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At least 955 records · Page 53

Radiation Testing and Evaluation Issues for Modern Integrated Circuits

Abstract. Changes in modern integrated circuit (IC) technologies have modified the way we approach and conduct radiation tolerance and testing of electronics. These changes include scaling of geometries, new materials, new packaging technologies, and overall speed and device complexity challenges. In this short course section, we will identify and discuss these issues as they impact radiation testing, modeling, and effects mitigation of modern integrated circuits. The focus will be on CMOS-based technologies, however, other high performance technologies will be discussed where appropriate. The effects of concern will be: Single-Event Effects (SEE) and steady state total ionizing dose (TID) IC response. However, due to the growing use of opto-electronics in space systems issues concerning displacement damage testing will also be considered. This short course section is not intended to provide detailed "how-to-test" information, but simply provide a snapshot of current challenges and some of the approaches being considered.

LaBel, Kenneth A.↗

Single-Event Upset and Scaling Trends in New Generation of the Commercial SOI PowerPC Microprocessors

SEU from heavy-ions is measured for SOI PowerPC microprocessors. Results for 0.13 micron PowerPC with 1.1V core voltages increases over 1.3V versions. This suggests that improvement in SEU for scaled devices may be reversed. In recent years there has been interest in the possible use of unhardened commercial microprocessors in space because of their superior performance compared to hardened processors. However, unhardened devices are susceptible to upset from radiation space. More information is needed on how they respond to radiation before they can be used in space. Only a limited number of advanced microprocessors have been subjected to radiation tests, which are designed with lower clock frequencies and higher internal core voltage voltages than recent devices [1-6]. However the trend for commercial Silicon-on-insulator (SOI) microprocessors is to reduce feature size and internal core voltage and increase the clock frequency. Commercial microprocessors with the PowerPC architecture are now available that use partially depleted SOI processes with feature size of 90 nm and internal core voltage as low as 1.0 V and clock frequency in the GHz range. Previously, we reported SEU measurements for SOI commercial PowerPCs with feature size of 0.18 and 0.13 m [7, 8]. The results showed an order of magnitude reduction in saturated cross section compared to CMOS bulk counterparts. This paper examines SEUs in advanced commercial SOI microprocessors, focusing on SEU sensitivity of D-Cache and hangs with feature size and internal core voltage. Results are presented for the Motorola SOI processor with feature sizes of 0.13 microns and internal core voltages of 1.3 and 1.1 V. These results are compared with results for the Motorola SOI processors with feature size of 0.18 microns and internal core voltage of 1.6 and 1.3 V.

Irom, Farokh↗

Gilgamesh: A Multithreaded Processor-In-Memory Architecture for Petaflops Computing

Processor-in-Memory (PIM) architectures avoid the von Neumann bottleneck in conventional machines by integrating high-density DRAM and CMOS logic on the same chip. Parallel systems based on this new technology are expected to provide higher scalability, adaptability, robustness, fault tolerance and lower power consumption than current MPPs or commodity clusters. In this paper we describe the design of Gilgamesh, a PIM-based massively parallel architecture, and elements of its execution model. Gilgamesh extends existing PIM capabilities by incorporating advanced mechanisms for virtualizing tasks and data and providing adaptive resource management for load balancing and latency tolerance. The Gilgamesh execution model is based on macroservers, a middleware layer which supports object-based runtime management of data and threads allowing explicit and dynamic control of locality and load balancing. The paper concludes with a discussion of related research activities and an outlook to future work.

management locality load balance↗

Complemenary body driving - a low voltage analog circuit technique for SOI

This paper describes several analog circuit primitives that utilize the body terminal as a signal port. A cascode current mirror that can operate with an input and output voltage of 200 mV; and a rail-to-rail, constant transconductance gain block capable of 1 V operation are presented. These circuits have been implemented in a standard 0.35~1 partially-depleted Silicon-on-Insulator (PDSOI) CMOS process and should find wide application in next-generation analog circuit designs.

neuro-prosthetic devices cortical signals↗

Total Ionizing Dose Effects on 64Mb 3.3V DRAMs

64Mb 3.3V CMOS DRAMs from two different manufacturers were tested for total dose. Retention time, power supply current, and functionality were used to characterize device response.

Ionizing Dose Effects Samsung Mitsubishi↗

15 cut-off 128x128 Quantum Well Infrared Photodetectors (QWIPS) Camera

We discuss the development and the performance of a very long wavelength (13.5 - 15 128x128 AlGaAs/GaAs multiquantum well infrared imaging system. Highly uniform, high-yield QWIP focal plane array was hybridized to a CMOS multiplexer operating in a direct injection mode. For efficient light coupling an integral random scattering reflector (Random Grating) was incorporated. Due to the high uniformity, excellent imagery, low noise as well as a noise equivalent temperature difference (NE T) of less than 30 mK were obtained when operating around 45 K. Therefore, high image contrast signal to noise ratio has been achieved.

128x128 Photodetectors↗

Design of a Low-Light-Level Image Sensor with On-Chip Sigma-Delta Analog-to- Digital Conversion

The design and projected performance of a low-light-level active-pixel-sensor (APS) chip with semi-parallel analog-to-digital (A/D) conversion is presented. The individual elements have been fabricated and tested using MOSIS* 2 micrometer CMOS technology, although the integrated system has not yet been fabricated. The imager consists of a 128 x 128 array of active pixels at a 50 micrometer pitch. Each column of pixels shares a 10-bit A/D converter based on first-order oversampled sigma-delta (Sigma-Delta) modulation. The 10-bit outputs of each converter are multiplexed and read out through a single set of outputs. A semi-parallel architecture is chosen to achieve 30 frames/second operation even at low light levels. The sensor is designed for less than 12 e^- rms noise performance.

Mendis, Sunetra K.↗

An Analog Processor for Image Compression

This paper describes a novel analog Vector Array Processor (VAP) that was designed for use in real-time and ultra-low power image compression applications. This custom CMOS processor is based architectually on the Vector Quantization (VQ) algorithm in image coding, and the hardware implementation fully exploits the inherent parallelism built-in the VQ algorithm.

Vector Array Processor VAP analog processor image ↗

SEU evaluation of FeRAM memories for space applications

SEU cross-sections were obtained for two different FeRAM memories: The 64 kbit and 256 kbit Ramtron FeRAM and the Hynix 64 kbit device. The devices were seen to have latch-up characteristics typical of commercial CMOS. Also, errors in the memory were also seen from heavy ion irradiation.

SEU FeRAM ion irradiation↗

Clementine RRELAX SRAM Particle Spectrometer

The Clementine RRELAX radiation monitor chip consists of a p-FET total dose monitor and a 4-kbit SRAM particle spectrometer. Eight of these chips were included in the RRELAX and used to detect the passage of the Clementine (S/C) and the innerstage adapter (ISA) through the earth's radiation belts and the 21-Feb 1994 solar flare. This is the first space flight for this 1.2 micron rad-soft custom CMOS radiation monitor. This paper emphasizes results from the SRAM particle detector which showed that it a) has a detection range of five orders of magnitude relative to the 21-Feb solar flare, b) is not affected by electrons, and c) detected microflares occurring with a 26.5 day period.

Clementine↗

Silicon validation of evolution-designed circuits

This paper is the first to report on a silicon implementation of circutis evolved in simulation. Several circuits were evolved an fabricated in 0.5 micron CMOS process; this paper focuses on results of logical gates evolved at transistor level. It discusses the steps taken in order to increase the chances of robust and portable designs, summarizes the results of characterization tests based on chip measurements, and comments on the performance comparing to simulations.

evolutionary algorithms↗

VLSI design of turbo decoder for integrated communication system on a chip applications

A high-throughput low-power turbo decoder core has been developed for integrated communication system applications such as satellite communications, wireless LAN, digital TV, cable modem, Digital Video Broadcast (DVB), and xDSL systems. The turbo decoder is based on convolutional constituent codes, which outperform all other Forward Error Correction techniques. This turbo decoder core is parameterizable and can be modified easily to fit any size for advanced communication system-on-chip products. The turbo decoder core provides Forward Error Correction of up to 15 Mbits/sec on a 0.13-micron CMOS FPGA prototyping chip at a power of 0.1 watts.

turbo decoder↗

A Nanochannel fabrication technique using chemical-mechanical polishing (CMP) and thermal oxidation

We have developed a new nanochannel fabrication technique using chemical-mechanical polishing (CMP) and thermal oxidation. With this technique, it is possible to control the width, length, and depth of the nanochannels without the need for nanolithography. The use of sacrificial SiO2 layers allows the fabrication of centimeter-long nanochannels. In addition, the fabrication process is CMOS compatible. We have successfully fabricated an array of extremely long and narrow nanochannels (i.e. 10 mm long, 25 nm wide and 100 nm deep) with smooth inner surfaces.

bionanotechnology↗

Taking evolutionary circuit design from experimentation to implementation: some useful techniques and a silicon demonstration

Current techniques in evolutionary synthesis of analogue and digital circuits designed at transistor level have focused on achieving the desired functional response, without paying sufficient attention to issues needed for a practical implementation of the resulting solution. No silicon fabrication of circuits with topologies designed by evolution has been done before, leaving open questions on the feasibility of the evolutionary circuit design approach, as well as on how high-performance, robust, or portable such designs could be when implemented in hardware. It is argued that moving from evolutionary 'design-for experimentation' to 'design-for-implementation' requires, beyond inclusion in the fitness function of measures indicative of circuit evaluation factors such as power consumption and robustness to temperature variations, the addition of certain evaluation techniques that are not common in conventional design. Several such techniques that were found to be useful in evolving designs for implementation are presented; some are general, and some are particular to the problem domain of transistor-level logic design, used here as a target application. The example used here is a multifunction NAND/NOR logic gate circuit, for which evolution obtained a creative circuit topology more compact than what has been achieved by multiplexing a NAND and a NOR gate. The circuit was fabricated in a 0.5 mum CMOS technology and silicon tests showed good correspondence with the simulations.

digital circuits designs↗