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At least 991 records · Page 55

Thermopile Energy Harvesting for Subsurface Wellbore Sensors (Final Report)

Robust in situ power harvesting underlies all efforts to enable downhole autonomous sensors for real-time and long-term monitoring of CO 2 plume movement and permeance, wellbore health, and induced seismicity. This project evaluated the potential use of downhole thermopile arrays, known as thermoelectric generators (TEGs), as power sources to charge sensors for in situ real-time, long-term data capture and transmission. Real-time downhole monitoring will enable “Big Data” techniques and machine learning, using massive amounts of continuous data from embedded sensors, to quantify short- and long-term stability and safety of enhanced oil recovery and/or commercial-scale geologic CO 2 storage. This project evaluated possible placement of the TEGs at two different wellbore locations: on the outside of the casing; or on the production tubing. TEGs convert heat flux to electrical power, and in the borehole environment, would convert heat flux into or out of the borehole into power for downhole sensors. Such heat flux would be driven by pumping of cold or hot fluids into the borehole—for instance, injecting supercritical CO 2 —creating a thermal pulse that could power the downhole sensors. Hence, wireless power generation could be accomplished with in situ TEG energy harvesting. This final report summarizes the project’s efforts that accomplished the creation of a fully operational thermopile field unit, including selection of materials, laboratory benchtop experiments and thermal-hydrologic modeling for design and optimization of the field-scale power generation test unit. Finally, the report describes the field unit that has been built and presents results of performance and survivability testing. The performance and survivability testing evaluated the following: 1) downhole power generation in response to a thermal gradient produced by pumping a heated fluid down a borehole and through the field unit; and 2) component survivability and operation at elevated temperature and pressure conditions representative of field conditions. The performance and survivability testing show that TEG arrays are viable for generating ample energy to power downhole sensors, although it is important to note that developing or connecting to sensors was beyond the scope of this project. This project’s accomplishments thus traversed from a low Technical Readiness Level (TRL) on fundamental concepts of the application and modeling to TRL-5 via testing of the fully integrated field unit for power generation in relevant environments. A fully issued United States Patent covers the wellbore power harvesting technology and applications developed by this project.

47 OTHER INSTRUMENTATION↗

The Design of Optical Sensor for the Pinhole/Occulter Facility

Three optical sight sensor systems were designed, built and tested. Two optical lines of sight sensor system are capable of measuring the absolute pointing angle to the sun. The system is for use with the Pinhole/Occulter Facility (P/OF), a solar hard x ray experiment to be flown from Space Shuttle or Space Station. The sensor consists of a pinhole camera with two pairs of perpendicularly mounted linear photodiode arrays to detect the intensity distribution of the solar image produced by the pinhole, track and hold circuitry for data reduction, an analog to digital converter, and a microcomputer. The deflection of the image center is calculated from these data using an approximation for the solar image. A second system consists of a pinhole camera with a pair of perpendicularly mounted linear photodiode arrays, amplification circuitry, threshold detection circuitry, and a microcomputer board. The deflection of the image is calculated by knowing the position of each pixel of the photodiode array and merely counting the pixel numbers until threshold is surpassed. A third optical sensor system is capable of measuring the internal vibration of the P/OF between the mask and base. The system consists of a white light source, a mirror and a pair of perpendicularly mounted linear photodiode arrays to detect the intensity distribution of the solar image produced by the mirror, amplification circuitry, threshold detection circuitry, and a microcomputer board. The deflection of the image and hence the vibration of the structure is calculated by knowing the position of each pixel of the photodiode array and merely counting the pixel numbers until threshold is surpassed.

Greene, Michael E.↗

Electrochemical detection of gas phase chemicals

We provide an electrochemical sensor in which working microelectrodes are arranged in an array and interconnected in parallel. The working electrodes are arranged so that in use, they are electrochemically coupled to a counter electrode structure through an electrolyte. The sensor also includes a microporous body arranged so that in use, it is situated at a boundary between a gaseous environment and the electrolyte. In another aspect, we provide a method of sensing in which a sample of gas is admitted to a liquid electrolyte maintained by pores of a porous substrate. A voltage is applied to the liquid electrolyte, and an electrical response to the applied voltage is observed, thereby to detect electrochemical evidence of an analyte within the liquid electrolyte.

Klavetter, Kyle C.↗

Multiplexable intrinsic Fabry–Perot interferometric fiber sensors for multipoint hydrogen gas monitoring

This Letter presents an approach to produce multiplexable optical fiber chemical sensor using an intrinsic Fabry–Perot interferometer (IFPI) array via the femtosecond laser direct writing technique. Using the hydrogen-sensitive palladium (Pd) alloy as a functional sensory material, Pd alloy coated IFPI devices can reproducibly and reversibly measure hydrogen concentrations with a detection limit of 0.25% at room temperature. Seven IFPI sensors were fabricated in one fiber and performed simultaneous temperature and hydrogen measurements at seven different locations. This Letter demonstrates a simple yet effective approach to fabricate multiplexable fiber optical chemical sensors for use in harsh environments.

Cao, Rongtao↗

Friction Stir Weld Inspection Through Conductivity Imaging Using Shaped Field MWM(TM)-Arrays

Friction Stir Welds (FSW) of A1 2195-T8 and A1 2219-T8, provided by Lockheed Martin Michoud Operations, were inspected for lack-of-penetration (LOP) defects using a custom designed MWM-Array, a multi-element eddy-current sensor. MWM electrical conductivity mapping demonstrated high sensitivity to LOP as small as 0.75 mm (0.03 in.), as confirmed by metallographic data that characterized the extent of LOP defects. High sensitivity and high spatial resolution was achieved via a 37-element custom designed MWM-Array allowing LOP detection using the normalized longitudinal component of the MWM measured conductivity. This permitted both LOP detection and correlation of MWM conductivity features with the LOP defect size, as changes in conductivity were apparently associated with metallurgical features within the near-surface layer of the LOP defect zone. MWM conductivity mapping reveals information similar to macroetching as the MWM-Array is sensitive to small changes in conductivity due to changes in microstructure associated with material thermal processing, in this case welding. The electrical conductivity measured on the root side of FSWs varies across the weld due to microstructural differences introduced by the FSW process, as well as those caused by planar flaws. Weld metal, i.e., dynamically recrystallized zone (DXZ), thermomechanically affected zone (TMZ), heat-affected zone (HAZ), and parent metal (PM) are all evident in the conductivity maps. While prior efforts had met with limited success for NDE of dissimilar alloy, A12219 to A12195 FSW, the new custom designed multi-element MWM-Array achieved detection of all LOP defects even in dissimilar metal welds.

Goldfine, Neil↗

The NASA MLA program

The NASA Multispectral Linear Array (MLA) program is structured to provide for the evolutionary development of advanced sensor concepts, technologies, and scientific basis for future remote sensing missions. Program elements include the development of multispectral visible and shortwave infrared (SWIR) detector arrays, optics and on-board signal processing technologies, sensor design studies, and supporting research. The research consists of advanced airborne sensor development with data acquisitions, field measurements, and supporting science studies. At the present time, two instrument concepts, including an imaging spectrometer, are in development as payloads for a series of Shuttle remote sensing research flights beginning as early as 1987. Progressively more advanced capability instruments suitable for extended duration Shuttle, free flyer, and space platform missions in the 1990's are also being studied.

Ando, K. J.↗

Friction Stir Weld Inspection Through Conductivity Imaging Using Shaped Field MWM(Registered Trademark) - Arrays

Friction Stir Welds (FSW) of Al 2195-T8 and Al 2219-T8, provided by Lockheed Martin Michoud Operations, were inspected for lack-of-penetration (LOP) defects using a custom designed MWM-Array, a multi-element eddy-current sensor. MWM (registered trademark) electrical conductivity mapping demonstrated high sensitivity to LOP as small as 0.75 mm (0.03 in.), as confirmed by metallographic data that characterized the extent of LOP defects. High sensitivity and high spatial resolution was achieved via a 37-element custom designed MWM-Array allowing LOP detection using the normalized longitudinal component of the MWM measured conductivity. This permitted both LOP detection and correlation of MWM conductivity features with the LOP defect size, as changes in conductivity were apparently associated with metallurgical features within the near-surface layer of the LOP defect zone. MWM conductivity mapping reveals information similar to macro-etching as the MWM-Array is sensitive to small changes in conductivity due to changes in microstructure associated with material thermal processing, in this case welding. The electrical conductivity measured on the root side of FSWs varies across the weld due to microstructural differences introduced by the FSW process, as well as those caused by planar flaws. Weld metal, i.e., dynamically recrystallized zone (DXZ), thermomechanically affected zone (TMZ), heat-affected zone (HAZ), and parent metal (PM) are all evident in the conductivity maps. While prior efforts had met with limited success for NDE (Nondestructive Evaluation) of dissimilar alloy, Al2219 to Al2195 FSW, the new custom designed multi-element MWM-Array achieved detection of all LOP defects even in dissimilar metal welds.

Goldfine, Neil↗

Nanoscale Surface Plasmonics Sensor With Nanofluidic Control

Conventional quantitative protein assays of bodily fluids typically involve multiple steps to obtain desired measurements. Such methods are not well suited for fast and accurate assay measurements in austere environments such as spaceflight and in the aftermath of disasters. Consequently, there is a need for a protein assay technology capable of routinely monitoring proteins in austere environments. For example, there is an immediate need for a urine protein assay to assess astronaut renal health during spaceflight. The disclosed nanoscale surface plasmonics sensor provides a core detection method that can be integrated to a lab-on-chip device that satisfies the unmet need for such a protein assay technology. Assays based upon combinations of nanoholes, nanorings, and nanoslits with transmission surface plasmon resonance (SPR) are used for assays requiring extreme sensitivity, and are capable of detecting specific analytes at concentrations as low as picomole to femtomole level in well-controlled environments. The device operates in a transmission mode configuration in which light is directed at one planar surface of the array, which functions as an optical aperture. The incident light induces surface plasmon light transmission from the opposite surface of the array. The presence of a target analyte is detected by changes in the spectrum of light transmitted by the array when a target analyte induces a change in the refractive index of the fluid within the nanochannels. This occurs, for example, when a target analyte binds to a receptor fixed to the walls of the nanochannels in the array. Independent fluid handling capability for individual nanoarrays on a nanofluidic chip containing a plurality of nanochannel arrays allows each array to be used to sense a different target analyte and/or for paired arrays to analyze control and test samples simultaneously in parallel. The present invention incorporates transmission mode nanoplasmonics and nanofluidics into a single, microfluidically controlled device. The device comprises one or more arrays of aligned nanochannels that are in fluid communication with inflowing and outflowing fluid handling manifolds that control the flow of fluid through the arrays. The array acts as an aperture in a plasmonic sensor. Fluid, in the form of a liquid or a gas and comprising a sample for analysis, is moved from an inlet manifold through the nanochannel array, and out through an exit manifold. The fluid may also contain a reagent used to modify the interior surfaces of the nanochannels, and/or a reagent required for the detection of an analyte.

Wei, Jianjun↗

Modeling Charge Collection in Detector Arrays

A detector array charge collection model has been developed for use as an engineering tool to aid in the design of optical sensor missions for operation in the space radiation environment. This model is an enhancement of the prototype array charge collection model that was developed for the Next Generation Space Telescope (NGST) program. The primary enhancements were accounting for drift-assisted diffusion by Monte Carlo modeling techniques and implementing the modeling approaches in a windows-based code. The modeling is concerned with integrated charge collection within discrete pixels in the focal plane array (FPA), with high fidelity spatial resolution. It is applicable to all detector geometries including monolithc charge coupled devices (CCDs), Active Pixel Sensors (APS) and hybrid FPA geometries based on a detector array bump-bonded to a readout integrated circuit (ROIC).

Hardage, Donna↗

Extended-Range Passive RFID and Sensor Tags

Extended-range passive radio-frequency identification (RFID) tags and related sensor tags are undergoing development. A tag of this type incorporates a retroreflective antenna array, so that it reflects significantly more signal power back toward an interrogating radio transceiver than does a comparable passive RFID tag of prior design, which does not incorporate a retroreflective antenna array. Therefore, for a given amount of power radiated by the transmitter in the interrogating transceiver, a tag of this type can be interrogated at a distance greater than that of the comparable passive RFID or sensor tag of prior design. The retroreflective antenna array is, more specifically, a Van Atta array, named after its inventor and first published in a patent issued in 1959. In its simplest form, a Van Atta array comprises two antenna elements connected by a transmission line so that the signal received by each antenna element is reradiated by the other antenna element (see Figure 1). The phase relationships among the received and reradiated signals are such as to produce constructive interference of the reradiated signals; that is, to concentrate the reradiated signal power in a direction back toward the source. Hence, an RFID tag equipped with a Van Atta antenna array automatically tracks the interrogating transceiver. The effective gain of a Van Atta array is the same as that of a traditional phased antenna array having the same number of antenna elements. Additional pairs of antenna elements connected by equal-length transmission lines can be incorporated into a Van Atta array to increase its directionality. Like some RFID tags here-to-fore commercially available, an RFID or sensor tag of the present developmental type includes one-port surface-acoustic-wave (SAW) devices. In simplified terms, the mode of operation of a basic one-port SAW device as used heretofore in an RFID device is the following: An interrogating radio signal is converted, at an input end, from an electrical signal to an acoustic wave that propagates along a surface and encounters multiple reflectors suitably positioned along the surface. Upon returning to the input end, the reflected acoustic wave is re-converted to an electrical signal, which, in turn, is reradiated from an antenna. The distances between the reflectors in the SAW device and the corresponding times between reflections encode the identifying or sensory information onto the reradiated signal. The fundamental problem in the present development is how to combine a Van Atta antenna array (which is inherently a multiple-port device) and one or more one-port SAW device(s) into a single, compact, passive unit that can function as a retroreflective RFID tag. The solution is to use one or more hybrid, half-power 90 couplers. A basic unit of this type, shown in Figure 2, includes a half-power 90 hybrid coupler; two identical SAW devices (SAW1 and SAW2) connected to ports 3 and 4 of the coupler, respectively; and antenna elements connected to ports 1 and 2 of the coupler. Necessarily omitting details for the sake of brevity, it must suffice to report that the phase relationships among the coupler inputs and outputs are such as to couple the incident signal from the antenna elements to the SAW devices and couple the reflected signals from the SAW devices back to the antenna elements in the phase relationships required for a Van Atta array. Hence, the reradiated signal is automatically directed back toward the interrogating transceiver and contains identifying and/or sensory information encoded in time intervals between reflections.

Fink, Patrick W.↗

Infrared-Bolometer Arrays with Reflective Backshorts

Integrated circuits that incorporate square arrays of superconducting-transition- edge bolometers with optically reflective backshorts are being developed for use in image sensors in the spectral range from far infrared to millimeter wavelengths. To maximize the optical efficiency (and, thus, sensitivity) of such a sensor at a specific wavelength, resonant optical structures are created by placing the backshorts at a quarter wavelength behind the bolometer plane. The bolometer and backshort arrays are fabricated separately, then integrated to form a single unit denoted a backshort-under-grid (BUG) bolometer array. In a subsequent fabrication step, the BUG bolometer array is connected, by use of single-sided indium bump bonding, to a readout device that comprises mostly a superconducting quantum interference device (SQUID) multiplexer circuit. The resulting sensor unit comprising the BUG bolometer array and the readout device is operated at a temperature below 1 K. The concept of increasing optical efficiency by use of backshorts at a quarter wavelength behind the bolometers is not new. Instead, the novelty of the present development lies mainly in several features of the design of the BUG bolometer array and the fabrication sequence used to implement the design. Prior to joining with the backshort array, the bolometer array comprises, more specifically, a square grid of free-standing molybdenum/gold superconducting-transition-edge bolometer elements on a 1.4- m-thick top layer of silicon that is part of a silicon support frame made from a silicon-on-insulator wafer. The backshort array is fabricated separately as a frame structure that includes support beams and contains a correspond - ing grid of optically reflective patches on a single-crystal silicon substrate. The process used to fabricate the bolometer array includes standard patterning and etching steps that result in the formation of deep notches in the silicon support frame. These notches are designed to interlock with the support beams on the backshort-array structure to provide structural support and precise relative positioning. The backshort-array structure is inserted in the silicon support frame behind the bolometer array, and the notches in the frame serve to receive the support beams of the backshort-array structure and thus determine the distance between the backshort and bolometer planes. The depth of the notches and, thus, the distance between the backshort and bolometer planes, can be tailored to a value between 25 to 300 m adjusting only a few process steps. The backshort array is designed so as not to interfere with the placement of indium bumps for subsequent indium bump-bonding to the multiplexing readout circuitry

Miller, Timothy M.↗

The Space Telescope alternate fine guidance sensor

A study was conducted to develop a preliminary design for an alternate fine guidance sensor system for retrofit on the NASA Space Telescope. An electrostatically focused quadrant array detector was proposed for this application. Configuration studies verified the feasibility of using this sensor in the existing fine guidance system and within the given limits on mass, power, volume, processor capability, and thermal dissipation. Space Telescope control system simulations showed the proposed system to meet the required performance specifications and to be substantially more resistant to external disturbances than the baseline system.

Griffin, M. D.↗

Internal structure of the San Jacinto fault zone at the Ramona Reservation, north of Anza, California, from dense array seismic data

SUMMARY We image the internal structure of the San Jacinto fault zone (SJFZ) near Anza, California, with seismic data recorded by two dense arrays (RA and RR) from ∼42 000 local and ∼180 teleseismic events occurring between 2012 and 2017. The RA linear array has short aperture (∼470 m long with 12 strong motion sensors) and recorded for the entire analysed time window, whereas the RR is a large three-component nodal array (97 geophones across a ∼2.4 km × 1.4 km area) that operated for about a month in September–October 2016. The SJFZ at the site contains three near-parallel surface traces F1, F2 and F3 from SW to NE that have accommodated several Mw > 6 earthquakes in the past 15 000 yr. Waveform changes in the fault normal direction indicate structural discontinuities that are consistent with the three fault surface traces. Relative slowness from local events and delay time analysis of teleseismic arrivals in the fault normal direction suggest a slower SW side than the NE with a core damage zone between F1 and F2. This core damage zone causes ∼0.05 s delay at stations RR26–31 in the teleseismic P arrivals compared with the SW-most station, and generates both P- and S-type fault zone trapped waves. Inversion of S trapped waves indicates the core damaged structure is ∼100 m wide, ∼4 km deep with a Q value of ∼20 and 40 per cent S-wave velocity reduction compared with bounding rocks. Fault zone head waves observed at stations SW of F3 indicate a local bimaterial interface that separates the locally faster NE block from the broad damage zone in the SW at shallow depth and merges with a deep interface that separates the regionally faster NE block from rocks to the SW with slower velocities at greater depth. The multiscale structural components observed at the site are related to the geological and earthquake rupture history at the site, and provide important information on the preferred NW propagation of earthquake ruptures on the San Jacinto fault.

Geochemistry & Geophysics↗

A 128 x 128 CMOS Active Pixel Image Sensor for Highly Integrated Imaging Systems

A new CMOS-based image sensor that is intrinsically compatible with on-chip CMOS circuitry is reported. The new CMOS active pixel image sensor achieves low noise, high sensitivity, X-Y addressability, and has simple timing requirements. The image sensor was fabricated using a 2 micrometer p-well CMOS process, and consists of a 128 x 128 array of 40 micrometer x 40 micrometer pixels. The CMOS image sensor technology enables highly integrated smart image sensors, and makes the design, incorporation and fabrication of such sensors widely accessible to the integrated circuit community.

Mendis, Sunetra K.↗

Testing of fiber optic based sensors for advanced reactors in the Texas A&M University TRIGA reactor

An Optical Fiber Based Gamma Thermometer has been developed and tested at the Texas A&M University reactor as well as the Ohio State Research Reactor. This sensor technology provides temperature measurement of a thermal mass undergoing gamma heating, from which the gamma flux along the length of the sensor may be calculated. The gamma flux data from an array of OFBGTs could allow the determination of local power density within a nuclear reactor core in three dimensions. The design of the sensor makes use of optical fiber as a truly distributed temperature sensor with a spatial resolution less than 1mm and temperature accuracy of ±1°C. The testing program showed that the system provided the expected temperature data for each location. Overall, this sensor technology shows promise for current Light Water Reactors as well as advanced nuclear reactors by providing an unparalleled level of precision in reactor power measurement.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Lightweight Sun-Position Sensor Developed

An orbiting spacecraft needs to be able to accurately locate the position of the Sun so that the solar arrays can be pointed toward the Sun. This not only maximizes the production of power, but it also helps the arrays find their orientation in space so that they can accurately point antennae at ground stations. As part of the work on the (now postponed) Mars-2001 Surveyor Lander, NASA Glenn Research Center engineers developed a new Sun sensor that is far lighter and simpler than earlier designs. This sensor uses the technology of a linear photodiode array to find the position of the Sun in one axis. Two of these sensors, used together, can locate the x and y coordinates of the Sun relative to the spacecraft. These sensors have a mass of only 18 g each, nearly an order of magnitude lighter than earlier designs. (This mass does not include the electronic circuit to read the photodiode output, which is on the experiment microcontroller.) Near the center of the field of view, the Sun position can be found to 0.15

Landis, Geoffrey A.↗

Gaia: segmented germanium detector for high-energy X-ray fluorescence and spectroscopic imaging

We present Gaia, a monolithic array of 96 high-purity germanium pixel detectors integrated with a custom low-noise application-specific integrated circuit (ASIC) and a field-programmable gate array (FPGA)-based data acquisition system. The sensor operates at ∼100 K using a commercial closed-cycle cryocooler, with the in-vacuum electronics thermally isolated from the cold finger to ensure thermal stability. The system demonstrates an average energy resolution of 711 eV at 122 keV, measured using a 57 Co source, and 253 eV at 5.89 keV, measured with 55 Fe across all channels. The readout architecture incorporates a high-performance FPGA paired with a dual-core ARM processor, forming a complete embedded Linux-based computing platform. Communication between the processor and FPGA is handled via memory-mapped I/O, and data are streamed over high-speed gigabit Ethernet. A full-scale 384-pixel Gaia detector, based on this 96-element module, is currently under fabrication.

36 MATERIALS SCIENCE↗

Impulsive Magnetic Anomaly Detection At the 100-m Scale With an Array of Induction Coil Magnetometers

We demonstrate magnetic anomaly detection (MAD) using an array of 24 commercial induction coil magnetometers with stand-off distances from a pulsed 99.8(3) kA·m 2 magnetic dipole source of 260–1200 m. The sparse array is used to estimate the magnetic dipole location, magnitude, and orientation. We demonstrate how independent component analysis (ICA) improves the accuracy and precision of the magnetometer array when estimating the dipole parameters. Using sensor responses recorded from individual source pulses, we estimate the dipole location to within 29 ± 2 m, the magnitude to within 3 ± 3 kA·m 2 , and dipole orientation error to within 19 ± 0.6°.

47 OTHER INSTRUMENTATION↗