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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Composite power semiconductor avoids second breakdown and provides stable operation. It consists of an array of parallel-connected integrated circuits fabricated in a single chip. The output power device and associated low-level amplifier are closely coupled thermally, so that they have a predetermined temperature relationship.
Compact instrument, composed of integrated circuits and a temperature-sensitive platinum resistor, measures temperature over a wide dynamic range. Ultimate accuracy is limited by nonlinearity of the platinum resistor. With proper calibration and current regulation to within 0.01 percent, a measurement accuracy of 0.05 percent can be achieved.
Seven integrated circuits incorporated at very low cost into frequency counters and digital voltmeters performing a voltage-to-frequency conversion permit automatic range changing. Extra decades are switched into and out of the counting chain as a function of the counter during the previous counting period.
Curve generator capable of producing precisely repeatable curve for any single-valued function of voltage versus time uses digital approach, implemented by means of clocked feedback shift register, large scale integrated circuit diode matrix comprising about 12,000 diodes, counter, and digital-to-analog converter.
Qualification test program for digital monolithic integrated circuit devices
Analog voltage to duty generator design and fabrication based on four silicon integrated circuit chips in single package assembly
Solid state voltage controlled oscillator using two silicon integrated circuit chips and thin film resistor chip
Reliability engineering processes for custom metallized multigate integrated circuit array design
Custom metallized multigate integrated circuit array design
Wiring technique for spacecraft electronic equipment using integrated circuits
Parallel multiplier design with carry-save scheme and constructed from series integrated circuits, discussing speed, complexity and cost
Complementary metal oxide semiconductor and bipolar transistors fabrication on same integrated circuit chip by C-squared technology
Photochemical etching is most successful method for obtaining simulated microwave backscatter pattern from ocean surface. Process is adaptable to integrated circuit and thin film semiconductor fabrications. The attained horizontal resolution of 10 should improve with equipment refinement.
Infrared microscope instrument measures and plots the infrared profile of semiconductor chips, transistors and integrated circuits. Infrared analyses yields information on electrical and physical properties, enabling manufacturing improvements in semiconductor performance and reliability. Operational performance and main sections of the instrument are given.
Hybrid integrated circuit operational amplifiers, which have inherent characteristics of low quiescent power dissipation and extended operational lifetime with high reliability, are source for digital systems. Amplifiers are coupled to Zener reference diode in current control and buffer configuration.
Memory, with limited number of programming cycles, is achieved by using verticle, fusible links in series with oxide breakthrough elements. Memory elements are fabricated with integrated circuit technology and are ideal for low power digital computer application.
System with single, standard, wideband line transmits ten or more real time TV video data displays over hard wire to recorders more than 22.5 km from source. Digital logic and integrated circuits ensure high reliability and low maintenance. System is adaptable for video sampling applications.
Integrated circuits for digital applications in high dc noise systems