Measurements of total hemispherical emittance for chromel and for alumel wires
Measurement of total hemispherical emittance for chromel and alumel thermocouple wires in inert atmosphere at high temperatures
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Measurement of total hemispherical emittance for chromel and alumel thermocouple wires in inert atmosphere at high temperatures
Development and characteristics of device for deployment of long wires as method of reducing hazards due to lightning during spacecraft launches
Methods and procedures for evaluating, forming, and installing small diameter thermocouple wire and sheathed thermocouples
Two-wire IC pressure transducer bridge circuit performance features based on circuit analysis
Composition and composition inhomogeneity effects on plated wire memory elements strain sensitivity, considering tension and torsion sensitivities
Shielded fine wire probe for total temperature rapid measurement in high speed flows, discussing construction and theoretical considerations
Nozzle wall hypersonic turbulent boundary layers at free stream Mach number, using pitot, hot wire, wall pressure fluctuation and static pressure measurements
Incompressible planar fluid flow magnitude, direction and turbulent shear stress measurement by hot-wire anemometer
Pressure, subcooling and diameter effects on heat transfer and circumferencial flow transition of thin wire film boiling of liquid nitrogen in pool
Heat transfer from incandescent platinum wires in saturated liquid nitrogen, examining film boiling from atmospheric to critical pressure
Hot-wire anemometer remote operation, discussing coaxial cable length, terminal connection and bridge current
Performance analysis was made of oscillating hot-wire anemometer electrical output in gas stream. Advantages include no calibration and measurement of fluid direction as well as fluid speed.
Thermal probe using infrared-transparent optical fiber attached to tip of collet with resin to prevent movement during bonding is used to accurately measure temperature during wire bonding on semiconductors for use in large scale integrated circuits.
The work performed entailed the design, development, construction and testing of a 4000 word by 18 bit random access, NDRO plated wire memory for use in conjunction with a spacecraft imput/output unit and central processing unit. The primary design parameters, in order of importance, were high reliability, low power, volume and weight. A single memory unit, referred to as a qualification model, was delivered.
Interconnecting wire harnesses defined in the design standard are considered, including type 4, open bundle (not enclosed). Knowledge gained through experience on the Saturn 5 program coupled with recent advances in techniques, materials, and processes was incorporated into the document.
The document covers interconnecting wire harnesses defined in the design standard, including type 6, enclosed in TFE heat shrink tubing; and type 7, flexible armored. Knowledge gained through experience on the Saturn 5 program coupled with recent advances in techniques, materials, and processes was incorporated into this document.
The document covers interconnecting wire harnesses defined in the design standard, including type 8, flat conductor cable. Volume breadth covers installations of groups of harnesses in a major assembly and the associated post installation inspections and electrical tests. Knowledge gained through experience on the Saturn 5 program coupled with recent advances in techniques, materials, and processes was incorporated into this document.
Results of investigations using X-ray diffraction and electron-beam microprobe techniques have shown that copper and Permalloy platings interdiffuse at low temperatures when plated-wire memory elements are annealed for times as short as 50 hr. Measurable interdiffusion between Permalloy platings and gold substrates does not occur in similar conditions. Both magnetic and compositional changes during aging are found to occur by a thermally activated process with activation energies around 38 kcal/mol. It is shown, however, that copper-diffusion and magnetic-dispersion changes during aging are merely concurrent processes, neither being the other's cause.