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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 955 records · Page 53
All sourcesNASA NTRSDOE OSTI
DOE OSTI2025

Frequency-domain modeling of floating wind arrays with shared mooring lines

A frequency-domain model for floating wind turbine dynamics has been extended to model floating wind farms with couplings from shared mooring systems. The model, called RAFT, could previously calculate the mean offsets and wave-induced response spectra for single floating wind turbines. Now, the model supports multiple floating wind turbines, each with their own properties and responses, along with mooring lines that run directly between floating wind turbines in the array, meaning that shared mooring lines or fully suspended dynamic power cables can be included. This capability is achieved by setting up an array-level solution of the system mean offsets and assembling the full system matrices for solving the dynamic response. The quasi-static mooring model MoorPy is used to linearize the mooring system properties. To compute the floating wind turbine relative motions, phase offsets are applied to each turbine's response as a function of wave frequency based on the wavelength and relative positions in the array. These differential motions are then applied to mooring system tension Jacobians to compute the tension loads in the shared mooring lines. Overall, the capability provides a frequency-domain analog to the modeling capabilities of the floating support structure in FAST.Farm. Mean offsets and power spectral density plots of responses are compared between RAFT and FAST.Farm to verify the implementation. The results indicate good agreement within the expectations of a frequency-domain modeling approach and suggest correct implementation of the shared mooring aspects. Additionally, a unique comb-like frequency response in the shared mooring line tensions has been observed. This phenomenon has a clear physical basis and may be an important design consideration for future shared mooring systems.

17 WIND ENERGY↗
DOE OSTI2026

Solar Heat for Industrial Processes: Integration with Chemical Reactors

The integration of solar thermal systems with chemical reactors has been proposed as part of a larger effort to develop and deploy solar heat for industrial processes (SHIP) technologies. A strong motivation for SHIP processes and technologies is the potential for high thermal efficiency coupled with low-cost thermal energy storage (TES) which can enable commercial deployment of such systems. While there are different ways to categorize SHIP technologies, one important such distinction is between directly irradiated systems and indirect off-sun process driven by a SHIP system. While directly irradiated systems can provide high thermal efficiencies and high fluxes, they usually require complex engineering solutions due to the need for redesigning the established processes and unit operations. In most cases, it is also more challenging to couple such a process to a TES system, losing some of the benefits of SHIP. On the other hand, using a SHIP system to drive an industrial process off-sun can allow better integration with existing process chains, easier TES capabilities, and potential for more applications fitting a specific SHIP technology. However, the integration of SHIP systems with the industrial processes is not fully explored in detail, especially in the case of high-temperature processes such as reforming, cracking, cement manufacturing, and iron/steelmaking. Many of these systems require heating fluxes of >50 kW/m^2, supplied via combustion of hydrocarbons in a fire box and benefitting from radiative heat transfer between the flue gases and the reaction zones. As such, using SHIP systems for such processes is more complex than providing the same thermal input in the form of a heat transfer medium (HTM) entering the reactor, kiln, or furnace. Moreover, in case convective heat transfer using SHIP is envisioned, for example using supercritical CO2 as the HTM from a particle receiver, the thermal integration might be more challenging than initially envisioned: lower heat transfer coefficients and limited approach temperature might require large flow rates, causing a mismatch between the process thermal requirements and the thermal capacity of the SHIP system. In addition, even if the heat exchange between SHIP and reactor is effective, there is still a cold leg HTM at the reaction temperature or slightly below it. Chemical plants usually include a set of heat exchangers, heat recovery steam generators, and even power generation units - in a tightly integrated design - to recover the flue gases which are eventually vented. With SHIP systems mostly operating on a closed HTM loop, bottoming the cold leg is crucial. In this talk, we will present different modeling results for a variety of syngas production reactions, using catalytic and chemical looping processes, and discuss some of the challenges and design considerations for off-sun chemical reactors using SHIP systems.

14 SOLAR ENERGY↗
NASA NTRS1965

Usb antenna structures

Design consideration of unified S-band antenna on land and shipboard for Apollo project

TRACKING ANTENNA↗
NASA NTRS1967

Yo-yo despin mechanisms

Design considerations and performance features of yo-yo despinning mechanisms

PERFORMANCE CHARACTERISTICS↗
NASA NTRS1967

Investigation of Solder Cracking Problems on Printed Circuit Boards

A Solder Committee designated to investigate a solder cracking phenomena occurring on the SATURN electrical/electronic hardware found the cause to be induced stress in the soldered connections rather than faulty soldering techniques. The design of the printed circuit (PC) board assemblies did not allow for thermal expansion of the boards that occurred during normal operation. The difference between the thermal expansion properties of the boards and component lead materials caused stress and cracking in the soldered connections. The failure mechanism and various PC boards component mounting configurations are examined in this report. Effective rework techniques using flanged tubelets, copper tubelets, and soft copper wiring are detailed. Future design considerations to provide adequate strain relief in mounting configurations are included to ensure successful solder terminations.

CIRCUIT BOARD↗