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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 937 records · Page 52

RTSJ Memory Areas and Their Affects on the Performance of a Flight-Like Attitude Control System

The two most important factors in improving performance in any software system, but especially a real-time, embedded system, are knowing which components are the low performers and knowing what can be done to improve their performance. The word performance with respect to a real-time, embedded system does not necessarily mean fast execution, which is the common definition when discussing non real-time systems. It also includes meeting all of the specified execution dead-lines and executing at the correct time without sacrificing non real-time performance. Using a Java prototype of an existing control system used on Deep Space 1[1], the effects from adding memory areas are measured and evaluated with respect to improving performance.

Real-time Specification for Java2 (RTSJ)↗

Microdose Induced Data Loss on Floating Gate Memories

Heavy ion irradiation of flash memories shows loss of stored data. The fluence dependence is indicative of microdose effects. Other qualitative factors identifying the effect as microdose are discussed. The data is presented, and compared to statistical results of a microdose target-based model.

radiation effects↗

Radiation Tests on 2Gb NAND Flash Memories

We report on SEE and TID tests of highly scaled Samsung 2Gbits flash memories. Both in-situ and biased interval irradiations were used to characterize the response of the total accumulated dose failures. The radiation-induced failures can be categorized as followings: single event upset (SEU) read errors in biased and unbiased modes, write errors, and single-event-functional-interrupt (SEFI) failures.

NAND circuits↗

Shape Memory Alloy Research and Development at NASA Glenn - Current and Future Progress

Shape memory alloys (SMAs) are a unique class of multifunctional materials that have the ability to recover large deformations or generate high stresses in response to thermal, mechanical and or electromagnetic stimuli. These abilities have made them a viable option for actuation systems in aerospace, medical, and automotive applications, amongst others. However, despite many advantages and the fact that SMA actuators have been developed and used for many years, so far they have only found service in a limited range of applications. In order to expand their applications, further developments are needed to increase their reliability and stability and to address processing, testing and qualification needed for large-scale commercial application of SMA actuators.

Challenges↗

On the Recovery Stress of a Ni50.3Ti29.7Hf20 High Temperature Shape Memory Alloy

Recovery stress in shape memory alloys (SMAs), also known as blocking stress, is an important property generally obtained during heating under a dimensional constraint as the material undergoes the martensitic phase transformation. This property has been instinctively utilized in most SMA shape-setting procedures, and has been used in numerous applications such as fastening and joining, rock splitting, safety release mechanisms, reinforced composites, medical devices, and many other applications. The stress generation is also relevant to actuator applications where jamming loads (e.g., in case the actuator gets stuck and is impeded from moving) need to be determined for proper hardware sizing. Recovery stresses in many SMA systems have been shown to reach stresses in the order of 800 MPa, achieved via thermo-mechanical training such as pre-straining, heat treatments or other factors. With the advent of high strength, high temperature SMAs, recovery stress data has been rarely probed, and there is no information pertinent to the magnitudes of these stresses. Thus, the purpose of this work is to investigate the recovery stress capability of a precipitation strengthened, Ni50.3Ti29.7Hf20 (at.) high temperature SMA in uniaxial tension and compression. This material has been shown to exhibit outstanding strength and stability during constant-stress, thermal cycling, but no data exists on constant-strain thermal cycling. Several training routines were implemented as part of this work including isothermal pre-straining, isobaric thermal cycling, and isothermal cyclic training routines. Regardless of the training method used, the recovery stress was characterized using constant-strain (strain-controlled condition) thermal cycling between the upper and lower cycle temperatures. Preliminary results indicate recovery stresses in excess of 1.5 GPa were obtained after a specific training routine. This stress magnitude is significantly higher than conventional NiTi stress generation capability.

Recovery Stress↗

Shape Memory Alloy (SMA)-Based Launch Lock

Most NASA missions require the use of a launch lock for securing moving components during the launch or securing the payload before release. A launch lock is a device used to prevent unwanted motion and secure the controlled components. The current launch locks are based on pyrotechnic, electro mechanically or NiTi driven pin pullers and they are mostly one time use mechanisms that are usually bulky and involve a relatively high mass. Generally, the use of piezoelectric actuation provides high precession nanometer accuracy but it relies on friction to generate displacement. During launch, the generated vibrations can release the normal force between the actuator components allowing shaft's free motion which could result in damage to the actuated structures or instruments. This problem is common to other linear actuators that consist of a ball screw mechanism. The authors are exploring the development of a novel launch lock mechanism that is activated by a shape memory alloy (SMA) material ring, a rigid element and an SMA ring holding flexure. The proposed design and analytical model will be described and discussed in this paper.

launch lock↗

Heavy Ion Irradiation Fluence Dependence for Single-Event Upsets of NAND Flash Memory

We investigated the single-event effect (SEE) susceptibility of the Micron 16 nm NAND flash, and found the single-event upset (SEU) cross section varied inversely with fluence. The SEU cross section decreased with increasing fluence. We attribute the effect to the variable upset sensitivities of the memory cells. The current test standards and procedures assume that SEU follow a Poisson process and do not take into account the variability in the error rate with fluence. Therefore, heavy ion irradiation of devices with variable upset sensitivity distribution using typical fluence levels may underestimate the cross section and on-orbit event rate.

Single Event Effects (SEE)↗

Development of Shape Memory Alloys- Challenges and Solutions

Shape memory alloys (SMAs) are a unique class of multifunctional materials that have the ability to recover large deformations or generate high stresses in response to thermal, mechanical andor electromagnetic stimuli. These abilities have made them a viable option for actuation systems in aerospace, medical, and automotive applications, amongst others. However, despite many advantages and the fact that SMA actuators have been developed and used for many years, so far they have only found service in a limited range of applications. In order to expand their applications, further developments are needed to increase their reliability and stability and to address processing, testing and qualification needed for large-scale commercial application of SMA actuators. In this seminar, historical inhibitors of SMA applications and current research efforts by NASA Glenn Research Center and collaborators will be discussed. Relationships between fundamental physicalscientific understanding, and the direct transition to engineering and design of mechanisms using these novel materials will be highlighted. Examples will be presented related to targeted alloy development, microstructural control, and bulk-scale testing as a function of stresses, temperatures and harsh environments. The seminar will conclude with a summary of SMA applications under development and current advances.

Shape Memory Alloy↗

The Effects of Fiber Orientation and Adhesives on Tensile Properties of Carbon Fiber Reinforced Polymer Matrix Composite with Embedded Nickel-Titanium Shape Memory Alloys

Nickel-titanium (NiTi) shape memory alloy (SMA) sections were embedded within carbon fiber reinforced polymer matrix composite (CFRPPMC) laminates and their tensile properties were evaluated with simultaneous monitoring of modal acoustic emissions. The test specimens were fabricated in three different layup configurations and two different thin film adhesives were applied to bond the SMA with the PMC. A trio of acoustic sensors were attached to the specimens during tensile testing to monitor the modal acoustic emission (AE) as the materials experienced mechanical failure. The values of ultimate tensile strengths, strains, and moduli were obtained. Cumulative AE energy of events and specimen failure location were determined. In conjunction, optical and scanning electron microscopy techniques were used to examine the break areas of the specimens. The analysis of AE data revealed failure locations within the specimens which were validated from the microscopic images. The placement of 90 deg plies in the outer ply gave the strongest acoustic signals during break as well as the cleanest break of the samples tested. Overlapping 0 deg ply layers surrounding the SMA was found to be the best scenario to prevent failure of the specimen itself.

shape memory alloy↗

Precipitation Strengthenable NiTiPd High Temperature Shape Memory Alloys

In binary NiTi alloys, it has long been known that Ni-rich alloys can be heat treated to produce precipitates which both strengthen the matrix against dislocations and improve the behavior of the material under thermal and mechanical cycling. Within recent years, the same effect has been observed in Ni-rich NiTiHf high temperature shape memory alloys and heat treatment regimens have been defined which will reliably produce improved properties. In NiTiPd alloys, precipitation has also been observed, but studies are still underway to define reliable heat treatments and compositions which will provide a balance of strengthening and good thermomechanical properties. For this study, a series of NiTi-32 at.Pd alloys was produced to determine the effect of changing nickeltitanium content on the transformation behavior and heat treatability of the material. Samples were aged at temperatures between 350C and 450C for times up to 100 hours. Actuation type behavior was evaluated using uniaxial constant force thermal cycling (UCFTC) to determine the effect of composition and aging on the material behavior. TEMSEM was used to evaluate the microstructure and determine the types of precipitates formed. The correlation between composition, heat treat, microstructure, and thermomechanical behavior will be addressed and discussed.

Transformation strain↗

Effect of Thin-Film Adhesives on Mode I Interlaminar Fracture Toughness in Carbon Fiber Composites with Shape Memory Alloy Inserts

A single sheet of NiTi shape memory alloy (SMA) was introduced within a unidirectional HexPly® 8552/IM7 (Hexcel®) polymer matrix composite (PMC) panel in conjunction with multiple thin-film adhesives to promote the interfacial bond strength between the SMA and PMC. A double cantilever beam (DCB) test was performed in accordance with the ASTM D5528 method for evaluation of Mode I interlaminar fracture toughness of unidirectional fiber-reinforced PMCs. The modal acoustic emissions (MAEs) were monitored during testing with two acoustic sensors attached to the specimens. The composite panels were subjected to a C-scan before testing and examined using optical and scanning electron microscopy (SEM) techniques after part failure. The data were used in conjunction with modified beam theory (MBT), the compliance calibration (CC) method, and the modified compliance calibration (MCC) method. The Mode I interlaminar toughness (G(sub IC)) values for control specimens were higher than previously reported and are attributed to extensive fiber bridging during testing. The presence of adhesives with SMA inserts stabilized crack propagation during DCB testing. The results reveal a new phenomenon of SMA bridging, whereby crack propagation would switch from one side of the SMA insert to the other, thus increasing the load and G(sub IC) values of specimens containing SMA.

shape memory alloys↗

Effect of Thin-Film Adhesives on Mode II Interlaminar Fracture Toughness in Carbon Fiber Composites with Shape Memory Alloy Inserts

A single sheet of nickel-titanium (NiTi) shape memory alloy (SMA) was introduced within an IM7/8552 polymer matrix composite (PMC) panel in conjunction with multiple thin film adhesives to promote the interfacial bond strength between the SMA and PMC. End notched flexure (ENF) testing was performed in accordance to ASTM D7905 method for evaluation of mode II interlaminar fracture toughness (GIIC) of unidirectional fiber-reinforced polymer matrix composites. Acoustic emissions (AE) were monitored during testing with two acoustic sensors attached to the specimens. The composite panels were subjected to C-scan before testing, and examined using optical and scanning electron microscopy techniques after part failure. GIIC values for the control composite samples were found to be higher than those of samples with embedded SMA sheets. The presence of adhesives bonded to SMA sheets further diminished the GIIC values. AE values revealed poor bonding of the panels, with little to no signals during testing.

End Notched Flexure↗

MT29F512G08AUCBBH8-6IT:B NAND Flash Memory Total Ionizing Dose Test Report

The purpose of this test was to characterize the Micron 512 GB NAND (MT29F512G08AUCBBH8-6IT:B) flash memory parameter degradation for total dose response. In the test, the device was exposed to high dose rate (HDR) irradiations using gamma radiation. Device parameters such as leakage currents, quantity of upset bits and overall chip and die health were investigated.

TID↗