As with most elements of infrastructure, electrical wiring is innocuous; usually hidden away and unnoticed until it fails. Failure of infrastructure, however, sometimes leads to serious health and safety hazards. Electrical wiring fails when the polymeric (usually rubber) insulation material that sheathes the conductor gets embrittled with age from exposure to pressure, temperature or radiation cycling or when the insulation gets removed by the chafing of wires against each other. Miles of such wiring can be found in typical aircraft, with significant lengths of the wiring immersed in aviation fuel - a recipe for an explosion if a spark were to occur. Diagnosing the health of wiring is thus an important aspect of monitoring the health of aging aircraft. Stress wave propagation through wiring affords a quick and non-invasive method for health monitoring. The extent to which a stress wave propagating through the cable core gets attenuated depends on the condition of the surrounding insulation. When the insulation is in good condition - supple and pliable, there is more damping or attenuation of the waveform. As the insulation gets embrittled and cracked, the attenuation is likely to reduce and the waveform of the propagating stress wave is likely to change. The monitoring of these changes provides a potential tool to evaluate wiring or cabling in service that is not accessible for visual inspection. This experiment has been designed for use in an introductory mechanical or materials engineering instrumentation lab. Initial setup (after procuring all the materials) should take the lab instructor about 4 hours. A single measurement can be initiated and saved to disk in less than 3 minutes, allowing for all the students in a typical lab section to take their own data rather than share a single set of data for the entire class.

Pai, Devdas M.↗

NASA NTRS2006

Miniature, shielded electrical connector with strain relief

An electrical connector assembly includes a wire bundle having at least one wire with a metal shield surrounding at least a portion of the wire. The shield has an end portion and provides electromagnetic interference protection to the wire. A backshell includes a body and a cover secured to the body together defining an internal cavity with the wire at least partially arranged within the cavity. The backshell provides EMI protection for the portion of the wire bundle not covered by the shield. The backshell includes a hole in a wall of either the body or the cover with the end portion of the shield extending through the hole. The clamp is secured about the body and the cover with the end portion of the shield arranged between the clamp and the backshell grounding the shield to the backshell. The clamp forces the backshell into engagement with the wire bundle to provide strain relief for the wire bundle.

Diep, Chuong H.↗

NASA NTRS2009

Microwave Power Combiners for Signals of Arbitrary Amplitude

Schemes for combining power from coherent microwave sources of arbitrary (unequal or equal) amplitude have been proposed. Most prior microwave-power-combining schemes are limited to sources of equal amplitude. The basic principle of the schemes now proposed is to use quasi-optical components to manipulate the polarizations and phases of two arbitrary-amplitude input signals in such a way as to combine them into one output signal having a specified, fixed polarization. To combine power from more than two sources, one could use multiple powercombining stages based on this principle, feeding the outputs of lower-power stages as inputs to higher-power stages. Quasi-optical components suitable for implementing these schemes include grids of parallel wires, vane polarizers, and a variety of waveguide structures. For the sake of brevity, the remainder of this article illustrates the basic principle by focusing on one scheme in which a wire grid and two vane polarizers would be used. Wire grids are the key quasi-optical elements in many prior equal-power combiners. In somewhat oversimplified terms, a wire grid reflects an incident beam having an electric field parallel to the wires and passes an incident beam having an electric field perpendicular to the wires. In a typical prior equal-power combining scheme, one provides for two properly phased, equal-amplitude signals having mutually perpendicular linear polarizations to impinge from two mutually perpendicular directions on a wire grid in a plane oriented at an angle of 45 with respect to both beam axes. The wires in the grid are oriented to pass one of the incident beams straight through onto the output path and to reflect the other incident beam onto the output path along with the first-mentioned beam.

Conroy, Bruce↗

NASA NTRS2007

Improved Sensing Coils for SQUIDs

An improvement in the design and fabrication of sensing coils of superconducting quantum interference device (SQUID) magnetometers has been proposed to increase sensitivity. It has been estimated that, in some cases, it would be possible to increase sensitivity by about half or to reduce measurement time correspondingly. The pertinent aspects of the problems of design and fabrication can be summarized as follows: In general, to increase the sensitivity of a SQUID magnetometer, it is necessary to maximize the magnetic flux enclosed by the sensing coil while minimizing the self-inductance of this coil. It is often beneficial to fabricate the coil from a thicker wire to reduce its self-inductance. Moreover, to optimize the design of the coil with respect to sensitivity, it may be necessary to shape the wire to other than a commonly available circular or square cross-section. On the other hand, it is not practical to use thicker superconducting wire for the entire superconducting circuit, especially if the design of a specific device requires a persistent-current loop enclosing a remotely placed SQUID sensor. It may be possible to bond a thicker sensing-coil wire to thinner superconducting wires leading to a SQUID sensor, but it could be difficult to ensure reliable superconducting connections, especially if the bonded wires are made of different materials. The main idea is to mold the sensing coil in place, to more nearly optimum cross sectional shape, instead of making the coil by winding standard pre-fabricated wire. For this purpose, a thin superconducting wire loop that is an essential part of the SQUID magnetometer would be encapsulated in a form that would serve as a mold. A low-melting-temperature superconducting metal (e.g., indium, tin, or a lead/tin alloy) would be melted into the form, which would be sized and shaped to impart the required cross section to the coil thus formed.

Penanen, Konstantin↗

NASA NTRS1984

Apparatus for disintegrating kidney stones

The useful life of the wire probe in an ultrasonic kidney stone disintegration instrument is enhanced and prolonged by attaching the wire of the wire probe to the tip of an ultrasonic transducer by means of a clamping arrangement. Additionally, damping material is applied to the wire probe in the form of a damper tube through which the wire probe passes in the region adjacent the transducer tip. The damper tube extends outwardly from the transducer tip a predetermined distance, terminating in a resilient soft rubber joint. Also, the damper tube is supported intermediate its length by a support member. The damper system thus acts to inhibit lateral vibrations of the wire in the region of the transducer tip while providing little or no damping to the linear vibrations imparted to the wire by the transducer.

Angulo, E. D.↗

NASA NTRS1991

Nozzle fabrication technique

A block of electrically conductive material which is to be formed into a body with internal and/or external surfaces that approximate hyperboloids of one sheet is placed so that its axis is set at a predetermined skew angle with relation to a traveling EDM electrode wire. The electrode wire is then moved into cutting proximity of the body wire. Thereafter, by revolving the body about its own axis, the external and/or internal surfaces of the body will be cut into an approximate hyperbolic surface of revolution depending upon whether the body is positioned with the cutting wire outside of the body or in a previously formed longitudinal passage in the body. As an alternative technique, elongated channels can also be cut into the wall of the body by successively orienting the body to a selected number of angular positions, with the electrode wire being either outside of the body or in a previously formed passage in the body. At each of these angular positions, the electrode wire is moved orthogonally with respect to the axis of the wire, while both the body axis skew angle and the rotational position about that axis is controlled by cutting a channel or groove in the body to relieve stresses in the body material or to convey a coolant fluid.

Wells, Dennis L.↗

NASA NTRS1992

Coupling device with improved thermal interface

The primary object of the present invention is to provide a simple, reliable, and lightweight coupling that will also have an efficient thermal interface. A further object of the invention is to provide a coupling that is capable of blind mating with little or no insertion forces. Another object of the invention is to provide a coupling that acts as a thermal regulator to maintain a constant temperature on one side of the coupling. Another object of the invention is to increase the available surface area of a coupling thus providing a larger area for the conduction of heat across the thermal interface. Another object of the invention is to provide a fluidic coupling that has no fluid passing across the interface, thus reducing the likelihood of leaks and contamination. The foregoing objects are achieved by utilizing, as in the prior art, a hot area (at an elevated temperature as compared to a cold area) with a need to remove excess heat from the hot area to a cold area. In this device, the thermal interface will occur not on a planar horizontal surface, but along a non-planar vertical surface, which will reduce the reaction forces and increase the thermal conductivity of the device. One non-planar surface is a surface on a cold pin extending from the cold area and the other non-planar surface is a surface on a hot pin extending from the hot area. The cold pin is fixed and does not move while the hot pin is a flexible member and its movement towards the cold pin will bring the two non-planar surfaces together forming the thermal interface. The actuating member for the device is a shape-memory actuation wire which is attached through an aperture to the hot pin and through another aperture to an actuation wire retainer. By properly programming the actuation wire, heat from the hot area will cause the actuation wire to bend the hot wire. Heat from the hot area will cause the actuation wire to bend the hot pin towards the cold pin forming the coupling and the desired thermal interface. The shape-memory actuation wire is made of a shape-memory-effect alloy such as Nitinol.

Milam, Malcolm Bruce↗

NASA NTRS2000

Fabrication of an Aluminum Based Hot Electron Mixer for Terahertz Applications

Aluminum based diffusion cooled hot electron bolometers (HEB) mixers, predicted to have better noise, bandwidth and to require less LO power than Nb based diffusion cooled HEBs, have been fabricated. Preliminary DC tests were performed. The bolometer elements consisted of short (0.1 to 0.3 micron), narrow (0.08 to 0. 15 micron) and thin (11 nm) aluminum wires connected to large contact pads consisting of a novel trilayer Al/Ti/Au. The patterns were defined by electron beam lithography and the metal deposition involved a double angle process, the Aluminum wires being deposited straight on and the pads being deposited at a 45 degree angle without breaking vacuum. The Al/Ti/Au trilayer was developed to provide a way of making contact between the aluminum wire and the gold antenna. The Titanium layer acts as a diffusion barrier to avoid damage of the Aluminum contact and bolometer wire and to lower the transition temperature of the pads to below that of the bolometer wire. The Au layer avoids the formation of an oxide on the Ti layer and provides good electrical contact to the IF/antenna structure. The resistance of the bolometers as a function of temperature was measured. It is clear that below the transition temperature of the wire (1.8K) but above the transition temperature of the contact pads (0.6K), the proximity effect drives most of the bolometer wire normal, causing a very broad transition. This effect should not affect the performance of the bolometers since they will be operated at a temperature below the TC of the pads. This is evident from the IV characteristics measured at 0.3K. RF characterization tests will begin shortly.

Echternach, P. M.↗

NASA NTRS2005

Three dimensional interactive display

A three-dimensional (3-D) interactive display and method of forming the same, includes a transparent capaciflector (TC) camera formed on a transparent shield layer on the screen surface. A first dielectric layer is formed on the shield layer. A first wire layer is formed on the first dielectric layer. A second dielectric layer is formed on the first wire layer. A second wire layer is formed on the second dielectric layer. Wires on the first wire layer and second wire layer are grouped into groups of parallel wires with a turnaround at one end of each group and a sensor pad at the opposite end. An operational amplifier is connected to each of the sensor pads and the shield pad biases the pads and receives a signal from connected sensor pads in response to intrusion of a probe. The signal is proportional to probe location with respect to the monitor screen.

Vranish, John M.↗

NASA NTRS2008

Electromagnetically Clean Solar Arrays

The term 'electromagnetically clean solar array' ('EMCSA') refers to a panel that contains a planar array of solar photovoltaic cells and that, in comparison with a functionally equivalent solar-array panel of a type heretofore used on spacecraft, (1) exhibits less electromagnetic interferences to and from other nearby electrical and electronic equipment and (2) can be manufactured at lower cost. The reduction of electromagnetic interferences is effected through a combination of (1) electrically conductive, electrically grounded shielding and (2) reduction of areas of current loops (in order to reduce magnetic moments). The reduction of cost is effected by designing the array to be fabricated as a more nearly unitary structure, using fewer components and fewer process steps. Although EMCSAs were conceived primarily for use on spacecraft they are also potentially advantageous for terrestrial applications in which there are requirements to limit electromagnetic interference. In a conventional solar panel of the type meant to be supplanted by an EMCSA panel, the wiring is normally located on the back side, separated from the cells, thereby giving rise to current loops having significant areas and, consequently, significant magnetic moments. Current-loop geometries are chosen in an effort to balance opposing magnetic moments to limit far-0field magnetic interactions, but the relatively large distances separating current loops makes full cancellation of magnetic fields problematic. The panel is assembled from bare photovoltaic cells by means of multiple sensitive process steps that contribute significantly to cost, especially if electomagnetic cleanliness is desired. The steps include applying a cover glass and electrical-interconnect-cell (CIC) sub-assemble, connecting the CIC subassemblies into strings of series-connected cells, laying down and adhesively bonding the strings onto a panel structure that has been made in a separate multi-step process, and mounting the wiring on the back of the panel. Each step increases the potential for occurrence of latent defects, loss of process control, and attrition of components. An EMCSA panel includes an integral cover made from a transparent material. The silicone cover supplants the individual cover glasses on the cells and serves as an additional unitary structural support that offers the advantage, relative to glass, of the robust, forgiving nature of the silcone material. The cover contains pockets that hold the solar cells in place during the lamination process. The cover is coated with indium tin oxide to make its surface electrically conductive, so that it serves as a contiguous, electrically grounded shield over the entire panel surface. The cells are mounted in proximity to metallic printed wiring. The painted-wiring layer comprises metal-film traces on a sheet of Kapton (or equivalent) polyimide. The traces include contact pads on one side of the sheet for interconnecting the cells. Return leads are on the opposite side of the sheet, positioned to form the return currents substantially as mirror images of, and in proximity to, the cell sheet currents, thereby minimizing magnetic moments. The printed-wiring arrangement mimics the back-wiring arrangement of conventional solar arrays, but the current-loop areas and the resulting magnetic moments are much smaller because the return-current paths are much closer to the solar-cell sheet currents. The contact pads are prepared with solder fo electrical and mechanical bonding to the cells. The pocketed cover/shield, the solar cells, the printed-wiring layer, an electrical bonding agent, a mechanical-bonding agent, a composite structural front-side face sheet, an aluminum honeycomb core, and a composite back-side face sheet are all assembled, then contact pads are soldered to the cells and the agents are cured in a single lamination process.

Stem, Theodore G.↗

NASA NTRS2005

Update on High-Temperature Coils for Electromagnets

A report revisits the subject matter of "High-Temperature Coils for Electromagnets" (LEW-17164), NASA Tech Briefs, Vol. 26, No. 8, (August 2002) page 38. To recapitulate: Wires have been developed for use in electromagnets that operate at high temperatures. The starting material for a wire of this type can be either a nickel-clad, ceramic-insulated copper wire or a bare silver wire. The wire is covered by electrical-insulation material that is intended to withstand operating temperatures in the range from 800 to 1,300 F (.430 to .700 C): The starting wire is either primarily wrapped with S-glass as an insulating material or else covered with another insulating material wrapped in S-glass prior to the winding process. A ceramic binding agent is applied as a slurry during the winding process to provide further insulating capability. The turns are pre-bent during winding to prevent damage to the insulation. The coil is then heated to convert the binder into ceramic. The instant report mostly reiterates the prior information and presents some additional information on the application of the ceramic binding agent and the incorporation of high-temperature wire into the windings.

Kascak, Albert F.↗

NASA NTRS2013

Miga Aero Actuator and 2D Machined Mechanical Binary Latch

Shape memory alloy (SMA) actuators provide the highest force-to-weight ratio of any known actuator. They can be designed for a wide variety of form factors from flat, thin packages, to form-matching packages for existing actuators. SMA actuators can be operated many thousands of times, so that ground testing is possible. Actuation speed can be accurately controlled from milliseconds to position and hold, and even electronic velocity-profile control is possible. SMA actuators provide a high degree of operational flexibility, and are truly smart actuators capable of being accurately controlled by onboard microprocessors across a wide range of voltages. The Miga Aero actuator is a SMA actuator designed specifically for spaceflight applications. Providing 13 mm of stroke with either 20- or 40-N output force in two different models, the Aero actuator is made from low-outgassing PEEK (polyether ether ketone) plastic, stainless steel, and nickel-titanium SMA wires. The modular actuator weighs less than 28 grams. The dorsal output attachment allows the Aero to be used in either PUSH or PULL modes by inverting the mounting orientation. The SPA1 actuator utilizes commercially available SMA actuator wire to provide 3/8-in. (approx. =.1 cm) of stroke at a force of over 28 lb (approx. = .125 N). The force is provided by a unique packaging of the single SMA wire that provides the output force of four SMA wires mechanically in parallel. The output load is shared by allowing the SMA wire to slip around the output attachment end to adjust or balance the load, preventing any individual wire segment from experiencing high loads during actuation. A built-in end limit switch prevents overheating of the SMA element following actuation when used in conjunction with the Miga Analog Driver [a simple MOSFET (metal oxide semiconductor field-effect transistor) switching circuit]. A simple 2D machined mechanical binary latch has been developed to complement the capabilities of SMA wire actuators. SMA actuators typically perform ideally as latch-release devices, wherein a spring-loaded device is released when the SMA actuator actuates in one direction. But many applications require cycling between two latched states open and closed.

Gummin, Mark A.↗

NASA NTRS2018

Conductivity of a Copper-Carbon Covetic Composite

NASA is currently engaged in the development of highly electrically conductive wire for space and aviation power and propulsion applications. Higher levels of electrical conductivity and lower densities compared to copper and aluminum are needed to improve the efficiency of commercial aviation and space flight. Carbon, in various forms, is being considered as a component in composites to increase conductivity and decrease density in Cu and Al. One form of carbon that is currently receiving much interest is known as covectic. The technology currently known as covetics was first introduced by Shugart and Scherer whose patents claimed "Carbon can be incorporated into any of these metals by melting the metal, mixing the carbon into the molten metal and, while mixing, applying a current of sufficient amperage to the molten mixture such that the carbon becomes incorporated into the metal, thereby forming a single phase metal-carbon material." It is reported that in this process a conversion reaction occurs with the carbon forming covalent bonds with the host metal, and that covetic processing enables higher carbon solubility and improvements in properties. Although there is a growing body of work supporting covetic materials, it is still a very new and somewhat controversial field. Composition, density, and electrical conductivity measurements of a covetically processed alloy ingot of Cu and C, with a nominal composition of Cu-0.4wt.% C, were made. A pure Cu ingot was similarly processed for comparison. Sections of these ingots were worked into wire and tested. Only small amounts of C could be detected in the Cu-0.4wt.% C ingot, and trace amounts (0.006 wt.%) in the wire. All wires had densities very close to the full density of pure Cu, indicating a high level of Cu purity and low void fraction. Finally, the electrical conductivity of the Cu-0.4wt.% C wires were 9% lower than the samples similarly processed but without C additions. The wires made without C additions had conductivities approximately equal to pure Cu. The low conductivity of the Cu-0.4wt.% C material is believed to be due to: (1) a structure of interfaces in the wire created by collapsed voids lined with elemental C, (2) impurities, such as Fe in the Cu, which came from the added C, and (3) a small volume fraction of voids.

Degroh, Henry C.↗

NASA NTRS1976

Effect of velocity gradients on measurements of turbulent shear stress

Experiments were carried out to evaluate the effects of normal velocity gradients on hot wire measurements in a subsonic boundary layer of the same size as the flow investigated by Johnson and Rose (1975). Both hot wire and film anemometers were used to measure the turbulent properties of the boundary layer. A special X-wire probe with one wire vertical and the other at an angle of about 40 deg to the flow was used to demonstrate the gradient effects. The results indicate that major errors are encountered when mean and turbulent velocity gradients exist along the length of hot wire sensors, the problem being more pronounced at high speeds. Although the split film sensor results show a significant improvement over the X-wire sensor, further reduction in the space resolution of sensors by roughly an order of magnitude would appear to be necessary to reduce the error to acceptable values near the wall.

Sandborn, V. A.↗

NASA NTRS1992

Palladium-chromium static strain gages for high temperatures

An electrical resistance strain gage that can provide accurate static strain measurement to a temperature of 1500 F or above is being developed both in fine wire and thin film forms. The gage is designed to be temperature compensated on any substrate material. It has a dual element: the gage element is a special alloy, palladium-13wt percent chromium (PdCr), and the compensator element is platinum (Pt). Earlier results of a PdCr based wire gage indicated that the apparent strain of this gage can be minimized and the repeatability of the apparent strain can be improved by prestabilizing the gage on the substrate for a long period of time. However, this kind of prestabilization is not practical in many applications and therefore the development of a wire gage which is prestabilized before installation on the substrate is desirable. This paper will present our recent progress in the development of a prestabilized wire gage which can provide meaningful strain data for the first thermal cycle. A weldable PdCr gage is also being developed for field testing where conventional flame-spraying installation can not be applied. This weldable gage is narrower than a previously reported gage, thereby allowing the gage to be more resistant to buckling under compressive loads. Some preliminary results of a prestabilized wire gage flame-sprayed directly on IN100, an engine material, and a weldable gage spot-welded on IN100 and SCS-6/(beta)21-S Titanium Matrix Composite (TMC), a National Aero-Space Plane (NASP) structure material, will be reported. Progress on the development of a weldable thin film gage will also be addressed. The measurement technique and procedures and the lead wire effect will be discussed.

Lei, Jih-Fen↗

NASA NTRS1993

The constant current loop: A new paradigm for resistance signal conditioning

A practical, single, constant-current loop circuit for the signal conditioning of variable-resistance transducers was synthesized, analyzed, and demonstrated. The strain gage and the resistance temperature device are examples of variable-resistance sensors. Lead wires connect variable-resistance sensors to remotely located signal-conditioning hardware. The presence of lead wires in the conventional Wheatstone bridge signal-conditioning circuit introduces undesired effects that reduce the quality of the data from the remote sensors. A practical approach is presented for suppressing essentially all lead wire resistance effects while indicating only the change in resistance value. Theoretical predictions supported by laboratory testing confirm the following features of the approach: (1) the dc response; (2) the electrical output is unaffected by extremely large variations in the resistance of any or all lead wires; (3) the electrical output remains zero for no change in gage resistance; (4) the electrical output is inherently linear with respect to gage resistance change; (5) the sensitivity is double that of a Wheatstone bridge circuit; and (6) the same excitation and sense wires can serve multiple independent gages. An adaptation of the current loop circuit is presented that simultaneously provides an output signal voltage directly proportional to transducer resistance change and provides temperature information that is unaffected by transducer and lead wire resistance variations. These innovations are the subject of NASA patent applications.

Anderson, Karl F.↗

NASA NTRS1994

The constant current loop: A new paradigm for resistance signal conditioning

A practical single constant current loop circuit for the signal conditioning of variable-resistance transducers has been synthesized, analyzed, and demonstrated. The strain gage and the resistance temperature detector are examples of variable-resistance sensors. Lead wires connect variable-resistance sensors to remotely located signal-conditioning hardware. The presence of lead wires in the conventional Wheatstone bridge signal-conditioning circuit introduces undesired effects that reduce the quality of the data from the remote sensors. A practical approach is presented for suppressing essentially all lead wire resistance effects while indicating only the change in resistance value. Theoretical predictions supported by laboratory testing confirm the following features of the approach: (1) dc response; (2) the electrical output is unaffected by extremely large variation in the resistance of any or all lead wires; (3) the electrical output remains zero for no change in gage resistance; (4) the electrical output is inherently linear with respect to gage resistance change; (5) the sensitivity is double that of a Wheatstone bridge circuit; and (6) the same excitation wires can serve multiple independent gages. An adaptation of current loop circuit is presented that simultaneously provides an output signal voltage directly proportional to transducer resistance change and provides temperature information that is unaffected by transducer and lead wire resistance variations. These innovations are the subject of NASA patent applications.

Anderson, Karl F.↗