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At least 1,027 records · Page 57

180-GHz Interferometric Imager

A 180-GHz interferometric imager uses compact receiver modules, combined high- and low-gain antennas, and ASIC (application specific integrated circuit) correlator technology, enabling continuous, all-weather observations of water vapor with 25-km resolution and 0.3-K noise in 15 minutes of observation for numerical weather forecasting and tropical storm prediction. The GeoSTAR-II prototype instrument is broken down into four major subsystems: the compact, low-noise receivers; sub-array modules; IF signal distribution; and the digitizer/correlator. Instead of the single row of antennas adopted in GeoSTAR, this version has four rows of antennas on a coarser grid. This dramatically improves the sensitivity in the desired field of view. The GeoSTAR-II instrument is a 48-element, synthetic, thinned aperture radiometer operating at 165-183 GHz. The instrument has compact receivers integrated into tiles of 16 elements in a 4x4 arrangement. These tiles become the building block of larger arrays. The tiles contain signal distribution for bias controls, IF signal, and local oscillator signals. The IF signals are digitized and correlated using an ASIC correlator to minimize power consumption. Previous synthetic aperture imagers have used comparatively large multichip modules, whereas this approach uses chip-scale modules mounted on circuit boards, which are in turn mounted on the distribution manifolds. This minimizes the number of connectors and reduces system mass. The use of ASIC technology in the digitizers and correlators leads to a power reduction close to an order of magnitude.

Kangaslahti, Pekka P.↗

Design of microwave broadband CMOS transmitter and receiver circuits for MIR and ECEI plasma diagnostics

To efficiently determine the plasma electron density fluctuations using the MIR diagnostic technique, a 55–75 GHz 65 nm-CMOS transmitter has been developed where four separate intermediate frequency (IF) signals are up-converted, amplified, and then combined to generate an 8-tone RF output; a broadband 90 nm-CMOS receiver has also been constructed, which consists of an RF-low noise amplifier (LNA), mixer, and IF amplifier. The circuits and their corresponding modules will soon be deployed on the DIII-D and NSTX-U fusion devices. A 110–140 GHz 65 nm-CMOS receiver has also been designed, which is suitable for measuring the deep-core temperature fluctuations in the DIII-D tokamak using the electron cyclotron emission imaging diagnostic system. In addition to the RF-LNA/balun, mixer, and IF amplifier, an LO balun/tripler and driving amplifier are now included in this highly integrated circuit chip. By adopting the microwave and millimeterwave system-on-chip concept in the front-end system design, this paper demonstrates that compact transmitter and receiver modules can be easily built, which, in turn, facilitates array implementation and maintenance.

70 PLASMA PHYSICS AND FUSION TECHNOLOGY↗

Large scale multi-node simulations of $\mathbb{Z}_2$ gauge theory quantum circuits using Google Cloud Platform

Simulating quantum field theories on a quantum computer is one of the most exciting fundamental physics applications of quantum information science. Dynamical time evolution of quantum fields is a challenge that is beyond the capabilities of classical computing, but it can teach us important lessons about the fundamental fabric of space and time. Whether we may answer scientific questions of interest using near-term quantum computing hardware is an open question that requires a detailed simulation study of quantum noise. Here we present a large scale simulation study powered by a multi-node implementation of qsim using the Google Cloud Platform. We additionally employ newly-developed GPU capabilities in qsim and show how Tensor Processing Units -- Application-specific Integrated Circuits (ASICs) specialized for Machine Learning -- may be used to dramatically speed up the simulation of large quantum circuits. We demonstrate the use of high performance cloud computing for simulating $\mathbb{Z}_2$ quantum field theories on system sizes up to 36 qubits. We find this lattice size is not able to simulate our problem and observable combination with sufficient accuracy, implying more challenging observables of interest for this theory are likely beyond the reach of classical computation using exact circuit simulation.

Gustafson, Erik↗

Low loss fiber-coupled volumetric interconnects fabricated via direct laser writing

Photonic integrated circuits (PICs) are vital for high-speed data transmission. However, optical routing is limited in PICs composed of only one or a few stacked planes. Further, coupling losses must be low in deployed systems. Previously, we developed the subsurface controllable refractive index via beam exposure (SCRIBE) technique to write accurate 3D gradient refractive index (GRIN) profiles within a mesoporous silica scaffold. Here, we apply SCRIBE to fabricate low loss, broadband, polarization insensitive, fiber-coupled, single-mode volumetric interconnects that include waveguides traversing arbitrary 3D paths. By seamlessly integrating mode-matching subsurface lenses and GRIN waveguide tapers, calibrating for positional writing errors, implementing multipass exposure, automating alignment, and switching to antireflection coated fibers, we reduced the insertion loss for a fiber-PIC-fiber interconnect from 50 to 2.14 dB, or 1.47 dB, excluding the fiber array’s loss. Further, we establish an upper bound of 0.45 dB loss per coupler. We report quality factors of 27,000 and 77,000 and bending losses of 6 and 3 dB/cm for 15 and 30 µm radii microrings, respectively. We also demonstrate Bézier escalators, polarization-rotating and polarization-splitting interconnects, and a seven-channel 25 µm pitch volumetric interconnect. The SCRIBE platform presents a clear path toward realizing 3D PICs with unique functionality.

Optics↗

Advanced Components for Spaceborne Infrared Astronomy

Basic improvements in the technology of low noise read-out systems for low background detectors were demonstrated. Using discrete JFET integrating amplifiers at their optimum temperature of 55 K, read noise less than 7.5 electrons in 128 seconds of integration was obtained. Two models of single channel integrators are now available, the JF-77 for use between 50 and 80 K and the JF-4 for lower temperatures. A 1 x 15 linear array of complete integrators on a single integrated circuit was developed and will be made available in the near future. The successful operation of a superconducting stepper motor was demonstrated. The motor shows a three fold increase in torque over conventional motors operating at room temperature. The success of the motor stems from the use of superconducting coils in conjunction with developments in bearings for cryogenic use, rare-earth rotors, and motor cooling techniques. The current state of development will allow the rapid development of motors optimized for specific applications. An electronic switch capable of resetting cooled JFET integrating amplifiers was developed. The JFET integrating amplifiers that use this switch have demonstrated read noise of less than 10 electrons. The JFET reset device exhibits an extremely high open impedance and low leakage current. Capacitance is sufficiently low so as not to impair amplifier sensitivity. The effects of transient switching charges are minimized by a compensation technique and variable transient current problems inherent to devices of this type are overcome by external circuity.

Davidson, Arnold W.↗

Strategies for on-chip digital data compression for X-ray pixel detectors

Here, the continued desire for X-ray pixel detectors with higher frame rates will stress the ability of application-specific integrated circuit (ASIC) designers to provide sufficient off-chip bandwidth to reach continuous frame rates in the 1 MHz regime. To move from the current 10 kHz to the 1 MHz frame rate regime, ASIC designers will continue to pack as many power-hungry high-speed transceivers at the periphery of the ASIC as possible. In this paper, however, we present new strategies to make the most efficient use of the off-chip bandwidth by utilizing data compression schemes for X-ray photon-counting and charge-integrating pixel detectors. In particular, we describe a novel in-pixel compression scheme that converts from analog to digital converter units to encoded photon counts near the photon Poisson noise level and achieves a compression ratio of >1.5x independent of the dataset. In addition, we describe a simple yet efficient zero-suppression compression scheme called "zeromask" (ZM) located at the ASIC's edge before streaming data off the ASIC chip. ZM achieves average compression ratios of >4x, >7x, and >8x for high-energy X-ray diffraction, ptychography, and X-ray photon correlation spectroscopy datasets, respectively. We present the conceptual designs, register-transfer level block diagrams, and the physical ASIC implementation of these compression schemes in 65 nm CMOS. When combined, these two digital compression schemes could increase the effective off-chip bandwidth by a factor of 6-12x.

47 OTHER INSTRUMENTATION↗

Fail-Safe Logic Design Strategies Within Modern FPGA Architectures

Fail-safe computing refers to computing systems that revert to a non-operational safe state when a fault occurs. In this paper, we investigate a circuit level technique as mitigation for single event upsets (SEUs) and fault injection attacks on field programmable gate arrays (FPGAs), and analyze the effectiveness of the technique as a fail-safe monitor for an encryption algorithm. The propagation of fault effects through FPGA primitives including lookup tables (LUTs) and programmable interconnect points (PIPs) is assessed within an FPGA architecture created using an open source tool, and validated using fault injection experiments on an FPGA. The analysis reveals additional vulnerabilities exist within reconfigurable architectures over those in equivalent fail-safe application specific integrated circuit (ASIC), thus requiring a more elaborate network of redundant circuits and checking logic. The configuration memory bits (CMBs), which configure routing and designate logic functions within the LUTs of the FPGA, add complexity to fail-safe design strategies by introducing additional fault conditions and fault propagation paths. A resource-efficient fail-safe circuit design technique called DEsign for Fail-safe in reCONfigurable systems (DEFCON) is proposed. The benefits and limitations associated with DEFCON are described in the context of fault injection experiments carried out as simulations and in FPGA hardware.

Bhakta, Priya A. [Univ. of New Mexico, Albuquerque↗

HEMT Frequency Doubler with Output at 300 GHz

An active frequency doubler in the form of an InP-based monolithic microwave integrated circuit (MMIC) containing a high-electron-mobility transistor (HEMT) has been demonstrated in operation at output frequencies in the vicinity of 300 GHz. This is the highestfrequency HEMT doubler reported to date, the next-highest-frequency active HEMT doubler having been previously reported to operate at 180 GHz. While the output power of this frequency doubler is less than that of a typical Schottky diode, this frequency doubler is considered an intermediate product of a continuing effort to realize the potential of active HEMT frequency doublers to operate with conversion efficiencies greater than those of passive diode frequency doublers. An additional incentive for developing active HEMT frequency doublers lies in the fact that they can be integrated with amplifiers, oscillators, and other circuitry on MMIC chips. The circuitry of the doubler MMIC (see Figure 1) features grounded coplanar waveguides. Air bridges and vias are used to make contact with the ground plane. The HEMT is biased for Class-A operation (in which current is conducted throughout each cycle of oscillation), which would ordinarily be better suited to linear amplification than to frequency doubling. Ordinarily, class-B operation (in which current is conducted during about half of each cycle of oscillation) would be more suitable for frequency doubling because of the essential nonlinearity of partial-cycle conduction. The reason for the unusual choice of class A was that computational simulations had shown that in this case, the efficiency in class B would be less than in class A. The input matching circuit of this doubler includes transmission lines that afford a good impedance match at the fundamental frequency, plus an open stub to prevent leakage of the second harmonic through the input terminals. The output circuit was designed to suppress the fundamental while providing a good match for the second harmonic.

Samoska, Lorene↗

High performance VLSI telemetry data systems

NASA's deployment of major space complexes such as Space Station Freedom (SSF) and the Earth Observing System (EOS) will demand increased functionality and performance from ground based telemetry acquisition systems well above current system capabilities. Adaptation of space telemetry data transport and processing standards such as those specified by the Consultative Committee for Space Data Systems (CCSDS) standards and those required for commercial ground distribution of telemetry data, will drive these functional and performance requirements. In addition, budget limitations will force the requirement for higher modularity, flexibility, and interchangeability at lower cost in new ground telemetry data system elements. At NASA's Goddard Space Flight Center (GSFC), the design and development of generic ground telemetry data system elements, over the last five years, has resulted in significant solutions to these problems. This solution, referred to as the functional components approach includes both hardware and software components ready for end user application. The hardware functional components consist of modern data flow architectures utilizing Application Specific Integrated Circuits (ASIC's) developed specifically to support NASA's telemetry data systems needs and designed to meet a range of data rate requirements up to 300 Mbps. Real-time operating system software components support both embedded local software intelligence, and overall system control, status, processing, and interface requirements. These components, hardware and software, form the superstructure upon which project specific elements are added to complete a telemetry ground data system installation. This paper describes the functional components approach, some specific component examples, and a project example of the evolution from VLSI component, to basic board level functional component, to integrated telemetry data system.

Chesney, J.↗

Electrically Isolating Subsystems in SOAC Technologies

Integrated circuit fabrication technology has evolved to the point that it is possible to construct complete systems, including power, data processing, and communications, on a single chip. Such System-on-a-chip (SOAC) technologies can enable drastic reductions in spacecraft size and weight, lowering the cost of missions and presenting new mission opportunities. This paper overviews some key enabling technologies unique to the needs of spacecraft for outer-planet exploration and missions requiring extreme resistance to radiation such as Europa orbiters and Europa Landers. The work is being carried out by Kansas State University (KSU) under direction of the Center for Integrated Space Microsystems (CISM) at NASA's Jet Propulsion Laboratory. Additional information is contained in the original extended abstract.

Boyd, R. M.↗

Operation of a New Half-Bridge Gate Driver for Enhancement - Mode GaN FETs, Type LM5113, Over a Wide Temperature Range

A new commercial-off-the-shelf (COTS) gate driver designed to drive both the high-side and the low-side enhancement-mode GaN FETs, National Semiconductor's type LM5113, was evaluated for operation at temperatures beyond its recommended specified limits of -40 C to +125 C. The effects of limited thermal cycling under the extended test temperature, which ranged from -194 C to +150 C, on the operation of this chip as well as restart capability at the extreme cryogenic and hot temperatures were also investigated. The driver circuit was able to maintain good operation throughout the entire test regime between -194 C and +150 C without undergoing any major changes in its outputs signals and characteristics. The limited thermal cycling performed on the device also had no effect on its performance, and the driver chip was able to successfully restart at each of the extreme temperatures of -194 C and +150 C. The plastic packaging of this device was also not affected by either the short extreme temperature exposure or the limited thermal cycling. These preliminary results indicate that this new commercial-off-the-shelf (COTS) halfbridge eGaN FET driver integrated circuit has the potential for use in space exploration missions under extreme temperature environments. Further testing is planned under long-term cycling to assess the reliability of these parts and to determine their suitability for extended use in the harsh environments of space.

Patterson, Richard↗

Analog vector-matrix multiplication by capacitive elements with resistive state storage

An array circuit includes a plurality of vector-matrix multiplication (VMM) elements arranged in rows and columns. The VMM elements are configured to collectively perform multiplication of an input vector by a programmed input matrix to generate a plurality of output values that are representative of a result matrix that is the result of multiplication of the input vector and the input matrix. The VMM elements store states of the input matrix. Input voltages to the array are representative of elements of the input vector. A VMM element draws charge from a column read line based upon charging of a capacitor in the VMM. An integrator circuit connected to the column read line outputs a voltage that is indicative of a total charge drawn from the column read line by elements connected to the read line, which voltage is further indicative of an element of a result matrix.

Agarwal, Sapan↗

An Open-Source Framework for Rapid Validation of Scientific ASICs

Spacely is an open-source framework for the post-silicon validation of analog, digital, and mixed-signal ASICs (Application-Specific Integrated Circuits) which maximizes the reuse of hardware and software, reducing the time taken to achieve meaningful test results. Spacely specifically addresses the needs of small, flexible ASIC design teams commonly found in academia or research institutions which benefit most from sharing the overhead of test stand creation between many unique ASIC designs. Spacely is a set of software, firmware, and design practices. It targets two primary hardware platforms (NI-PXI and Caribou) as well as offering extensible support for bench instruments. Spacely provides a high-level Python interface to all test hardware for accessibility, while also giving more sophisticated teams the opportunity to integrate custom test firmware. The design principles of Spacely are presented in brief. Current documentation is available at https://github.com/SpacelyProject/spacely-docs.

Quinn, Adam [Fermilab]↗

An Open-Source Framework for Rapid Validation of Scientific ASICs

Spacely is an open-source framework for the post-silicon validation of analog, digital, and mixed-signal ASICs (Application-Specific Integrated Circuits) which maximizes the reuse of hardware and software, reducing the time taken to achieve meaningful test results. Spacely specifically addresses the needs of small, flexible ASIC design teams commonly found in academia or research institutions which benefit most from sharing the overhead of test stand creation between many unique ASIC designs. Spacely is a set of software, firmware, and design practices. It targets two primary hardware platforms (NI-PXI and Caribou) as well as offering extensible support for bench instruments. Spacely provides a high-level Python interface to all test hardware for accessibility, while also giving more sophisticated teams the opportunity to integrate custom test firmware. The design principles of Spacely are presented, along with a demonstrative example of using Spacely to test a pixel detector readout ASIC.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Digital Radar-Signal Processors Implemented in FPGAs

High-performance digital electronic circuits for onboard processing of return signals in an airborne precipitation- measuring radar system have been implemented in commercially available field-programmable gate arrays (FPGAs). Previously, it was standard practice to downlink the radar-return data to a ground station for postprocessing a costly practice that prevents the nearly-real-time use of the data for automated targeting. In principle, the onboard processing could be performed by a system of about 20 personal- computer-type microprocessors; relative to such a system, the present FPGA-based processor is much smaller and consumes much less power. Alternatively, the onboard processing could be performed by an application-specific integrated circuit (ASIC), but in comparison with an ASIC implementation, the present FPGA implementation offers the advantages of (1) greater flexibility for research applications like the present one and (2) lower cost in the small production volumes typical of research applications. The generation and processing of signals in the airborne precipitation measuring radar system in question involves the following especially notable steps: The system utilizes a total of four channels two carrier frequencies and two polarizations at each frequency. The system uses pulse compression: that is, the transmitted pulse is spread out in time and the received echo of the pulse is processed with a matched filter to despread it. The return signal is band-limited and digitally demodulated to a complex baseband signal that, for each pulse, comprises a large number of samples. Each complex pair of samples (denoted a range gate in radar terminology) is associated with a numerical index that corresponds to a specific time offset from the beginning of the radar pulse, so that each such pair represents the energy reflected from a specific range. This energy and the average echo power are computed. The phase of each range bin is compared to the previous echo by complex conjugate multiplication to obtain the mean Doppler shift (and hence the mean and variance of the velocity of precipitation) of the echo at that range.

Berkun, Andrew↗

HAMSR - The High Altitude MMIC Sounding Radiometer

WAMSR is a millimeter wave atmospheric temperature and humidity sounder that utilizes state of the art technology to enable substantial reductions in size and mass while at the same time achieve improved measurement sensitivity and accuracy. It is the first such instrument to use receivers based entirely on newly developed monolithic microwave integrated circuit technology. Sponsored by the NASA Instrument Incubator Program, HAMSR has been under development for the past 2 112 years. The first science mission takes place in Florida this summer, where HAMSR is deployed on the NASA ER-2 during the CAMEX-4 hurricane field campaign and will provide core atmospheric soundings to a number of investigators. HAMSR represents the next generation of microwave sounders.

remote sensing↗

K-Band Phased Array Developed for Low- Earth-Orbit Satellite Communications

Future rapid deployment of low- and medium-Earth-orbit satellite constellations that will offer various narrow- to wide-band wireless communications services will require phased-array antennas that feature wide-angle and superagile electronic steering of one or more antenna beams. Antennas, which employ monolithic microwave integrated circuits (MMIC), are perfectly suited for this application. Under a cooperative agreement, an MMIC-based, K-band phased-array antenna is being developed with 50/50 cost sharing by the NASA Lewis Research Center and Raytheon Systems Company. The transmitting array, which will operate at 19 gigahertz (GHz), is a state-of-the-art design that features dual, independent, electronically steerable beam operation ( 42 ), a stand-alone thermal management, and a high-density tile architecture. This array can transmit 622 megabits per second (Mbps) in each beam from Earth orbit to small Earth terminals. The weight of the total array package is expected to be less than 8 lb. The tile integration technology (flip chip MMIC tile) chosen for this project represents a major advancement in phased-array engineering and holds much promise for reducing manufacturing costs.

Anzic, Godfrey↗

Use of a Frequency Divider to Evaluate an SOI NAND Gate Device, Type CHT-7400, for Wide Temperature Applications

Frequency dividers constitute essential elements in designing phase-locked loop circuits and microwave systems. In addition, they are used in providing required clocking signals to microprocessors and can be utilized as digital counters. In some applications, particularly space missions, electronics are often exposed to extreme temperature conditions. Therefore, it is required that circuits designed for such applications incorporate electronic parts and devices that can tolerate and operate efficiently in harsh temperature environments. While present electronic circuits employ COTS (commercial-off- the-shelf) parts that necessitate and are supported with some form of thermal control systems to maintain adequate temperature for proper operation, it is highly desirable and beneficial if the thermal conditioning elements are eliminated. Amongst these benefits are: simpler system design, reduced weight and size, improved reliability, simpler maintenance, and reduced cost. Devices based on silicon-on-insulator (SOI) technology, which utilizes the addition of an insulation layer in the device structure to reduce leakage currents and to minimize parasitic junctions, are well suited for high temperatures due to reduced internal heating as compared to the conventional silicon devices, and less power consumption. In addition, SOI electronic integrated circuits display good tolerance to radiation by virtue of introducing barriers or lengthening the path for penetrating particles and/or providing a region for trapping incident ionization. The benefits of these parts make them suitable for use in deep space and planetary exploration missions where extreme temperatures and radiation are encountered. Although designed for high temperatures, very little data exist on the operation of SOI devices and circuits at cryogenic temperatures. In this work, the performance of a divide-by-two frequency divider circuit built using COTS SOI logic gates was evaluated over a wide temperature range and thermal cycling to determine suitability for use in space exploration missions and terrestrial fields under extreme temperature conditions.

Patterson, Richard L.↗