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Permanent and transient effects are discussed that are induced in linear integrated circuits by space radiation. Recent developments include enhanced damage at low dose rate, increased damage from protons due to displacement effects, and transients in digital comparators that can cause circuit malfunctions.
Rectangular waveguides are commonly used as circuit elements in remote-sensing heterodyne receivers at millimeter wavelengths. The advantages of waveguides are low loss and mechanical tunability. However, conventional machining techniques for waveguide components operating above a few hundred GHz are complicated and costly. Waveguides micromachined from silicon however would have several important advantages including low-cost; small size for very high frequency (submillimeter wave) operation; high dimensional accuracy (important for high-Q circuits); atomically smooth walls, thereby reducing rf losses; and the ability to integrate active and passive devices directly in the waveguide on thin membranes, thereby solving the traditional problem of mounting thin substrates.
This paper describes scalability issues of evolutionary-driven automatic synthesis of electronic circuits. The article begins by reviewing the concepts of circuit evolution and discussing the limitations of this technique when trying to achieve more complex systems.
A three-dimensional electromagnetic field simulation software package was used to compute the cold-test parameters, phase velocity, on-axis interaction impedance, and attenuation, for several high-frequency traveling-wave tube slow-wave circuit geometries. This research effort determined the effects of variations in circuit dimensions on cold-test performance. The parameter variations were based on the tolerances of conventional micromachining techniques.
An electronics chassis box includes a pair of opposing sidewalls, a pair of opposing end walls, a bottom surface, a top cover, and ring connectors assemblies mounted in selective ones of the walls of the electronic box. Boss members extend from the bottom surface at different heights upon which circuit cards are mounted in spatial relationship to each other. A flex interconnect substantially reduces and generally eliminates the need of a motherboard by interconnecting the circuit cards to one another and to external connectors mounted within the ring connector assemblies.
An actively pumped alkali metal flow circuit, designed and fabricated at the NASA Marshall Space Flight Center, underwent a range of tests at MSFC in early 2007. During this period, system transient responses and the performance of the liquid metal pump were evaluated. In May of 2007, the circuit was drained and cleaned to prepare for multiple modifications: the addition of larger upper and lower reservoirs, the installation of an annular linear induction pump (ALIP), and the inclusion of a closeable orifice in the test section. Modifications are now complete and testing has resumed. Performance of the ALIP, provided by Idaho National Laboratory (1NL), is the subject of the first round of experimentation. This presentation details the physical changes made to the FSP-PTC and the current test program.
An actively pumped alkali metal flow circuit, designed and fabricated at the NASA Marshall Space Flight Center, underwent a range of tests at MSFC in early 2007. During this period, system transient responses and the performance of the liquid metal pump were evaluated. In May of 2007, the circuit was drained and cleaned to prepare for multiple modifications: the addition of larger upper and lower reservoirs, the installation of an annular linear induction pump (ALIP), and the inclusion of the Single Flow Cell Test Apparatus (SFCTA) in the test section. Performance of the ALIP, provided by Idaho National Laboratory (INL), will be evaluated when testing resumes. The SFCTA, which will be tested simultaneously, will provide data on alkali metal flow behavior through the simulated core channels and assist in the development of a second generation thermal simulator. Additionally, data from the first round of testing has been used to refine the working system model, developed using the Generalized Fluid System Simulation Program (GFSSP). This paper covers the modifications of the FSP-PTC and the updated GFSSP system model.
An actively pumped alkali metal flow circuit, designed and fabricated at the NASA Marshall Space Flight Center, underwent a range of tests at MSFC in early 2007. During this period, system transient responses and the performance of the liquid metal pump were evaluated. In May of2007, the circuit was drained and cleaned to prepare for multiple modifications: the addition of larger upper and lower reservoirs, the installation of an annular linear induction pump (ALIP), and the inclusion of a closeable orifice in the test section. Performance of the ALIP, provided by Idaho National Laboratory (INL), will be evaluated when testing resumes. Data from the first round of testing has been used to refine the working system model, developed using the Generalized Fluid System Simulation Program (GFSSP). This paper covers the modifications of the FSP-PTC and the updated GFSSP system model.
A quantum circuit performing quantum computation in a quantum computer. A chosen transformation of an initial n-qubit state is probabilistically obtained. The circuit comprises a unitary quantum operator obtained from a non-unitary quantum operator, operating on an n-qubit state and an ancilla state. When operation on the ancilla state provides a success condition, computation is stopped. When operation on the ancilla state provides a failure condition, computation is performed again on the ancilla state and the n-qubit state obtained in the previous computation, until a success condition is obtained.
A circuit and method for transmitting and receiving on-off-keyed (OOK) signals with fractional signal-to-noise ratios uses available high-temperature silicon- on-insulator (SOI) components to move computational, sensing, and actuation abilities closer to high-temperature or high-ionizing radiation environments such as vehicle engine compartments, deep-hole drilling environments, industrial control and monitoring of processes like smelting, and operations near nuclear reactors and in space. This device allows for the networking of multiple, like nodes to each other and to a central processor. It can do this with nothing more than the already in-situ power wiring of the system. The device s microprocessor allows it to make intelligent decisions within the vehicle operational loop and to effect control outputs to its associated actuators. The figure illustrates how each node converts digital serial data to OOK 18-kHz in transmit mode and vice-versa in receive mode; though operations at lower frequencies or up to a megahertz are within reason using this method and these parts. This innovation s technique modulates a DC power bus with millivolt-level signals through a MOSFET (metal oxide semiconductor field effect transistor) and resistor by OOK. It receives and demodulates this signal from the DC power bus through capacitive coupling at high temperature and in high ionizing radiation environments. The demodulation of the OOK signal is accomplished by using an asynchronous quadrature detection technique realized by a quasi-discrete Fourier transform through use of the quadrature components (0 and 90 phases) of the carrier frequency as generated by the microcontroller and as a function of the selected crystal frequency driving its oscillator. The detected signal is rectified using an absolute-value circuit containing no diodes (diodes being non-operational at high temperatures), and only operational amplifiers. The absolute values of the two phases of the received signal are then summed and hard limited (digitized) by comparing them to a reference level and are then input into a microprocessor as a serial bit stream. The quasi-discrete Fourier transform is performed in high-temperature components (operational amplifiers, analog switches, resistors, and capacitors). The demodulated signal is a serial data stream that is input to the UART (universal asynchronous receiver transmitter) receiver pin of the microprocessor. The OOK of the carrier frequency uses the output of the UART pin as an enabling signal that drives the gate of the MOSFET. Logic low bits enable the carrier frequency (realized by using the 0 phase signal from the microcontroller, though either phase may be used) to be DC-coupled to the power supply bus through a current-limiting resistor mounted between the MOSFET drain and the supply rail. The presence of logic lows on the power supply rail is realized by carrier bursts while logic highs are realized by the absence of bursts.
A remote alarm circuit provides visible and audible signals to indicate that there is little unused space left on magnetic and optical tracks on disks used to record voice signals in a group of three multichannel voice recorders. In the particular application for which the remote alarm circuit was built, the voice recorders are required to operate without interruption, but the technicians responsible for the continuous operation of the voice recorders perform most of their duties on a different floor of the building in which the voice recorders are located.
Existing risk simulations make the assumption that when a free tin whisker has bridged two adjacent exposed electrical conductors, the result is an electrical short circuit. This conservative assumption is made because shorting is a random event that has a currently unknown probability associated with it. Due to contact resistance electrical shorts may not occur at lower voltage levels. In this experiment, we study the effect of varying voltage on the breakdown of the contact resistance which leads to a short circuit. From this data we can estimate the probability of an electrical short, as a function of voltage, given that a free tin whisker has bridged two adjacent exposed electrical conductors. Also, three tin whiskers grown from the same Space Shuttle Orbiter card guide used in the aforementioned experiment were cross-sectioned and studied using a focused ion beam (FIB). The rare polycrystalline structure seen in the FIB cross section was confirmed using transmission electron microscopy (TEM). The FIB was also used to cross section two card guides to facilitate the measurement of the grain size to determine that the tin plating on the card guides had a bright finish.
A continuing program addresses the development of flexible multilayer electronic circuits and associated flexible cables. This development is undertaken to help satisfy aerospace-system-engineering requirements for efficient, lightweight electrical and electronic subsystems that can fit within confined spaces, adhere to complexly shaped surfaces, and can be embedded within composite materials. Heretofore, substrate layers for commercial flexible circuitry have been made from sheets of Kapton (or equivalent) polyimide and have been bonded to copper conductors and to other substrate layers by means of adhesives. The substrates for the present developmental flexible circuitry are made from thin films of a polyimide known as LaRC(TM)-SI. This polyimide is thermoplastic and, therefore, offers the potential to eliminate delamination and the need for adhesives. The development work undertaken thus far includes experiments in the use of several techniques of design and fabrication (including computer-aided design and fabrication) of representative flexible circuits. Anticipated future efforts would focus on multilayer bonding, fabrication of prototypes, and overcoming limitations.
A finned-ladder structure has been invented in an effort to improve the design of the slow-wave circuit of a traveling-wave tube (TWT). The point of departure for the design effort was a prototype TWT that contains a ring-plane slow-wave circuit (see Figure 1). The design effort was a response to the observation that despite the high-power capabilities of the ringplane TWT, its requirement for a high supply voltage and its low bandwidth have made it unacceptable for use outside a laboratory setting.
Two documents present wide-ranging discussions of some issues in the design and operation of signal-conditioning circuits. The first document focuses on active low-pass filter circuits that contain resistors, capacitors, and operational amplifiers. It describes design and operational problems encountered previously, deficiencies of prior designs, and four design improvements to overcome the deficiencies. These improvements are as follows: 1. An offset-calibration feature in which an electronic switch isolates a filter capacitor in order to preserve its voltage during a calibration performed to measure the offset voltage of the operational amplifier; 2. Configuring a pair of complementary operational amplifiers to prevent latchup and decrease the degree of nonlinearity in overall response; 3. Minimizing distortion by taking the filter output from the operational-amplifier output nodes instead of from one of the other nodes as in prior designs; and 4. Providing for switching different feedback resistors to change filter break frequencies. The second document addresses topics in the architecture of signal-conditioning and multiplexing circuitry. Improvements are described as being made with respect to greater compactness, increased flexibility in accommodating a variety of inputs, improvements in filter performance, simplification of wiring, and reconfigurability of designs.
The mini bus interface card (miniBIC) is the first four-channel electronic circuit board that conforms to MIL-STD-1553 and to the electrical-footprint portion of PC/104. [MIL-STD-1553 is a military standard that encompasses a method of communication and electrical- interface requirements for digital electronic subsystems connected to a data bus. PC/104 is an industry standard for compact, stackable modules that are fully compatible (in architecture, hardware, and software) with personal-computer data- and power-bus circuitry.] Prior to the development of the miniBIC, only one- and two-channel PC/104 MIL-STD-1553 boards were available. To obtain four channels, it was necessary to include at least two boards in a PC/104 stack. In comparison with such a two-board stack, the miniBIC takes up less space, consumes less power, and is more reliable. In addition, the miniBIC includes 32 digital input/output channels. The miniBIC (see figure) contains four MIL-STD-1553B hybrid integrated circuits (ICs), four transformers, a field-programmable gate array (FPGA), and an Industry Standard Architecture (ISA) interface. Each hybrid IC includes a MILSTD-1553 dual transceiver, memory-management circuitry, processor interface logic circuitry, and 64Kx16 bits of shared static random access memory. The memory is used to configure message and data blocks. In addition, 23 16-bit registers are available for (1) configuring the hybrid IC for, and starting it in, various modes of operation; (2) reading the status of the functionality of the hybrid IC; and (3) resetting the hybrid IC to a known state. The miniBIC can operate as a remote terminal, bus controller, or bus monitor. The FPGA provides the chip-select and data-strobe signals needed for operation of the hybrid ICs. The FPGA also receives interruption signals and forwards them to the ISA bus. The ISA interface connects the address, data, and control interfaces of the hybrid ICs to the ISA backplane. Each channel is, in effect, a MIL-STD-1553 interface that can operate either independently of the others or else as a redundant version of one of the others. The transformer in each channel provides electrical isolation between the rest of the miniBIC circuitry and the bus to which that channel is connected.
The EMU incorporates two separate water circuits for the rejection of metabolic heat from the astronaut and the cooling of electrical components. The first (the Transport Water Loop) circulates in a semi-closed-loop manner and absorbs heat into a Liquid Coolant and Ventilation Garment (LCVG) warn by the astronaut. The second (the Feed Water Loop) provides water to a cooling device (Sublimator) with a porous plate, and that water subsequently sublimates to space vacuum. The cooling effect from the sublimation of this water translates to a cooling of the LCVG water that circulates through the Sublimator. Efforts are underway to streamline the use of a water processing kit (ALCLR) that is being used to periodically clean and disinfect the Transport Loop Water. Those efforts include a fine tuning of the duty cycle based on a review of prior performance data as well as an assessment of a fixed installation of this kit into the EMU backpack or within on-orbit EMU interface hardware. Furthermore, testing is being conducted to ensure compatibility between the International Space Station (ISS) Water Processor Assembly (WPA) effluent and the EMU Sublimator as a prelude to using the WPA effluent as influent to the EMU Feed Water loop. This work is undertaken to reduce the crew-time and logistics burdens for the EMU, while ensuring the long-term health of the EMU water circuits for a post-Shuttle 6-year service life.
The design and analysis of a cold trap proposed for use in the purification of circulated eutectic sodium potassium (NaK-78) loops is presented. The cold trap is designed to be incorporated into the Fission Surface Power-Primary Test Circuit (FSP-PTC), which incorporates a pumped NaK loop to simulate in-space nuclear reactor-based technology using non-nuclear test methodology as developed by the Early Flight Fission-Test Facility. The FSP-PTC provides a test circuit for the development of fission surface power technology. This system operates at temperatures that would be similar to those found in a reactor (500-800 K). By dropping the operating temperature of a specified percentage of NaK flow through a bypass containing a forced circulation cold trap, the NaK purity level can be increased by precipitating oxides from the NaK and capturing them within the cold trap. This would prevent recirculation of these oxides back through the system, which may help prevent corrosion.