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At least 955 records · Page 53

Grounding Headphones for Protection Against ESD

A simple alternative technique has been devised protecting delicate equipment against electrostatic discharge (ESD) in settings in which workers wear communication headsets. In the original setting in which the technique was devised, the workers who wear the headsets also wear anti-ESD grounding straps on their wrists. The alternative technique eliminates the need for the wrist grounding straps by providing for grounding through the headsets. In place of the electrically insulating foam pads on the headsets, one installs pads made of electrically conductive foam like that commonly used to protect electronic components. Grounding wires are attached to the conductive foam pads, then possibly to the shielding cable which may be grounded to the backshell on the connector. The efficacy of this technique in protecting against ESD has been verified in experiments. The electrical resistance of the pads is a few megohms - about the same as that of a human body between the fingers of opposite hands and, hence, low enough for grounding. The only drawback of the technique is that care must be taken to place the foam pads in contact with the user s skin: any hair that comes between the foam pads and the skin must be pushed aside because hair is electrically insulating and thus prevents adequate grounding.

Peters, John↗

Backplane Design Considerations for High Speed SpaceWire Networks

SpaceWire is becoming a preferred protocol for board to board communication over a backplane in addition to its existing use over cabled interfaces, replacing other protocols due to its simplicity and readily available flight quality physical layer devices, IP cores and test equipment. However, without specific guidelines for implementing SpaceWire over a backplane, designers are left to make trade decisions regarding connector selection, layout design rules and test accessibility issues. This paper will discuss NASA's Goddard Space Flight Center s implementation of high speed SpaceWire over backplane on James Webb Space Telescope and other missions.

Pagen, Shahana Aziz↗

NASA Tech Briefs, August 2003

Topics covered include: Stable, Thermally Conductive Fillers for Bolted Joints; Connecting to Thermocouples with Fewer Lead Wires; Zipper Connectors for Flexible Electronic Circuits; Safety Interlock for Angularly Misdirected Power Tool; Modular, Parallel Pulse-Shaping Filter Architectures; High-Fidelity Piezoelectric Audio Device; Photovoltaic Power Station with Ultracapacitors for Storage; Time Analyzer for Time Synchronization and Monitor of the Deep Space Network; Program for Computing Albedo; Integrated Software for Analyzing Designs of Launch Vehicles; Abstract-Reasoning Software for Coordinating Multiple Agents; Software Searches for Better Spacecraft-Navigation Models; Software for Partly Automated Recognition of Targets; Antistatic Polycarbonate/Copper Oxide Composite; Better VPS Fabrication of Crucibles and Furnace Cartridges; Burn-Resistant, Strong Metal-Matrix Composites; Self-Deployable Spring-Strip Booms; Explosion Welding for Hermetic Containerization; Improved Process for Fabricating Carbon Nanotube Probes; Automated Serial Sectioning for 3D Reconstruction; and Parallel Subconvolution Filtering Architectures.

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High-Performance Solid-State W-Band Power Amplifiers

The figure shows one of four solid-state power amplifiers, each capable of generating an output power greater than or equal to 240 mW over one of four overlapping frequency bands from 71 to 106 GHz. (The bands are 71 to 84, 80 to 92, 88 to 99, and 89 to 106 GHz.) The amplifiers are designed for optimum performance at a temperature of 130 K. These amplifiers were developed specifically for incorporation into frequency-multiplier chains in local oscillators in a low-noise, far-infrared receiving instrument to be launched into outer space to make astrophysical observations. The designs of these amplifiers may also be of interest to designers and manufacturers of terrestrial W-band communication and radar systems. Each amplifier includes a set of six high-electron-mobility transistor (HEMT) GaAs monolithic microwave integrated-circuit (MMIC) chips, microstrip cavities, and other components packaged in a housing made from A-40 silicon-aluminum alloy. This alloy was chosen because, for the original intended spacecraft application, it offers an acceptable compromise among the partially competing requirements for high thermal conductivity, low mass, and low thermal expansion. Problems that were solved in designing the amplifiers included designing connectors and packages to fit the available space; designing microstrip signal-power splitters and combiners; matching of impedances across the frequency bands; matching of the electrical characteristics of those chips installed in parallel power-combining arms; control and levelling of output power across the bands; and designing the MMICs, microstrips, and microstrip cavities to suppress tendencies toward oscillation in several modes, both inside and outside the desired frequency bands.

Gaier, Todd↗

NASA Tech Briefs, September 2011

Topics covered include: Fused Reality for Enhanced Flight Test Capabilities; Thermography to Inspect Insulation of Large Cryogenic Tanks; Crush Test Abuse Stand; Test Generator for MATLAB Simulations; Dynamic Monitoring of Cleanroom Fallout Using an Air Particle Counter; Enhancement to Non-Contacting Stress Measurement of Blade Vibration Frequency; Positively Verifying Mating of Previously Unverifiable Flight Connectors; Radiation-Tolerant Intelligent Memory Stack - RTIMS; Ultra-Low-Dropout Linear Regulator; Excitation of a Parallel Plate Waveguide by an Array of Rectangular Waveguides; FPGA for Power Control of MSL Avionics; UAVSAR Active Electronically Scanned Array; Lockout/Tagout (LOTO) Simulator; Silicon Carbide Mounts for Fabry-Perot Interferometers; Measuring the In-Process Figure, Final Prescription, and System Alignment of Large; Optics and Segmented Mirrors Using Lidar Metrology; Fiber-Reinforced Reactive Nano-Epoxy Composites; Polymerization Initiated at the Sidewalls of Carbon Nanotubes; Metal-Matrix/Hollow-Ceramic-Sphere Composites; Piezoelectrically Enhanced Photocathodes; Iridium-Doped Ruthenium Oxide Catalyst for Oxygen Evolution; Improved Mo-Re VPS Alloys for High-Temperature Uses; Data Service Provider Cost Estimation Tool; Hybrid Power Management-Based Vehicle Architecture; Force Limit System; Levitated Duct Fan (LDF) Aircraft Auxiliary Generator; Compact, Two-Sided Structural Cold Plate Configuration; AN Fitting Reconditioning Tool; Active Response Gravity Offload System; Method and Apparatus for Forming Nanodroplets; Rapid Detection of the Varicella Zoster Virus in Saliva; Improved Devices for Collecting Sweat for Chemical Analysis; Phase-Controlled Magnetic Mirror for Wavefront Correction; and Frame-Transfer Gating Raman Spectroscopy for Time-Resolved Multiscalar Combustion Diagnostics.

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180-GHz Interferometric Imager

A 180-GHz interferometric imager uses compact receiver modules, combined high- and low-gain antennas, and ASIC (application specific integrated circuit) correlator technology, enabling continuous, all-weather observations of water vapor with 25-km resolution and 0.3-K noise in 15 minutes of observation for numerical weather forecasting and tropical storm prediction. The GeoSTAR-II prototype instrument is broken down into four major subsystems: the compact, low-noise receivers; sub-array modules; IF signal distribution; and the digitizer/correlator. Instead of the single row of antennas adopted in GeoSTAR, this version has four rows of antennas on a coarser grid. This dramatically improves the sensitivity in the desired field of view. The GeoSTAR-II instrument is a 48-element, synthetic, thinned aperture radiometer operating at 165-183 GHz. The instrument has compact receivers integrated into tiles of 16 elements in a 4x4 arrangement. These tiles become the building block of larger arrays. The tiles contain signal distribution for bias controls, IF signal, and local oscillator signals. The IF signals are digitized and correlated using an ASIC correlator to minimize power consumption. Previous synthetic aperture imagers have used comparatively large multichip modules, whereas this approach uses chip-scale modules mounted on circuit boards, which are in turn mounted on the distribution manifolds. This minimizes the number of connectors and reduces system mass. The use of ASIC technology in the digitizers and correlators leads to a power reduction close to an order of magnitude.

Kangaslahti, Pekka P.↗

Metal Patch Antenna

Disclosed herein is a patch antenna comprises a planar conductive patch attached to a ground plane by a support member, and a probe connector in electrical communication with the conductive patch arranged to conduct electromagnetic energy to or from the conductive patch, wherein the conductive patch is disposed essentially parallel to the ground plane and is separated from the ground plane by a spacing distance; wherein the support member comprises a plurality of sides disposed about a central axis oriented perpendicular to the conductive patch and the ground plane; wherein the conductive patch is solely supported above the ground plane by the support member; and wherein the support member provides electrical communication between the planer conductive patch and the ground plane.

Chamberlain, Neil F.↗

Face-Sheet Quality Analysis and Thermo-Physical Property Characterization of OOA and Autoclave Panels

Increased application of polymer matrix composite (PMC) materials in large vehicle structures requires consideration of non-autoclave manufacturing technology. The NASA Composites for Exploration project, and its predecessor, Lightweight Spacecraft Structures and Materials project, were tasked with the development of materials and manufacturing processes for structures that will perform in a heavy-lift-launch vehicle environment. Both autoclave and out of autoclave processable materials were considered. Large PMC structures envisioned for such a vehicle included the payload shroud and the interstage connector. In this study, composite sandwich panels representing 1/16th segments of the barrel section of the Ares V rocket fairing were prepared as 1.8 m x 2.4 m sections of the 10 m diameter arc segment. IM7/977-3 was used as the face-sheet prepreg of the autoclave processed panels and T40-800B/5320-1 for the out of autoclave panels. The core was 49.7 kilograms per square meters (3.1 pounds per cubic feet (pcf)) aluminum honeycomb. Face-sheets were fabricated by automated tape laying 153 mm wide unidirectional tape. This work details analysis of the manufactured panels where face-sheet quality was characterized by optical microscopy, cured ply thickness measurements, acid digestion, and thermal analysis.

Miller, Sandi G.↗

Ultra-Compact Motor Controller

This invention is an electronically commutated brushless motor contro ller that incorporates Hall-array sensing in a small, 42-gram packag e that provides 4096 absolute counts per motor revolution position s ensing. The unit is the size of a miniature hockey puck, and is a 44 -pin male connector that provides many I/O channels, including CANbus , RS-232 communications, general-purpose analog and digital I/O (GPI O), analog and digital Hall inputs, DC power input (18-90 VDC, 0-l0 A), three-phase motor outputs, and a strain gauge amplifier.

Townsend, William T.↗

Alumina Based 500 C Electronic Packaging Systems and Future Development

NASA space and aeronautical missions for probing the inner solar planets as well as for in situ monitoring and control of next-generation aeronautical engines require high-temperature environment operable sensors and electronics. A 96% aluminum oxide and Au thick-film metallization based packaging system including chip-level packages, printed circuit board, and edge-connector is in development for high temperature SiC electronics. An electronic packaging system based on this material system was successfully tested and demonstrated with SiC electronics at 500 C for over 10,000 hours in laboratory conditions previously. In addition to the tests in laboratory environments, this packaging system has more recently been tested with a SiC junction field effect transistor (JFET) on low earth orbit through the NASA Materials on the International Space Station Experiment 7 (MISSE7). A SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE7 suite to International Space Station via a Shuttle mission and tested on the orbit for eighteen months. A summary of results of tests in both laboratory and space environments will be presented. The future development of alumina based high temperature packaging using co-fired material systems for improved performance at high temperature and more feasible mass production will also be discussed.

Chen, Liang-Yu↗

W-band Heterodyne Receiver Module with 27 K Noise Temperature

We present noise temperature and gain measurements of a W-band heterodyne module populated with MMIC LNAs designed and fabricated using 35nm InP HEMT process. The module has a WR-10 waveguide input. GPPO connectors are used for the LO input and the I and and Q IF outputs. The module is tested at both ambient (300 K) and cryogenic (25 K) temperatures. At 25 K physical temperature, the module has a noise temperature in the range of 27-45 K over the frequency band of 75-111 GHz. The module gain varies between 15 dB and 27 dB. The band-averaged module noise temperature of 350 K and 33 K were measured over 80-110 GHz for the physical temperature of 300 K and 25 K, respectively. The resulting cooling factor is 10.6.

heterodyne module↗

Compact Autonomous Hemispheric Vision System

Solar System Exploration camera implementations to date have involved either single cameras with wide field-of-view (FOV) and consequently coarser spatial resolution, cameras on a movable mast, or single cameras necessitating rotation of the host vehicle to afford visibility outside a relatively narrow FOV. These cameras require detailed commanding from the ground or separate onboard computers to operate properly, and are incapable of making decisions based on image content that control pointing and downlink strategy. For color, a filter wheel having selectable positions was often added, which added moving parts, size, mass, power, and reduced reliability. A system was developed based on a general-purpose miniature visible-light camera using advanced CMOS (complementary metal oxide semiconductor) imager technology. The baseline camera has a 92 FOV and six cameras are arranged in an angled-up carousel fashion, with FOV overlaps such that the system has a 360 FOV (azimuth). A seventh camera, also with a FOV of 92 , is installed normal to the plane of the other 6 cameras giving the system a > 90 FOV in elevation and completing the hemispheric vision system. A central unit houses the common electronics box (CEB) controlling the system (power conversion, data processing, memory, and control software). Stereo is achieved by adding a second system on a baseline, and color is achieved by stacking two more systems (for a total of three, each system equipped with its own filter.) Two connectors on the bottom of the CEB provide a connection to a carrier (rover, spacecraft, balloon, etc.) for telemetry, commands, and power. This system has no moving parts. The system's onboard software (SW) supports autonomous operations such as pattern recognition and tracking.

Pingree, Paula J.↗

Packaging Technologies for 500C SiC Electronics and Sensors

Various SiC electronics and sensors are currently under development for applications in 500C high temperature environments such as hot sections of aerospace engines and the surface of Venus. In order to conduct long-term test and eventually commercialize these SiC devices, compatible packaging technologies for the SiC electronics and sensors are required. This presentation reviews packaging technologies developed for 500C SiC electronics and sensors to address both component and subsystem level packaging needs for high temperature environments. The packaging system for high temperature SiC electronics includes ceramic chip-level packages, ceramic printed circuit boards (PCBs), and edge-connectors. High temperature durable die-attach and precious metal wire-bonding are used in the chip-level packaging process. A high temperature sensor package is specifically designed to address high temperature micro-fabricated capacitive pressure sensors for high differential pressure environments. This presentation describes development of these electronics and sensor packaging technologies, including some testing results of SiC electronics and capacitive pressure sensors using these packaging technologies.

Chen, Liang-Yu↗

NASA Tech Briefs, June 2013

Topics include: Cloud Absorption Radiometer Autonomous Navigation System - CANS, Software Method for Computed Tomography Cylinder Data Unwrapping, Re-slicing, and Analysis, Discrete Data Qualification System and Method Comprising Noise Series Fault Detection, Simple Laser Communications Terminal for Downlink from Earth Orbit at Rates Exceeding 10 Gb/s, Application Program Interface for the Orion Aerodynamics Database, Hyperspectral Imager-Tracker, Web Application Software for Ground Operations Planning Database (GOPDb) Management, Software Defined Radio with Parallelized Software Architecture, Compact Radar Transceiver with Included Calibration, Software Defined Radio with Parallelized Software Architecture, Phase Change Material Thermal Power Generator, The Thermal Hogan - A Means of Surviving the Lunar Night, Micromachined Active Magnetic Regenerator for Low-Temperature Magnetic Coolers, Nano-Ceramic Coated Plastics, Preparation of a Bimetal Using Mechanical Alloying for Environmental or Industrial Use, Phase Change Material for Temperature Control of Imager or Sounder on GOES Type Satellites in GEO, Dual-Compartment Inflatable Suitlock, Modular Connector Keying Concept, Genesis Ultrapure Water Megasonic Wafer Spin Cleaner, Piezoelectrically Initiated Pyrotechnic Igniter, Folding Elastic Thermal Surface - FETS, Multi-Pass Quadrupole Mass Analyzer, Lunar Sulfur Capture System, Environmental Qualification of a Single-Crystal Silicon Mirror for Spaceflight Use, Planar Superconducting Millimeter-Wave/Terahertz Channelizing Filter, Qualification of UHF Antenna for Extreme Martian Thermal Environments, Ensemble Eclipse: A Process for Prefab Development Environment for the Ensemble Project, ISS Live!, Space Operations Learning Center (SOLC) iPhone/iPad Application, Software to Compare NPP HDF5 Data Files, Planetary Data Systems (PDS) Imaging Node Atlas II, Automatic Calibration of an Airborne Imaging System to an Inertial Navigation Unit, Translating MAPGEN to ASPEN for MER, Support Routines for In Situ Image Processing, and Semi-Supervised Eigenbasis Novelty Detection.

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Packaging Technologies for High Temperature Electronics and Sensors

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500 C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550 C. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500 C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500 C are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Chen, Liang-Yu↗

Advanced Hybrid Spacesuit Concept Featuring Integrated Open Loop and Closed Loop Ventilation Systems

A document discusses the design and prototype of an advanced spacesuit concept that integrates the capability to function seamlessly with multiple ventilation system approaches. Traditionally, spacesuits are designed to operate both dependently and independently of a host vehicle environment control and life support system (ECLSS). Spacesuits that operate independent of vehicle-provided ECLSS services must do so with equipment selfcontained within or on the spacesuit. Suits that are dependent on vehicle-provided consumables must remain physically connected to and integrated with the vehicle to operate properly. This innovation is the design and prototype of a hybrid spacesuit approach that configures the spacesuit to seamlessly interface and integrate with either type of vehicular systems, while still maintaining the ability to function completely independent of the vehicle. An existing Advanced Crew Escape Suit (ACES) was utilized as the platform from which to develop the innovation. The ACES was retrofitted with selected components and one-off items to achieve the objective. The ventilation system concept was developed and prototyped/retrofitted to an existing ACES. Components were selected to provide suit connectors, hoses/umbilicals, internal breathing system ducting/ conduits, etc. The concept utilizes a lowpressure- drop, high-flow ventilation system that serves as a conduit from the vehicle supply into the suit, up through a neck seal, into the breathing helmet cavity, back down through the neck seal, out of the suit, and returned to the vehicle. The concept also utilizes a modified demand-based breathing system configured to function seamlessly with the low-pressure-drop closed-loop ventilation system.

Daniel, Brian A.↗

NASA Tech Briefs, October 2013

Topics include: A Short-Range Distance Sensor with Exceptional Linearity; Miniature Trace Gas Detector Based on Microfabricated Optical Resonators; Commercial Non-Dispersive Infrared Spectroscopy Sensors for Sub-Ambient Carbon Dioxide Detection; Fast, Large-Area, Wide-Bandgap UV Photodetector for Cherenkov Light Detection; Mission Data System Java Edition Version 7; Adaptive Distributed Environment for Procedure Training (ADEPT); LEGEND, a LEO-to-GEO Environment Debris Model; Electronics/Computers; Millimeter-Wave Localizers for Aircraft-to-Aircraft Approach Navigation; Impedance Discontinuity Reduction Between High-Speed Differential Connectors and PCB Interfaces; SpaceCube Version 1.5; High-Pressure Lightweight Thrusters; Non-Magnetic, Tough, Corrosion- and Wear-Resistant Knives From Bulk Metallic Glasses and Composites; Ambient Dried Aerogels; Applications for Gradient Metal Alloys Fabricated Using Additive Manufacturing; Passivation of Flexible YBCO Superconducting Current Lead With Amorphous SiO2 Layer; Propellant-Flow-Actuated Rocket Engine Igniter; Lightweight Liquid Helium Dewar for High-Altitude Balloon Payloads; Method to Increase Performance of Foil Bearings Through Passive Thermal Management; Unibody Composite Pressurized Structure; JWST Integrated Science Instrument Module Alignment Optimization Tool; Radar Range Sidelobe Reduction Using Adaptive Pulse Compression Technique; Digitally Calibrated TR Modules Enabling Real-Time Beamforming SweepSAR Architectures; Electro-Optic Time-to-Space Converter for Optical Detector Jitter Mitigation; Partially Transparent Petaled Mask/Occulter for Visible-Range Spectrum; Educational NASA Computational and Scientific Studies (enCOMPASS); Coarse-Grain Bandwidth Estimation Scheme for Large-Scale Network; Detection of Moving Targets Using Soliton Resonance Effect; High-Efficiency Nested Hall Thrusters for Robotic Solar System Exploration; High-Voltage Clock Driver for Photon-Counting CCD Characterization; Development of the Code RITRACKS; and Enabling Microliquid Chromatography by Microbead Packing of Microchannels.

Source record↗

Packaging Technologies for High Temperature Electronics and Sensors

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500degC silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chiplevel packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550degC. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500degC for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500degC are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Electronic packaging↗