Spatial Distribution of Plasma Sheet Entropy Reduction Caused by a Plasma Bubble: Rice Convection Model Simulations
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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Study of boundary conditions at liquid-vapor interface through irreversible thermodynamics
Subcooling and gravity level effects investigated for water boiling at low heat flux from flat horizontal surface
Steady state mercury evaporation experiment to measure transport coefficient in liquid-vapor interface boundary condition study
Irreversible thermodynamics of liquid-vapor phase change process
Thermodynamic rate equations for boundary analysis at liquid-vapor interface of mercury
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Fabrication of integrated circuit chips to compensate for faulty memory elements is discussed. Procedure for testing chips to determine extent of redundancy and faults is described. Mathematical model to define operation is presented. Schematic circuit diagram of test equipment is provided.
The fabrication yield of an on-chip modifiable redundant circuit design for a 100M bit serial shift register is evaluated. The yield model is a redundancy design in which there is a primary loop and a set of secondary loops which can be enabled/disabled without introducing blanks to the data stream. This function has a finite yield, the loop-modification yield factor, which must be greater than 0.9 to make the system more economical than the simple nonredundant design. It is further established that small loop capacities greatly degrade the yield because of the effect of the modification yield factor, while large loop capacities degrade the yield because of defects in the operating area. As the modification yield increases the optimum loop capacity decreases. An optimum value for the number of redundant loops exists for each loop capacity. Other factors that affect the yield are the garnet film and the processed circuit.
Coil etched from conductive film has better field uniformity than wire-wound coils and less coil loss at high-frequency operation.