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At least 91 records · Page 5
All sourcesNASA NTRSDOE OSTI
NASA NTRS1984

Dynamic dielectric characterization of thermosets and thermoplastics using intrinsic variables

Dynamic dielectric analysis has been used to study curing polymer systems and thermoplastics. Measurements have been made over a frequency range of six decades. The data are analyzed in terms of capacitance, conductance, dissipation, complex permittivity, and conductivity (sigma). Complex permittivity and sigma are properties which are characteristic of the cure state of the material and independent of the size of the sample. LARC-160, PMR-15, NARMCO 5208, Epon and UDEL-P1700 have been studied. The experimental results suggest that when ionic processes dominate the dielectric response, the intensive property sigma is a good monitor of the resin's viscosity.

Kranbuehl, D. E.↗
NASA NTRS1989

Chemoviscosity modeling for thermosetting resin systems, 4

An experimental study on the changes of chemorheological properties has been conducted and analyzed on commercial Hercules 3501-6 resin system cured under several isothermal conditions between 375 and 435 K. For the cure temperatures equal to or greater than 385 K, the storage modulus curing curves, G prime (t), exhibited abrupt changes in slope which occurred at various times depending on the curing temperatures and were attributed to the onset of gelation reactions. The crossover points between G prime (t) and G double prime (t) curves were observed for curing temperatures equal to or greater than 400 K. The gelation and the crossover points obtained from the chemorheological measurements, therefore, defined two characteristic resin states during cure. Approximately the same value for the degree of cure was reached by the advancement of the reaction at each of these states. The temperature dependency of the viscosities for the characteristic resin states and the rate constants of increase in moduli at different stages of curing were analyzed. Various G prime (t) and G double prime (t) isothermal curing curves were also shown to be capable of being superimposed on one another by the principle of time-temperature superposition. The resultant shift factors a sub t(t) and a Eta(T) were shown to follow the Arrhenius type relationship. Values of the activation energy suggested that the reaction kinetics, instead of the diffusion mechanism, was the limiting step in the overall resin advancement for the cure at temperatures equal to or greater than 385 K.

Hou, T. H.↗
NASA NTRS1989

A predictive model for failure properties of thermoset resins

A predictive model for the three-dimensional failure behavior of engineering polymers has been developed in a recent NASA-sponsored research program. This model acknowledges the underlying molecular deformation mechanisms and thus accounts for the effects of different chemical compositions, crosslink density, functionality of the curing agent, etc., on the complete nonlinear stress-strain response including yield. The material parameters required by the model can be determined from test-tube quantities of a new resin in only a few days. Thus, we can obtain a first-order prediction of the applicability of a new resin for an advanced aerospace application without synthesizing the large quantities of material needed for failure testing. This technology will effect order-of-magnitude reductions in the time and expense required to develop new engineering polymers.

Caruthers, James M.↗
NASA NTRS1988

Frequency-dependent dielectric analysis - Monitoring the chemistry and rheology of thermosets during cure

Frequency-dependent dielectric measurements in a curing resin sample were performed using an impedance analyzer and a permittivity sensor, to separate and measure the ionic (sigma) and dipolar (tau) mobilities, used as molecular probes of the cure reaction in the resin. The resin samples were tetraglycidyl 4,4-prime-diaminodiphenylmethane epoxy resins which included catalyzed (Hercules 3501-6) and uncatalyzed l3502 resin samples. The values of sigma and tau were used to quantitatively determine the viscosity, the degree of cure, and the T(g) of the resin. It is shown that the values of the Arrhenius and WLF constants during the cure process reflect the buildup of the crosslink network.

Kranbuehl, D.↗
NASA NTRS1990

Additives to reduce susceptibility of thermosets and thermoplastics to erosion from atomic oxygen

Polymeric materials have many attractive features such as light weight, high strength, and broad applicability in the form of films, fibers, and molded objects. In low earth orbit (LEO), these materials, when exposed on the exterior of the spacecraft, have the serious disadvantage of being susceptible to erosion by atomic oxygen (AO). AO is the most common chemical species at LEO altitudes. AO can be an extremely efficient oxidizing agent as was apparent from the extensive erosion of organic films exposed in STS missions. The mechanism for erosion involves the reaction of oxygen atoms at the surface of the substrate to form small molecular species. The susceptibility of polymeric materials varies with their chemical composition. Films with silicon atoms incorporated in the molecular structures have large coefficients of thermal expansion. This limits their utility. In an alternative approach additives were sought that mix physically and form a protective oxide layer when the film is exposed to AO. A large number of organic compounds containing silicon, germanium, or tin atoms were screened. Most were found to have very limited solubility in the polyetherimide (Ultem) films that were being protected from AO. However, one, bis(triphenyl tin) oxide, (BTO), is miscible in Ultem up to about 25 percent. Films of Ultem polyimide containing up to 25 wt percent BTO were prepared by evaporation of solvent from a solution of Ultem and BTO. The effects of AO on these films were simulated in the oxygen atmosphere of a radio frequency glow-discharge chamber. In the second part of this study, atoms were incorporated in epoxy resins. Experiments are in progress to measure the resistance of films of the cured epoxy to AO in the discharge chamber.

Orwoll, Robert A.↗
NASA NTRS1992

Environmental effects on the compressive properties - Thermosetting vs. thermoplastic composites

The influence of moisture and temperature on the compressive properties of graphite/epoxy and APC-2 materials systems was investigated to assess the viability of using APC-2 instead of graphite/epoxy. Data obtained indicate that the moisture absorption rate of T-300/epoxy is higher than that of APC-2. Thick plate with smaller surface area absorbs less moisture than thin plate with larger surface area. The compressive strength and modulus of APC-2 are higher than those of T-300/epoxy composite, and APC-2 sustains higher compressive strength in the presence of moisture. The compressive strength and modulus decrease with the increase of temperature in the range of 23-100 C. The compression failure was in the form of delamination, interlaminar shear, and end brooming.

Haque, A.↗
NASA NTRS1991

Addition Curing Thermosets Endcapped with 4-Amino (2.2) Paracyclophane

A new family of addition curing polyimides were prepared that contained 4-amino (2.2)-paracyclophane as the endcap. An improved synthesis of the endcap 4-amino-(2.2) cyclophane was accomplished increasing the yield to 60 percent and simplifying the procedure. DSC and rheological analysis of endcapped polyimide oligomers confirmed that the onset for polymerization of the ethylene bridge was 250 C. C-13 CP/MAS NMR was used to determine the structural changes of the oligomers after thermal treatment. The cyclophane capped polyimides were successfully compression molded to form void free neat resin specimens. Tg's as high as 353 C were obtained by thermomechanical analysis for postcured samples. Preliminary thermal stability studies suggest that these resins have a high onset of decomposition ranging from 549 to 567 C.

Waters, John F.↗
NASA NTRS1993

Toughened High-Temperature Thermoset Composites

Laminated composites of carbon fibers and either PMR-15 or LARC(TM)RP-46 polyimides toughened selectively by incorporating thin layers of Matrimid(TM) 5218 thermoplastic polyimide at interfaces between plies to form gradient semi-interpenetrating microstuctures. Toughening of composites accompanied by acceptably small decreases in strength and stiffness. Thick laminates of toughened composites fabricated easily at 500 psi. Materials useful in components of aircraft engines, where exposed to high temperatures for short times.

Johnston, Norman J.↗
NASA NTRS1992

Characterization of damage modes in impacted thermoset and thermoplastic composites

Composite materials remain extremely vulnerable to out-of-plane impact loads, which may lead to severe losses in strength and stiffness. Impact induced damage is often a complex mixture of transverse cracks, delaminations and fiber failures. An experimental investigation was undertaken to quantify damage tolerance and resistance in composite materials impacted using the drop-weight method. Tests were conducted on laminates of several different carbon-fiber composite systems such as epoxies, modified epoxies, and amorphous and semicrystalline thermoplastics. In this paper, impacted composite specimens have been examined using destructive and nondestructive techniques to establish the characteristic damage states. Specifically, optical microscopy, ultrasonic and scanning electron microscopy techniques have been used to identify impact induced damage mechanisms. Damage propagation during post impact compression was also studied.

Srinivasan, K.↗
NASA NTRS1994

Damage tolerance of candidate thermoset composites for use on single stage to orbit vehicles

Four fiber/resin systems were compared for resistance to damage and damage tolerance. One toughened epoxy and three toughened bismaleimide (BMI) resins were used, all with IM7 carbon fiber reinforcement. A statistical design of experiments technique was used to evaluate the effects of impact energy, specimen thickness, and impactor diameter on the damage area, as computed by C-scans, and residual compression-after-impact (CAI) strength. Results showed that two of the BMI systems sustained relatively large damage zones yet had an excellent retention of CAI strength.

Nettles, A. T.↗
NASA NTRS1999

Low-Cost, High Glass-Transition Temperature, Thermosetting Polyimide Developed

PMR-15 polyimide, developed in the mid-1970's at the NASA Lewis Research Center, is recognized as a state-of-the-art high-temperature resin for composite applications in the temperature range of 500 to 550 F (260 to 288 C). PMR-15 offers easy processing and good property retention at a reasonable cost. For these reasons, it is widely used in both military and commercial aircraft engine components. Traditionally, polyimide composites have been designed for long-term use at 500 to 600 F over thousands of hours. However, new applications in reusable launch vehicles (RLV's) require lightweight materials that can perform for short times (tens of hours) at temperatures between 800 and 1000 F (425 and 538 C). Current efforts at Lewis are focused on raising the use temperature of polyimide composites by increasing the glass-transition temperature of the matrix resins. Achieving this dramatic increase in the upper use temperature without sacrificing polymer and composite processability is a major technical challenge.

Chuang, Kathy C.↗
NASA NTRS2004

Liquid-Crystal Thermosets, a New Generation of High-Performance Liquid-Crystal Polymers

One of the major challenges for NASA's next-generation reusable-launch-vehicle (RLV) program is the design of a cryogenic lightweight composite fuel tank. Potential matrix resin systems need to exhibit a low coefficient of thermal expansion (CTE), good mechanical strength, and excellent barrier properties at cryogenic temperatures under load. In addition, the resin system needs to be processable by a variety of non-autoclavable techniques, such as vacuum-bag curing, resin-transfer molding (RTM), vacuum-assisted resin-transfer molding (VaRTM), resin-film infusion (RFI), pultrusion, and advanced tow placement (ATP). To meet these requirements, the Advanced Materials and Processing Branch (AMPB) at NASA Langley Research Center developed a new family of wholly aromatic liquid-crystal oligomers that can be processed and thermally cross-linked while maintaining their liquid-crystal order. All the monomers were polymerized in the presence of a cross-linkable unit by use of an environmentally benign melt-condensation technique. This method does not require hazardous solvents, and the only side product is acetic acid. The final product can be obtained as a powder or granulate and has an infinite shelf life. The obtained oligomers melt into a nematic phase and do not exhibit isotropization temperatures greater than the temperatures of decomposition (Ti > T(sub dec)). Three aromatic formulations were designed and tested and included esters, ester-amides, and ester-imides. One of the major advantages of this invention, named LaRC-LCR or Langley Research Center-Liquid Crystal Resin, is the ability to control a variety of resin characteristics, such as melting temperature, viscosity, and the cross-link density of the final part. Depending on the formulation, oligomers can be prepared with melt viscosities in the range of 10-10,000 poise (100 rad/s), which can easily be melt-processed using a variety of composite-processing techniques. This capability provides NASA with custom-made matrix resins that meet the required processing conditions for the fabrication of textile composites. Once the resin is in place, the temperature is raised to 375 C and the oligomers are cross-linked into a high-glass-transition-temperature (Tg) nematic network without releasing volatiles. The mechanical properties of the fully crosslinked, composite articles are comparable to typical composites based on commercially available epoxy resins.

Dingemans, Theo↗
NASA NTRS2016

Challenges in Laser Sintering of Melt-Processable Thermoset Imide Resin

Polymer Laser Sintering (LS) is an additive manufacturing technique that builds 3D models layer by layer using a laser to selectively melt cross sections in powdered polymeric materials, following sequential slices of the CAD model. LS generally uses thermoplastic polymeric powders, such as polyamides (i.e. Nylon), and the resultant 3D objects are often weaker in their strength compared to traditionally processed materials, due to the lack of polymer inter-chain connection in the z-direction. The objective of this project is to investigate the possibility of printing a melt-processable RTM370 imide resin powder terminated with reactive phenylethynyl groups by LS, followed by a postcure in order to promote additional crosslinking to achieve higher temperature (250-300 C) capability. A preliminary study to build tensile specimens by LS and the corresponding DSC and rheology study of RTM370 during LS process is presented.

Additive Manufacturing↗
NASA NTRS2016

Challenges in Laser Sintering of Thermoset Imide Resin

Polymer Laser Sintering (LS) is an additive manufacturing technique that builds 3D models layer by layer using a laser to selectively melt cross sections in powdered polymeric materials, following sequential slices of the CAD model. LS generally uses thermoplastic polymeric powders, such as polyamides (i.e. Nylon), and the resultant 3D objects are often weaker in their strength compared to traditionally processed materials, due to the lack of polymer inter-chain connection in the z-direction. The objective of this project is to investigate the possibility of printing a melt-processable RTM370 imide resin powder terminated with reactive phenylethynyl groups by LS, followed by a postcure in order to promote additional crosslinking to achieve higher temperature (250-300 C) capability. A preliminary study to build tensile specimens by LS and the corresponding DSC and rheology study of RTM370 during LS process is presented.

Additive Manufacturing↗
NASA NTRSDate not supplied

Latent Cure Epoxy Matrix Resins for Reliable Assembly of Thermoset Composite Structures

Polymer matrix composites are used in high performance structures because of their excellent specific strength, toughness, and stiffness. To realize their full potential, complex composite structures must be assembled with adhesive, but uncertainty in bond performance often requires manufacturers to install bolts or other crack-arrest features to ensure safety in critical applications.1 The inherent uncertainty in adhesive bonds stems from the material discontinuity at the composite-to-adhesive interfaces, which are susceptible to contamination and other causes of inter-facial weakness.2 In contrast, co-cured composites, although limited in size and complexity, result in predictable structures that may be certifiable for commercial aviation with reduced dependence on redundant load paths.1 The technology proposed here uses a stoichiometric offset of the hardener-to-epoxy ratio on the faying surfaces of epoxy compo-site laminates. Assembly of the components in a subsequent “secondary co-cure” process results in a joint with no material discontinuities (Figure 1)

Frank L. Palmieri↗
NASA NTRSDate not supplied

In-situ Lunar Launch and Landing Pad Construction with Regolith-Thermoset Polymer Composite Materials

Lunar launch and landing pads are necessary to mitigate risks to lander/ascent vehicles and surrounding surface assets from rocket plume ejected regolith. The current state of the art of landing and launching from the lunar surface is to land/launch on unprepared regolith surfaces. Significant risks exist for the larger landers proposed for the Artemis Program due to higher thrust levels leading to increased ejecta and cratering, presence of co-located assets in the ejecta path, and potential strict surface levelness requirements for tall vehicles.

Launch Pad↗