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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 1,009 records · Page 56

NASA Galactic Cosmic Radiation Environment Model: Badhwar - O'Neill (2014)

The Badhwar-O'Neill (BON) Galactic Cosmic Ray (GCR) flux model has been used by NASA to certify microelectronic systems and in the analysis of radiation health risks for human space flight missions. Of special interest to NASA is the kinetic energy region below 4.0 GeV/n due to the fact that exposure from GCR behind shielding (e.g., inside a space vehicle) is heavily influenced by the GCR particles from this energy domain. The BON model numerically solves the Fokker-Planck differential equation to account for particle transport in the heliosphere due to diffusion, convection, and adiabatic deceleration under the assumption of a spherically symmetric heliosphere. The model utilizes a comprehensive database of GCR measurements from various particle detectors to determine boundary conditions. By using an updated GCR database and improved model fit parameters, the new BON model (BON14) is significantly improved over the previous BON models for describing the GCR radiation environment of interest to human space flight.

Golge, S.↗

Initial Results from the Radiation Dosimetry Experiment (RaD-X) Balloon Flight Mission

The NASA Radiation Dosimetry Experiment (RaD-X) high-altitude balloon mission was successfully launched from Fort Sumner, New Mexico USA on 25 September, 2015. Over 15 hours of science data were obtained from four dosimeters at altitudes above about 25 km. The four dosimeters flown on the RaD-X science payload are a Hawk version 3.0 Tissue Equivalent Proportional Counter (TEPC) manufactured by Far West Technologies, a Liulin dosimeter-spectrometer produced by the Solar Research and Technology Institute, Bulgarian Academy of Sciences, a total ionizing dose detector manufactured by Teledyne Microelectronic Technologies, and the RaySure detector provided by the University of Surrey.

Mertens, Christopher J.↗

Source Data Impacts on Epistemic Uncertainty for Launch Vehicle Fault Tree Models

Launch vehicle systems are designed and developed using both heritage and new hardware. Design modifications to the heritage hardware to fit new functional system requirements can impact the applicability of heritage reliability data. Risk estimates for newly designed systems must be developed from generic data sources such as commercially available reliability databases using reliability prediction methodologies, such as those addressed in MIL-HDBK-217F. Failure estimates must be converted from the generic environment to the specific operating environment of the system in which it is used. In addition, some qualification of applicability for the data source to the current system should be made. Characterizing data applicability under these circumstances is crucial to developing model estimations that support confident decisions on design changes and trade studies. This paper will demonstrate a data-source applicability classification method for suggesting epistemic component uncertainty to a target vehicle based on the source and operating environment of the originating data. The source applicability is determined using heuristic guidelines while translation of operating environments is accomplished by applying statistical methods to MIL-HDK-217F tables. The paper will provide one example for assigning environmental factors uncertainty when translating between operating environments for the microelectronic part-type components. The heuristic guidelines will be followed by uncertainty-importance routines to assess the need for more applicable data to reduce model uncertainty.

Al Hassan, Mohammad↗

Experimentally Observed Electrical Durability of 4H-SiC JFET ICs Operating from 500 C to 700 C

Prolonged 500 degrees Celsius to 700 degrees Celsius electrical testing data from 4H-SiC junction field effect transistor (JFET) integrated circuits (ICs) are combined with post-testing microscopic studies in order to gain more comprehensive understanding of the durability limits of the present version of NASA Glenn's extreme temperature microelectronics technology. The results of this study support the hypothesis that T ≥ 500 degrees Celsius durability-limiting IC failure initiates with thermal-stress-related crack formation where dielectric passivation layers overcoat micron-scale vertical features including patterned metal traces.

high temperature↗

Radiation Effects: Overview for Space Environment Specialists

Radiation Hardness Assurance (RHA) methodologies need to evolve to capitalize on the increased flexibility introduced by new models of space radiation environments. This presentation examines the characteristics of various radiation threats, the sources of error that RHA methodologies seek to control and the contributions of environment models to those errors. The influence of trends in microelectronic device technology is also considered.

Galactic Cosmic Ray (GCR)↗

Impact of Spacecraft Shielding on Direct Ionization Soft Error Rates for Sub-130 nm Technologies

We use ray tracing software to model various levels of spacecraft shielding complexity and energy deposition pulse height analysis to study how it affects the direct ionization soft error rate of microelectronic components in space. The analysis incorporates the galactic cosmic ray background, trapped proton, and solar heavy ion environments as well as the October 1989 and July 2000 solar particle events.

Pellish, Jonathan A.↗

Heavy Ion Testing at the Galactic Cosmic Ray Energy Peak

A 1 GeV/u Fe-56 Ion beam allows for true 90 deg. tilt irradiations of various microelectronic components and reveals relevant upset trends for an abundant element at the galactic cosmic ray (GCR) flux-energy peak.

Pellish, Jonathan A.↗

Heavy Ion Testing at the Galactic Cosmic Ray Energy Peak

A 1 GeV/u 5 6Fe ion beam allows for true 90deg tilt irradiations of various microelectronic c-0mponents and reveals relevant upset trends at the GCR Hux energy peak. Three SRAMs and an SRAM-based FPGA evaluated at the NASA Space Radiation Effects Laboratory demonstrate that a 90deg tilt irradiation yields a unique device response. These tilt angle effects need t-0 be screened for, and if found, pursued with radiation transport simulations to quantify their impact on event rate calculations.

Pellish, Jonathan A.↗

A Comparison of High-Energy Electron and Cobalt-60 Gamma-Ray Radiation Testing

In this paper, a comparison between the effects of irradiating microelectronics with high energy electrons and Cobalt-60 gamma-rays is examined. Additionally, the effect of electron energy is also discussed. A variety of part types are investigated, including discrete bipolar transistors, hybrids, and junction field effect transistors

Boutte, Alvin J.↗

ASIC/FPGA Trust Assessment Framework

NASA Electronic Parts and Packaging (NEPP) is developing a process to be employed in critical applications. The framework assesses levels of Trust and assurance in microelectronic systems. The process is being created with participation from a variety of organizations. We present a synopsis of the framework that includes contributions from The Aerospace Corporation.

Application specific integrated circuit (ASIC)↗

Challenges and Opportunities in Gen3 Embedded Cooling with High-Quality Microgap Flow

Gen3, Embedded Cooling, promises to revolutionize thermal management of advanced microelectronic systems by eliminating the sequential conductive and interfacial thermal resistances which dominate the present 'remote cooling' paradigm. Single-phase interchip microfluidic flow with high thermal conductivity chips and substrates has been used successfully to cool single transistors dissipating more than 40kW/sq cm, but efficient heat removal from transistor arrays, larger chips, and chip stacks operating at these prodigious heat fluxes would require the use of high vapor fraction (quality), two-phase cooling in intra- and inter-chip microgap channels. The motivation, as well as the challenges and opportunities associated with evaporative embedded cooling in realistic form factors, is the focus of this paper. The paper will begin with a brief review of the history of thermal packaging, reflecting the 70-year 'inward migration' of cooling technology from the computer-room, to the rack, and then to the single chip and multichip module with 'remote' or attached air- and liquid-cooled coldplates. Discussion of the limitations of this approach and recent results from single-phase embedded cooling will follow. This will set the stage for discussion of the development challenges associated with application of this Gen3 thermal management paradigm to commercial semiconductor hardware, including dealing with the effects of channel length, orientation, and manifold-driven centrifugal acceleration on the governing behavior.

microchannel↗

Single-Event Latchup Measurements on COTS Electronic Devices for Use in ISS Payloads

This paper reports recent single-event latchup results for a variety of microelectronic devices that include an ADC, OpAmp, EEPROM, CPLD, PWM, transceiver, voltage regulator, digital signal processor, step-down converter, buck controller and supervisory circuits. The data were collected to evaluate these devices for possible use in NASA ISS payloads.

Irom, Farokh↗

NASA 2009 Body of Knowledge (BoK) carbon nanotube technology

The nature of the bonding of a nanotube is described by applied quantum chemistry, specifically, orbital hybridization. The chemical bonding of nanotubes is composed entirely of sp2 bonds, similar to those of graphite. This bonding structure, which is stronger than the sp3 bonds found in diamonds, provides the molecules with their unique strength. Nanotubes naturally align themselves into "ropes" held together by Van der Waals forces. Under high pressure, nanotubes can merge together, trading some sp² bonds for sp³ bonds, giving the possibility of producing strong, unlimited-length wires through high-pressure nanotube linking. This document looks at the topic of carbon nanotubes as it applies to microelectronics packaging and assembly.

Gerke, David↗

Recent photonics activites under the NASA electronic parts and packaging (NEPP) program

With the rapidly increasing insertion of photonic devices, circuits and subsystems into NASA spacecraft, a variety of issues associated with reliability and radiation tolerance have arisen. In this paper, we discuss these issues from the perspective of the work currently ongoing in the NASA Electronic Parts and Packaging (NEPP) Program. This Program is focused on evaluating the reliability and radiation response of advanced and emerging microelectronics and photonics technologies of interest to NASA spacecraft system designers.

NEEP↗

TERA-OPS Processing for ATR

A three-dimensional microelectronic device (3DANN-R) capable of performing general image convolution at the speed of 10***sup12*** operations/second (ops) in a volume of less than 1.5 cubic centimeter has been successfully built under the BMDO/JPL VIGILANTE program.

Automatic↗

NASA'S 3D FLIGHT COMPUTER FOR SPACE APPLICATIONS

The New Millennium Program (NMP) Integrated Product Development Team (IPDT) for Microelectronics Systems was planning to validate a newly developed 3D Flight Computer system on its first deep-space flight, DS1, launched in October 1998.

New↗

A History of GPS Sounding

The roots of GPS sounding go back to the first days of interplanetary flight. Today we have the almost concurrent emergence of the very element vital to a new global enterprise in GPS sounding: copious high beacons at ideal frequencies bathing the globe; a profusion of low obiters carrying GPS receivers and designed for real-time global data transfer; low-cost microelectronics of unprecedented power; and the occultation techniques itself the most precise and arguably the simplest atmospheric probe yet devised.

occultation↗