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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 919 records · Page 51
All sourcesNASA NTRSDOE OSTI
NASA NTRS1978

Laserfax

The photo shows an Associated Press technician receiving a photograph prepared by means of a high speed, high resolution facsimile system known as Laserfax, so called because it employs a laser beam to scan the photo being sent. Laser scanning data is converted to electrical signals and transmitted to news bureaus within the Associated Press network via microwave radio or telephone lines. At the other end, another laser sweeps reconverted imagery onto a special, light-sensitive, dry silver paper. The paper is then heat processed to reproduce the photograph. Manufactured by Harris Electronics Systems Inc., Melbourne, Florida, Laserfax incorporates NASA thermal control coating technology developed by Jet Propulsion Laboratory for use on spacecraft antennas; the coatings block absorption of solar radiation which would interfere with the antenna's proper operation. Harris Electronics Systems, originally Radiation, Inc., reused the NASA technology in development of Laserfax. A NASA technical support package provided information about the thermal properties that could be expected of various coatings for the facsimile system's paper rollers; this information served as a design base for the infrared heat source used in developing the photo. Although relatively new, Laserfax is in extensive service. It is manufactured in several models. One of them is the type used by the Associated Press, its news bureaus and affiliated newspapers, radio and television stations. Other models have been sold in large numbers to law enforcement agencies for transmitting high quality fingerprints and identification photos. Laserfax is also in service with the National Weather Service, which converts satellite imagery to weather photographs and relays them to local weather stations, television stations, newspapers and airlines.

Source record↗
NASA NTRS2004

Phytoplankton-Fluorescence-Lifetime Vertical Profiler

A battery-operated optoelectronic instrument is designed to be lowered into the ocean to measure the intensity and lifetime of fluorescence of chlorophyll A in marine phytoplankton as a function of depth from 0 to 300 m. Fluorescence lifetimes are especially useful as robust measures of photosynthetic productivity of phytoplankton and of physical and chemical mechanisms that affect photosynthesis. The knowledge of photosynthesis in phytoplankton gained by use of this and related instruments is expected to contribute to understanding of global processes that control the time-varying fluxes of carbon and associated biogenic elements in the ocean. The concentration of chlorophyll in the ocean presents a major detection challenge because in order to obtain accurate values of photosynthetic parameters, the intensity of light used to excite fluorescence must be kept very low so as not to disturb the photosynthetic system. Several innovations in fluorometric instrumentation were made in order to make it possible to reach the required low detection limit. These innovations include a highly efficient optical assembly with an integrated flow-through sample interface, and a high-gain, low-noise electronic detection subsystem. The instrument also incorporates means for self-calibration during operation, and electronic hardware and software for control, acquisition and analysis of data, and communications. The electronic circuitry is highly miniaturized and designed to minimize power demand. The instrument is housed in a package that can withstand the water pressure at the maximum depth of 300 m. A light-emitting diode excites fluorescence in the sample flow cell, which is placed at one focal point of an ellipsoidal reflector. A photomultiplier tube is placed at the other focal point. This optical arrangement enables highly efficient collection of fluorescence emitted over all polar directions. Fluorescence lifetime is measured indirectly, by use of a technique based on the same principle as the one described in "Fluorometer for Analysis of Photosynthesis in Phytoplankton" (SSC-00110), NASA Tech Briefs, Vol. 24, No. 1 (November 2000), page 79. The excitation is modulated at a frequency of 70 MHz, and the phase shift between the excitation light and the emitted fluorescence is measured by a detection method in which the 70 MHz signal is down-converted to a 400 Hz signal. The fluorescence lifetime can be computed from the known relationship among the fluorescence lifetime, phase shift, and modulation frequency

Fernandez, Salvador M.↗
NASA NTRS2003

High-Performance Solid-State W-Band Power Amplifiers

The figure shows one of four solid-state power amplifiers, each capable of generating an output power greater than or equal to 240 mW over one of four overlapping frequency bands from 71 to 106 GHz. (The bands are 71 to 84, 80 to 92, 88 to 99, and 89 to 106 GHz.) The amplifiers are designed for optimum performance at a temperature of 130 K. These amplifiers were developed specifically for incorporation into frequency-multiplier chains in local oscillators in a low-noise, far-infrared receiving instrument to be launched into outer space to make astrophysical observations. The designs of these amplifiers may also be of interest to designers and manufacturers of terrestrial W-band communication and radar systems. Each amplifier includes a set of six high-electron-mobility transistor (HEMT) GaAs monolithic microwave integrated-circuit (MMIC) chips, microstrip cavities, and other components packaged in a housing made from A-40 silicon-aluminum alloy. This alloy was chosen because, for the original intended spacecraft application, it offers an acceptable compromise among the partially competing requirements for high thermal conductivity, low mass, and low thermal expansion. Problems that were solved in designing the amplifiers included designing connectors and packages to fit the available space; designing microstrip signal-power splitters and combiners; matching of impedances across the frequency bands; matching of the electrical characteristics of those chips installed in parallel power-combining arms; control and levelling of output power across the bands; and designing the MMICs, microstrips, and microstrip cavities to suppress tendencies toward oscillation in several modes, both inside and outside the desired frequency bands.

Gaier, Todd↗
NASA NTRS2012

Ultra-Compact Motor Controller

This invention is an electronically commutated brushless motor contro ller that incorporates Hall-array sensing in a small, 42-gram packag e that provides 4096 absolute counts per motor revolution position s ensing. The unit is the size of a miniature hockey puck, and is a 44 -pin male connector that provides many I/O channels, including CANbus , RS-232 communications, general-purpose analog and digital I/O (GPI O), analog and digital Hall inputs, DC power input (18-90 VDC, 0-l0 A), three-phase motor outputs, and a strain gauge amplifier.

Townsend, William T.↗
DOE OSTI2024

Heterogeneous Integration Technologies for High-temperature, High-density, Low-profile Power Modules of Wide Bandgap Devices in Electric Drive Applications (Final Technical Report)

The goal of this project is to develop packaging technologies for making high-temperature, high-density, and low-profile wide-bandgap (WBG) power electronics modules for electric drives. These modules are aimed at enabling the DOE’s University Consortium to reach its 2025 inverter targets of ≥ 100 kW/L and ≤ 2.7 $/kW. The specific objectives are to: design and fabricate SiC half-bridge power modules with double-sided cooling and parasitic inductances < 5 nH, heat flux density > 400 W/cm 2 , and working junction temperature of 200 o C; design, fabricate, and deliver a gate driver with double-sided cooled modules for the construction of a 100 kW/L inverter at Oak Ridge National Lab; and design and prototype intelligent gate drivers with integrated current sensor and a low-profile DC-DC power supply with air-core transformer for testing power modules at 200 o C junction temperature. We followed an iterative technical approach of design, simulation, fabrication, and testing of various versions of modules, current sensors, and power supply. The state-of-the-art silicon carbide devices rated at 1.2 kV and 149 A were packaged by sintered-silver bonding on an aluminum nitride direct-bond-copper substrate for high thermal conductivity, high working temperature, and high joint reliability. Porous silver posts were used to interconnect the device’s source pads to the other direct-bond-copper substrate for low mechanical stresses, ease of manufacturing, and double-sided cooling. A current sensor based on package parasitic inductance was developed to measure switching current. A dynamic feedback scheme was developed to compensate the effect of parasitic resistance and temperature variation. A constant-current class-E dc-dc converter with air-core transformer was developed. Air-core transformer was used due to the unavailability of magnetic core at high temperatures. Gate driver and power supply were integrated with the double-side cooled, high temperature SiC power modules for testing the modules at 200 o C junction temperature. Double-pulse and continuous testing of the integrated technologies validated the design and fabrication of the three component technologies. Throughout the project, we overcame the challenge for design verification caused by low prototyping yield, which then helped train the graduate students, the future workforce, to learn the engineering know-how for low-cost manufacturing of reliable products. Below is a summary of the major accomplishments of this project: development of a prototyping process for fabricating double-side cooled (1200 V, 149 A) SiC phase-leg modules capable of working to 200 o C Tj; simulation and experimental verification of the improvement of thermo-mechanical reliability of the double-side cooled SiC phase-leg module by using rigid encapsulant; design and experimental validation of a current sensor based on package parasitic inductance and a compensation solution for eliminating the effect of parasitic resistance; design and experimental validation of a low-profile power supply with six-output air-core transformer for gate driver; functional demonstration of a SiC phase-leg module integrated with its gate driver, current sensor, and an air-core power supply at 200 o C Tj in a double-pulse switching test setup and Buck converter continuous test setup; successful completion of six PhD and two MS students who are or will work at Apple Inc., Tesla Inc., Wolfspeed Inc., Microchip Inc., Monolithic Power Systems Inc., and LG Magna Inc.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗
DOE OSTI2026

The Heterogeneous Integration of Electronic Components

Heterogeneous integration (HI) of electronics components is broadly recognized as a powerful and crucial enabler for the continued growth of computing and communication. From 2010 onwards, the value of HI is increasingly visible in the advanced packaging used in artificial intelligence, high-performance computing, smartphones and communications product implementations. In this Perspective, we argue that HI is crucial to semiconductors and more broadly to the continued evolution of computing and communications. We use leading-edge advanced packaging examples to represent the value, advancements and opportunities for HI. To succeed, it is critical to develop comprehensive HI roadmaps that inform collaborations across the design, manufacturing and reliability spectrum between systems architects, packaging and semiconductor technologists to common goals. Although this article does not provide a full roadmap, we instead detail additional parameters for artificial intelligence, smartphone and other cellular communication devices, and their constituent building blocks including interconnects, power electronics, photonics, thermal management, reliability, modelling and co-design, to foster greater collaboration opportunities among academia, research laboratories and industry.

42 ENGINEERING↗
NASA NTRS2003

Packaging Technology Designed, Fabricated, and Assembled for High-Temperature SiC Microsystems

A series of ceramic substrates and thick-film metalization-based prototype microsystem packages designed for silicon carbide (SiC) high-temperature microsystems have been developed for operation in 500 C harsh environments. These prototype packages were designed, fabricated, and assembled at the NASA Glenn Research Center. Both the electrical interconnection system and the die-attach scheme for this packaging system have been tested extensively at high temperatures. Printed circuit boards used to interconnect these chip-level packages and passive components also are being fabricated and tested. NASA space and aeronautical missions need harsh-environment, especially high-temperature, operable microsystems for probing the inner solar planets and for in situ monitoring and control of next-generation aeronautical engines. Various SiC high-temperature-operable microelectromechanical system (MEMS) sensors, actuators, and electronics have been demonstrated at temperatures as high as 600 C, but most of these devices were demonstrated only in the laboratory environment partially because systematic packaging technology for supporting these devices at temperatures of 500 C and beyond was not available. Thus, the development of a systematic high-temperature packaging technology is essential for both in situ testing and the commercialization of high-temperature SiC MEMS. Researchers at Glenn developed new prototype packages for high-temperature microsystems using ceramic substrates (aluminum nitride and 96- and 90-wt% aluminum oxides) and gold (Au) thick-film metalization. Packaging components, which include a thick-film metalization-based wirebond interconnection system and a low-electrical-resistance SiC die-attachment scheme, have been tested at temperatures up to 500 C. The interconnection system composed of Au thick-film printed wire and 1-mil Au wire bond was tested in 500 C oxidizing air with and without 50-mA direct current for over 5000 hr. The Au thick-film metalization-based wirebond electrical interconnection system was also tested in an extremely dynamic thermal environment to assess thermal reliability. The I-V curve1 of a SiC high-temperature diode was measured in oxidizing air at 500 C for 1000 hr to electrically test the Au thick-film material-based die-attach assembly.

Chen, Liang-Yu↗
NASA NTRS2005

The Mars SEIS Experiment: A Mars Seismic Package

The Mars SEIS experiment. The SEIS experiment was first proposed by IPGP (and accepted) for the NetLander mission. It integrates two VBB (Very Broad Band) seismometers, a three axis Short Period seismometer and a series of environmental sensors for pressure, infra-sounds and temperature. IPGP (France) has the overall responsibility of the experiment and is responsible for the seismic and environmental sensors. ETHZ (Switzerland) is responsible for the electronics of the experiment and JPL (USA) for the SP (Short Period) sensors. As NetLander mission has been cancelled (while fortunately the development still goes on), this seismic package can be proposed for future Mars missions.

Mimoun, D.↗
NASA NTRSDate not supplied

Harnessing the Digital Transformation for Development of Electrified Aircraft Propulsion Control Systems

Hybrid electric aircraft propulsion is an emerging technology that presents a variety of potential benefits along with technical integration challenges. Developing these new propulsion architectures with their complex control systems, and ultimately proving their benefit, is a multistep process that goes from concept, to analysis, to dynamic simulation, to hardware in the loop testing, to full scale testing and beyond. This effort is being revolutionized and indeed enabled by new digital tools that support the increasing technology readiness level throughout the maturation process. NASA has developed and made available a suite of digital tools that ease the path from concept to implementation. The three packages are the Toolbox for the Modeling and Analysis of Thermodynamic Systems (T-MATS), the Electrical Modeling and Thermal Analysis Toolbox (EMTAT), and the Thermal Systems Analysis Toolbox (TSAT). These tools are interactive, complementary, and compatible with each other. T-MATS is a modular thermodynamic modeling framework designed for creating custom component level models of jet engines. EMTAT is a modeling framework used to simulate a variety of power electronic devices, using both physics-based and power flow calculations. TSAT is a framework for modeling and analysis of dynamic heat transfer. These packages all consist of graphical, drag-and-drop, parameterizable building blocks representing various components of the system to be modeled, e.g., compressors, turbines, motors, energy storage devices, etc. They are designed to enable the user to model and simulate the end-to-end dynamic operation of a hybrid powertrain at the timescale of the turbomachinery, capturing mechanical, electrical, and thermal interactions. This paper will describe through multiple examples how these tools have been used successfully in several of the early stages of hybrid electric propulsion system development, from the initial system modeling to real-time interactive pilot-in-the-loop simulation to physical hardware-in-the-loop testing, each step bringing the technology closer to fruition.

Hybrid electric propulsion↗
NASA NTRSDate not supplied

Harnessing the Digital Transformation for Development of Hybrid Electric Aircraft Propulsion Control Systems

Hybrid electric aircraft propulsion is an emerging technology that presents a variety of potential benefits along with technical integration challenges. Developing these new propulsion architectures with their complex control systems, and ultimately proving their benefit, is a multistep process that goes from concept, to analysis, to dynamic simulation, to hardware in the loop testing, to full scale testing and beyond. This effort is being revolutionized and indeed enabled by new digital tools that support the increasing technology readiness level throughout the maturation process. NASA has developed and made available a suite of digital tools that ease the path from concept to implementation. The three packages are the Toolbox for the Modeling and Analysis of Thermodynamic Systems (T-MATS), the Electrical Modeling and Thermal Analysis Toolbox (EMTAT), and the Thermal Systems Analysis Toolbox (TSAT). These tools are interactive, complementary, and compatible with each other. T-MATS is a modular thermodynamic modeling framework designed for creating custom component level models of jet engines. EMTAT is a modeling framework used to simulate a variety of power electronic devices, using both physics-based and power flow calculations. TSAT is a framework for modeling and analysis of dynamic heat transfer. These packages all consist of graphical, drag-and-drop, parameterizable building blocks representing various components of the system to be modeled, e.g., compressors, turbines, motors, energy storage devices, etc. They are designed to enable the user to model and simulate the end-to-end dynamic operation of a hybrid powertrain at the timescale of the turbomachinery, capturing mechanical, electrical, and thermal interactions. This paper will describe through multiple examples how these tools have been used successfully in several of the early stages of hybrid electric propulsion system development, from the initial system modeling to real-time interactive pilot-in-the-loop simulation to physical hardware-in-the-loop testing, each step bringing the technology closer to fruition.

Electrified Propulsion↗
NASA NTRS2023

Harnessing the Digital Transformation for Development of Electrified Aircraft Propulsion Control Systems

Hybrid electric aircraft propulsion is an emerging technology that presents a variety of potential benefits along with technical integration challenges. Developing these new propulsion architectures with their complex control systems, and ultimately proving their benefit, is a multistep process. This process includes concept development and analysis, dynamic simulation, hardware-in-the-loop testing, full-scale testing, and so on. This effort is being revolutionized and indeed enabled by new digital tools that support increasing the technology readiness level throughout the maturation process. As part of this Digital Transformation, NASA has developed a suite of publicly available digital tools that facilitate the path from concept to implementation. This paper describes the NASA-developed tools and puts them in the context of control system development for hybrid electric aircraft propulsion. The three MATLAB®-based software packages are the Toolbox for the Modeling and Analysis of Thermodynamic Systems (T-MATS), the Electrical Modeling and Thermal Analysis Toolbox (EMTAT), and the Thermal Systems Analysis Toolbox (TSAT). These tools are interactive, complementary, and compatible with each other. T-MATS is a modular thermodynamic modeling framework designed for creating custom component level models of jet engines. EMTAT is a modeling framework used to simulate a variety of power electronic devices, using both physics-based and power flow calculations. TSAT is a framework for modeling and analysis of dynamic heat transfer. These packages all consist of graphical, drag-and-drop, parameterizable building blocks representing various components of the system to be modeled, e.g., compressors, turbines, motors, energy storage devices, etc. They are designed to enable the user to model and simulate the end-to-end dynamic operation of a hybrid electric gas turbine engine powertrain at the timescale of the turbomachinery, capturing mechanical, electrical, and thermal interactions. This paper demonstrates through multiple examples how these tools have been used successfully in a variety of applications, including several of the early stages of hybrid electric gas turbine engine propulsion system development, from the initial system modeling to real-time interactive pilot-in-the-loop simulation to physical hardware-in-the-loop testing, each step bringing the technology closer to fruition.

hybrid electric propulsion↗
DOE OSTI2024

SMATool: Strength of materials analysis toolkit

The study of the strength of materials is a cornerstone in material science and engineering, playing a critical role in shaping the progress and application of materials in diverse industrial sectors. The strength of a material is meticulously examined to understand the behavior of the material under different stress conditions and environments, thereby guiding material selection and structural design. Herein, we introduce the SMATool, a computational toolkit for the efficient calculation and analysis of material strength at both zero and finite temperatures for 3D, 2D, 1D, and tubular 2D-based nanostructures and nanotubes, as well as 1D nanoribbons. The toolkit is capable of calculating tensile, shear, ultimate, yield, and indentation (Vickers' hardness) strengths in various dimensions, as well as the energy storage capacity. We conducted several calculations both at zero and finite temperatures to validate the accuracy and reliability of the developed software. Here, the results show that the SMATool package provides accurate predictions that align with existing data on material strength. SMATool integrates seamlessly with widely used electronic structure codes like VASP and Quantum Espresso, providing a user-friendly interface catering to academic researchers and industry professionals.

36 MATERIALS SCIENCE↗
DOE OSTI2021

A perspective on the electro-thermal co-design of ultra-wide bandgap lateral devices

Fundamental research and development of ultra-wide bandgap (UWBG) semiconductor devices are under way to realize next-generation power conversion and wireless communication systems. Devices based on aluminum gallium nitride (AlxGa1-xN, x is the Al composition), ..beta..-phase gallium oxide (..beta..-Ga2O3), and diamond give promise to the development of power switching devices and radio frequency power amplifiers with higher performance and efficiency than commercial wide bandgap semiconductor devices based on gallium nitride (GaN) and silicon carbide (SiC). However, one of the most critical challenges for the successful deployment of UWBG device technologies is to overcome adverse thermal effects that impact the device performance and reliability. Overheating of UWBG devices originates from the projected high power density operation and poor intrinsic thermal properties of AlxGa1-xN and ..beta..-Ga2O3. This Perspective delineates the need and process for the "electro-thermal co-design" of laterally configured UWBG electronic devices and provides a comprehensive review of current state-of-the-art thermal characterization methods, device thermal modeling practices, and both device- and package-level thermal management solutions.

71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSIC↗
DOE OSTI2024

Multiphysics modeling of accelerators through code integration

This work aims to improve the ability of particle accelerator researchers to develop high-performance accelerator cavity designs by creating an overall multiphysics framework that integrates and couples existing application codes. This framework will allow accelerator researchers to build multiphysics models that will optimize cavity design, improve understanding of whole-device performance, and reduce the development and fabrication costs of accelerator research. We utilize the open-source VizSchema data standard as an intermediate data structure interface layer to standardize interfaces between individual application codes. VizScema is extensively documented online, and plugins for VizSchema are available for popular visualization packages, including VisIt and ParaView. Currently, the work focuses on coupling the EM field solver COMSOL and the electron gun code MICHELLE to allow COMSOL field-solve results to be seamlessly used by MICHELLE for particle-solve. Later work will extend this integration to include other fields, particles, and thermodynamics simulation codes.

43 PARTICLE ACCELERATORS↗
NASA NTRS1969

Folded stick module

Integrated circuit modules can be compactly assembled into short-run complex electronic assemblies by mounting them on a Stick module. This module provides a method of high-density packaging for industrial operations that require the fabrication of compact circuitry configurations.

Katzin, L.↗
NASA NTRS1977

A condensed form of NASTRAN

The Interactive Graphics Finite Element System, IGFES, is described along with its supporting analysis software, graphics terminal support package and hardware configurations. IGFES provides an interactive design tool for structural engineers via pre- and postprocessing of finite element data. The system currently runs on an IBM 360/44 OS-MFT system or a PDP 11/40 DOS/BATCH system. Graphics devices are supported using an inhouse developed, device independent terminal support package. Support is available for the Calcomp 563 drum plotter, Tektronix 4002A storage display terminal and the Lundy Electronics 20 inch standalone refresh display system. IGFES and its associated systems are written in FORTRAN IV.

Rogers, J. L., Jr.↗
NASA NTRS1978

Electrical Prototype Power Processor for the 30-cm Mercury electric propulsion engine

An Electrical Prototpye Power Processor has been designed to the latest electrical and performance requirements for a flight-type 30-cm ion engine and includes all the necessary power, command, telemetry and control interfaces for a typical electric propulsion subsystem. The power processor was configured into seven separate mechanical modules that would allow subassembly fabrication, test and integration into a complete power processor unit assembly. The conceptual mechanical packaging of the electrical prototype power processor unit demonstrated the relative location of power, high voltage and control electronic components to minimize electrical interactions and to provide adequate thermal control in a vacuum environment. Thermal control was accomplished with a heat pipe simulator attached to the base of the modules.

Biess, J. J.↗
NASA NTRS1992

Interim report on the analysis of the microwave power module

The results of a traveling wave tube multistage depressed collector (TWT-MDC) design study in support of the DARPA/DoD Microwave Power Module (MPM) Program are described. The study stressed the MDC as a key element in obtaining the required high overall efficiencies in the MPM application. The results showed that an efficient MDC, utilizing conventional design and fabrication techniques can be designed for the first generation MPM TWT, which permits a package one wavelength thick (.66 in. at 18 GHz). The overall TWT efficiency goal of 40 percent for electronic countermeasure (ECM) applications appears to be readily achievable. However, the 50 percent goal for radar applications presents a considerable challenge.

Ramins, Peter↗