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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 1,027 records · Page 57

Improved Particle Heat Transfer by way of Bimodal Particle Distributions for High Temperature Solar Thermal Energy

High temperature solar thermal facilities are looking to increase operating temperatures through novel heat transfer media, one such being solid particles. These particles operating at high temperatures will require transferring their thermal energy into another working fluid like supercritical carbon dioxide which can be used in advanced power cycles. Achieving high heat transfer between the particles and supercritical carbon dioxide is essential to high efficiency and low-cost operation. Therefore, optimizing the thermal conductivity of these particles is one potential way to ensure high performance. Traditionally, unimodal particle distributions have been employed in high temperature particle solar power plants. However, ambient temperature testing of bimodal particle distributions has revealed a superior thermal conductivity when compared to its unimodal counterpart at the same temperature. This data was obtained by certified, off-the-shelf instruments that can effectively simulate the conditions a particle would be exposed to in a high temperature solar thermal system. Data obtained in this way suggests that the increased thermal conductively imputed by a bimodal particle distribution is significant at working temperatures in solar facilities. Furthermore, the thermal conductivity of these bimodal particle distributions peaks when the best combination of large and small particles is applied. At high temperatures, binary particle distributions are compared to monodispersed distributions of larger particles where heat transfer is more prolific due to the increased surface radiation. Various thermal conductivity, porosity and heat exchanger models are explored in conjunction with data acquired up to 700 C.

Stout, Dallin (ORCID:0009000294586091)↗

A thermal scale modeling study for Apollo and Apollo applications, volume 1

The program is reported for developing and demonstrating the capabilities of thermal scale modeling as a thermal design and verification tool for Apollo and Apollo Applications Projects. The work performed for thermal scale modeling of STB; cabin atmosphere/spacecraft cabin wall thermal interface; closed loop heat rejection radiator; and docked module/spacecraft thermal interface are discussed along with the test facility requirements for thermal scale model testing of AAP spacecraft. It is concluded that thermal scale modeling can be used as an effective thermal design and verification tool to provide data early in a spacecraft development program.

Shannon, R. L.↗

Factors affecting the thermal shock resistance of several hafnia based composites containing graphite or tungsten

The thermal shock resistance of hafnia based composites containing graphite powder or tungsten fibers was investigated in terms of material properties which include thermal expansion, thermal conductivity, compressive fracture stress, modulus of elasticity, and phase stability in terms of the processing parameters of hot pressing pressure and/or density, degree of stabilization of the hafnia, and composition. All other parameters were held constant or assumed constant. The thermal shock resistance was directly proportional to the compressive fracture stress to modulus of elasticity ratio and was not affected appreciably by the small thermal expansion or thermal conductivity changes. This ratio was found to vary strongly with the composition and density such that the composites containing graphite had relatively poor thermal shock resistance, while the composites containing tungsten had superior thermal shock resistance.

Lineback, L. D.↗

Correlation of predicted and measured thermal stresses on an advanced aircraft structure with similar materials

A laboratory heating test simulating hypersonic heating was conducted on a heat-sink type structure to provide basic thermal stress measurements. Six NASTRAN models utilizing various combinations of bar, shear panel, membrane, and plate elements were used to develop calculated thermal stresses. Thermal stresses were also calculated using a beam model. For a given temperature distribution there was very little variation in NASTRAN calculated thermal stresses when element types were interchanged for a given grid system. Thermal stresses calculated for the beam model compared similarly to the values obtained for the NASTRAN models. Calculated thermal stresses compared generally well to laboratory measured thermal stresses. A discrepancy of signifiance occurred between the measured and predicted thermal stresses in the skin areas. A minor anomaly in the laboratory skin heating uniformity resulted in inadequate temperature input data for the structural models.

Jenkins, J. M.↗

Thermal Storage Applications Workshop. Volume 2: Contributed Papers

The solar thermal and the thermal and thermochemical energy storage programs are described as well as the technology requirements for both external (electrical) and internal (thermal, chemical) modes for energy storage in solar power plants. Specific technical issues addressed include thermal storage criteria for solar power plants interfacing with utility systems; optimal dispatch of storage for solar plants in a conventional electric grid; thermal storage/temperature tradeoffs for solar total energy systems; the value of energy storage for direct-replacement solar thermal power plants; systems analysis of storage in specific solar thermal power applications; the value of seasonal storage of solar energy; criteria for selection of the thermal storage system for a 10 MW(2) solar power plant; and the need for specific requirements by storage system development teams.

Source record↗

Heat transfer, thermal control, and heat pipes

This volume provides information on recent progress in spacecraft thermal control and the supporting disciplines of conduction, thermal radiation, and heat pipe theory and application. Four problem areas are considered: conduction heat transfer, radiation heat transfer, thermal control, and heat pipes. The topics covered include finite-element methodology for transient conduction/forced-convection thermal analysis; effects of surface finish on thermal contact resistance between different materials; mathematical models for wide-band nongray gas radiation in spherical and cylindrical geometries; thermal design, analysis and testing of the Shuttle remote manipulator arm; porous heat pipe; and transient behavior of liquid trap heat-pipe thermal diodes. Also discussed is the thermal design concept for a high-resolution UV spectrometer.

Olstad, W. B.↗

Space Shuttle Orbiter flight heating rate measurement sensitivity to thermal protection system uncertainties

A study was completed to determine the sensitivity of computed convective heating rates to uncertainties in the thermal protection system thermal model. Those parameters considered were: density, thermal conductivity, and specific heat of both the reusable surface insulation and its coating; coating thickness and emittance; and temperature measurement uncertainty. The assessment used a modified version of the computer program to calculate heating rates from temperature time histories. The original version of the program solves the direct one dimensional heating problem and this modified version of The program is set up to solve the inverse problem. The modified program was used in thermocouple data reduction for shuttle flight data. Both nominal thermal models and altered thermal models were used to determine the necessity for accurate knowledge of thermal protection system's material thermal properties. For many thermal properties, the sensitivity (inaccuracies created in the calculation of convective heating rate by an altered property) was very low.

Bradley, P. F.↗

Thermal stress fracture in elastic-brittle materials

The reported investigation shows that the assessment of the possibility of the thermal fracture of brittle materials depends upon an accurate evaluation of the thermal stresses and the determination of the resulting stress intensity factors. The stress intensity factors can be calculated in a variety of ways ranging from the very precise to approximate, but only for a limited number of geometries. The main difficulty is related to the determination of the thermal stress field because of its unusual character and its dependence upon boundary conditions at points far from the region of thermal activity. Examination of a number of examples suggests that the best visualization of the thermal stresses and any associated fracture can be made by considering the problem to be the combination of thermal and isothermal problems or by considering that the prime effect of the temperature is in the generation of thermal strains and that the thermal stresses are simply the result of the region trying to accommodate these strains.

Emery, A. F.↗

Automatic thermal switch

An automatic thermal switch to control heat flow includes a first thermally conductive plate, a second thermally conductive plate and a thermal transfer plate pivotally mounted between the first and second plates. A phase change power unit, including a plunger connected to the transfer plate, is in thermal contact with the first thermally conductive plate. A biasing element, connected to the transfer plate, biases the transfer plate in a predetermined position with respect to the first and second plates. When the phase change power unit is actuated by an increase in heat transmitted through the first plate, the plunger extends and pivots the transfer plate to vary the thermal conduction between the first and second plates through the transfer plate. The biasing element, transfer plate and piston can be arranged to provide either a normally closed or normally open thermally conductive path between the first and second plates.

Wing, L. D.↗

Thermal analysis of the vertical bridgman semiconductor crystal growth technique

The quality of semiconductor crystals grown by the vertical Bridgman technique is strongly influenced by the axial and radial variations of temperature within the charge. The relationship between the thermal parameters of the vertical Bridgman system and the thermal behavior of the charge are examined. Thermal models are developed which are capable of producing results expressable in analytical form and which can be used without recourse to extensive computer work for the preliminary thermal design of vertical Bridgman crystal growth systems. These models include the effects of thermal coupling between the furnace and the charge, charge translation rate, charge diameter, thickness and thermal conductivity of the confining crucible, thermal conductivity change and liberation of latent heat at the growth interface, and infinite charge length. The hot and cold zone regions, considered to be at spatially uniform temperatures, are separated by a gradient control region which provides added thermal design flexibility for controlling the temperature variations near the growth interface.

Jasinski, T. J.↗

Theoretical basis for design of thermal-stress-free fasteners

A theoretical basis was developed for the design of fasteners which are free of thermal stress. A fastener can be shaped to eliminate the thermal stress which would otherwise result from differential thermal expansion between dissimilar fastener and sheet materials for many combinations of isotropic and orthotropic materials. The resulting joint remains snug, yet free of thermal stress at any temperature, if the joint is uniform in temperature, if it is frictionless, and if the coefficients of thermal expansion of the materials do not change with temperature. In general, such a fastener has curved sides; however, if both materials have isotropic coefficients of thermal expansion, a conical fastener is free of thermal stress. Equations are presented for thermal stress free shapes at both initial and final temperature, and typical fastener shapes are shown.

Blosser, M. L.↗

Orbital maneuvering vehicle thermal design and analysis techniques

This paper describes the OMV thermal design that is required to maintain components within temperature limits for all mission phases. A key element in the OMV thermal design is the application of a motorized thermal shade assembly that is a replacement for the more conventional variable conductance heat pipes or louvers. The thermal shade assembly covers equipment module radiator areas, and based upon the radiator temperature input to onboard computer, opens and closes the shade, varying the effective radiator area. Thermal design verification thermal analyses results are presented. Selected thermal analyses methods, including several unique subroutines, are discussed. A representation of enclosure Script F equations, in matrix form, is also included. Personal computer application to the development of the OMV thermal design is summarized.

Chapter, J.↗

Development of an emulation-simulation thermal control model for space station application

The orbiting space station being developed by NASA will have many thermal sources and sinks as well as requirements for the transport of thermal energy through large distances. The station is also expected to evolve over twenty or more years from an initial design. As the station evolves, thermal management will become more difficult. Thus, analysis techniques to evaluate the effects of changing various thermal loads and the methods utilized to control temperature distributions in the station are essential. Analysis techniques, including a user-friendly computer program, were developed which should prove useful to thermal designers and system analysts working on the space station. The program uses a data base and user input to compute costs, sizes, and power requirements for individual components and complete systems. User input consists of selecting mission parameters, selecting thermal acquisition configurations, transport systems and distances, and thermal rejection configurations. The capabilities of the program may be expanded by including additional thermal models as subroutines.

Hartley, James G.↗

Thermal-stress-free fasteners for joining orthotropic materials

Hot structures fabricated from orthotropic materials are an attractive design option for future high speed vehicles. Joining subassemblies of these materials with standard cylindrical fasteners can lead to loose joints or highly stressed joints due to thermal stress. A method has been developed to eliminate thermal stresses and maintain a tight joint by shaping the fastener and mating hole. This method allows both materials (fastener and structure), with different coefficients of thermal expansion (CTEs) in each of the three material directions, to expand freely with temperature yet remain in contact. For the assumptions made in the analysis, the joint will remain snug, yet free of thermal stress at any temperature. Finite element analysis was used to verify several thermal-stress-free fasteners and to show that conical fasteners, which are thermal-stress-free for isotropic materials, can reduce thermal stresses for transversely isotropic materials compared to a cylindrical fastener. Equations for thermal-stress-free shapes are presented and typical fastener shapes are shown.

Blosser, M. L.↗

Thermal-stress-free fasteners for joining orthotropic materials

Hot structures fabricated from orthotropic materials are an attractive design option for future high speed vehicles. Joining subassemblies of these materials with standard cylindrical fasteners can lead to loose joints or highly stressed joints due to thermal stress. A method has been developed to eliminate thermal stress and maintain a tight joint by shaping the fastener and mating hole. This method allows both materials (fastener and structure), with different coefficients of thermal expansion (CTE's) in each of the three principal material directions, to expand freely with temperature yet remain in contact. For the assumptions made in the analysis, the joint will remain snug, yet free of thermal stress at any temperature. Finite element analysis was used to verify several thermal-stress-free fasteners and to show that conical fasteners, which are thermal-stress-free for isotropic materials, can reduce thermal stresses for transversely isotropic materials compared to a cylindrical fastener. Equations for thermal-stress-free shapes are presented and typical fastener shapes are shown.

Blosser, Max L.↗

Determining bonding, thickness, and density via thermal wave impedance NDE

Bonding, density, and thickness of coatings have a vital effect on their performance in many applications. Pioneering development work on thermal wave nondestructive evaluation (NDE) methods during the past 25 years has resulted in an array of useful techniques for performing bonding, density, and thickness measurements in a practical shop environment. The most useful thermal wave methods for this purpose are based on thermal wave surface impedance measurement or scanning. A pulse of heat from either a thermal transducer or a hot gas pulse is projected onto the surface, and the resulting temperature response is analyzed to unfold the bonding, density, and thickness of the coating. An advanced emissivity independent infrared method was applied to detect the temperature response. These methods were recently completely computerized and can automatically provide information on coating quality in near real-time using the proper equipment. Complex shapes such as turbine blades can be scanned. Microscopic inhomogeneities such as microstructural differences and small, normal, isolated voids do not cause problems but are seen as slight differences in the bulk thermal properties. Test objects with rough surfaces can be effectively nondestructively evaluated using proper thermal surface impedance methods. Some of the basic principles involved, as well as metallographic results illustrating the ability of the thermal wave surface impedance method to detect natural nonbonds under a two-layer thermally sprayed coating, will be presented.

Green, D. R.↗

Shuttle payload bay thermal environments: Summary and conclusion report for STS Flights 1-5

The thermal data for the payload bay of the first five shuttle flights is summarized and the engineering evaluation of that data is presented. After a general discussion on mission profiles and vehicle configurations, the thermal design and flight instrumentation systems of the payload bay are described. The thermal flight data sources and a categorization of the data are then presented. A thermal flight data summarization section provides temperature data for the five phases of a typical mission profile. These are: prelaunch, ascent, on-orbit, entry and postlanding. The thermal flight data characterization section encompasses this flight data for flight to flight variations, payload effects, temperature ranges, and other variations. Discussion of the thermal environment prediction models in use by industry and various NASA Centers, and the results predicted by these models, is followed by an evaluation of the correlation between the actual flight data and the results predicted by the models. Finally, the available thermal data are evaluated from the viewpoint of the user concerned with establishing the thermal environment in the payload bay. The data deficiencies are discussed and recommendations for their elimination are presented.

Fu, J. H.↗

Thermal design of the Wide Field/Planetary Camera

The Wide Field/Planetary Camera is an imaging system developed by the Jet Propulsion Laboratory for the NASA Hubble Space Telescope currently scheduled to be launched in December 1989 aboard the space shuttle. The temperature control design of the instrument utilizes multilayered insulation, electric resistance heaters, aluminum/ammonia heat pipes, thermoelectric coolers, temperature control coatings, and space radiators. A feedback control system maintains stable sensor temperatures. Thermal capacitance maintains stable optics and electronics temperatures during transient conditions. Schedule slips and launch delays have allowed extensive thermal testing of the instrument. Six instrument thermal vacuum tests and a spacecraft thermal vacuum test were performed. Several modifications have been made to the instrument to correct icing and contamination problems that have been discovered during thermal vacuum testing. This paper describes the thermal design, last instrument thermal vacuum test, results, and thermal model correlation.

Garcia, R. D.↗