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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 1,027 records · Page 57
All sourcesNASA NTRSDOE OSTI
NASA NTRS1969

Silicon carbide diode for increased light output

Transition metals improve the overall light output and the output in particular regions of the electroluminescent of a silicon carbide semiconductor device. These metals /impurities/ introduce levels that can be pumped electrically and affect the efficiency of the recombination process involved in emission of radiation.

Griffiths, L. B.↗
NASA NTRS1970

P-I-N diode switch

Solid state switches use the same voltage and power supply as the RF amplifier. This simplifies circuit design and reduces input power requirements.

Vanek, C. S.↗
NASA NTRS1970

Visible light electroluminescent diodes of indium-gallium phosphide

Vapor deposition and acceptor impurity diffusion techniques are used to prepare indium-gallium phosphide junctions. Certain problems in preparation are overcome by altering gas flow conditions and by increasing the concentration of phosphine in the gas. A general formula is given for the alloy's composition.

Clough, R.↗
NASA NTRS1972

Emitter surface temperature distribution for a miniature thermionic diode

Brightness temperatures have been observed from five hohlraums equally spaced on a diameter of a 0.635 cm thermionic emitter surface. The hohlraums are 0.0381 cm in diameter and are 0.114 cm deep. The surface was mounted in a simulated diminiode geometry and was heated from the backside, according to the design, by electron bombardment. Several temperature observations were made at each hohlraum at four different levels of input power. Within experimental error no measurable temperature gradients across the emitter surface were observed at any input power level.

Lancashire, R. B.↗
NASA NTRS1973

Study of the collector/heat pipe cooled externally configured thermionic diode

A description is given of the design approach followed and the results of the analysis leading up to the reference thermionic module designs, both initial and revised. Engineering layout drawing for components of both modules are given. Various steps taken in the component fabrication and the module assembly are detailed.

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