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Results for “resistive heating”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 91 records · Page 5
All sourcesNASA NTRSDOE OSTI
DOE OSTI2022

Heat-resistant aluminium alloys

Scandium added to Al–Cu–Mg–Ag alloys leads to an in situ phase transformation of coherent Cu-rich nanoprecipitates at elevated temperature, with Sc atoms diffusing and occupying their interstitial sites. Notably, the transformed nanoprecipitates have enhanced thermal stability while maintaining a large volume fraction and these two microstructural features enable high tensile strength of the Al alloy with creep resistance up to 400 °C.

36 MATERIALS SCIENCE↗
NASA NTRS1967

Resistance heating releases structural adhesive

Composite adhesive package bonds components together for testing and enables separation when testing is completed. The composite of adhesives, insulation and a heating element separate easily when an electrical current is applied.

Glemser, N. N.↗
NASA NTRS1971

Dry-heat Resistance of Bacillus Subtilis Var. Niger Spores on Mated Surfaces

Bacillus subtilis var. niger spores were placed on the surfaces of test coupons manufactured from typical spacecraft materials including stainless steel, magnesium, titanium, and aluminum. These coupons were then juxtaposed at the inoculated surfaces and subjected to test pressures of 0, 1000, 5000, and 10,000 psi. Tests were conducted in ambient, nitrogen, and helium atmospheres. While under the test pressure condition, the spores were exposed to 125 C for intervals of 5, 10, 20, 50, or 80 min. Survivor data were subjected to a linear regression analysis that calculated decimal reduction times.

Simko, G. J.↗
NASA NTRS1973

HNS/Teflon, a new heat resistant explosive

HNS/Teflon (90/10) is a new pressed explosive developed for use in the Apollo program. The major advantages of HNS/Teflon are (1) excellent thermal stability at elevated temperatures, (2) superior resistance to sublimation at high temperatures and low pressures and (3) ease of molding powder preparation, pressing and machining. The impact sensitivity of HNS/Teflon is between that of Comp B and Comp A-3 while its explosive performance is about the same as TNT. Under the severe environmental conditions of the moon's surface, this explosive successfully performed its intended function of generating seismic waves in the Apollo ALSEP and LSPE experiments. (Modified author abstract)

Heller, H.↗
NASA NTRS1973

Heat-resistant polymers containing bipyridyl units. II Polyamide-imides

Polyamide-amic acids containing bipyridyl units were prepared by polymerization of various bipyridyl diamines with trimellitic anhydride acid chloride. These polymers were converted to polyamide-imides by thermal cyclization. The resulting polyamide-imides exhibited very good solubility in organic solvents.

Kurita, K.↗
NASA NTRS1979

Heat resistant nontoxic laminate

Light-weight low-cost laminate used to replace epoxy compound panels is suitable for auto, railcar, and aircraft structural parts. Physical and thermal tests show panels made from formulation have better insulative properties, and burn cleaner with less toxic gas generation than panels made with conventional materials.

Kourtides, D. A.↗
NASA NTRS1978

Heat resistant polymers of oxidized styrylphosphine

Homopolymers, copolymers and terpolymers of a styrene based monomer are prepared by polymerizing at least one oxidized styrylphosphine monomer or by polymerizing p-diphenylphosphinestyrene and then oxidizing the polymerized monomer with an organoazide. Copolymers can also be prepared by copolymerizing styrene with at least one oxidized styrylphosphine monomer. Flame resistant vinyl based polymers whose degradation products are non toxic and non corrosive are obtained.

Paciorek, K. J. L.↗
NASA NTRS1980

Heat resistant polymers of oxidized styrylphosphine

A flame resistant, nontoxic polymer which may be used safely in confined locations where there is inadequate ventilation is prepared either by polymerizing compounds having the formula R-N=P(C6H5)2(C6H4)CH=CH2 where R is an organic moeity selected from the group of (C6H5)2P(O)-, (C6H5O)2P(O)-, (C6H5)2 C3N3-, or their mixtures, or by reacting a polymer with an organic azide such as diphenylphosphinylazide, diphenyl-phosphorylazide, 2-azido-4,6-diphenly-5-triazine, 2,4-diazido-6-phenyl-s-triazine, trimethylsilyoazide, triphenylsilylazine, and phenylazine. The reaction of the styrylphosphine with the organozaide results in the oxidation of the trivalent phosphorus atom to the pentavalent state in the form of an unsaturated P=N linkage known as a phosphazene group.

Paciorek, K. J. L.↗
NASA NTRS1985

Vapor pressure and evaporation rate of certain heat-resistant compounds in a vacuum at high temperatures

The vapor pressure and evaporation rate of borides of titanium, zirconium, and chrome; and of strontium and carbides of titanium, zirconium, and chrome, molybdenum silicide; and nitrides of titanium, niobium, and tantalum in a vacuum were studied. It is concluded that all subject compounds evaporate by molecular structures except AlB sub 12' which dissociates, losing the aluminum.

Bolgar, A. S.↗
NASA NTRS1987

Electrically Conductive, Heat-Resistant Paint

Improved, sprayable, thermal- and electrostatic-discharge-control coating for titanium possesses excellent adhesion and high resistance to both vibration and thermal shock. Coating is improved formulation of one described in "High-Temperature Coatings for Titanium" (NPO-16222).

Hribar, V. F.↗
NASA NTRS1987

Fire- and Heat-Resistant Laminating Resins

Imide compounds containing phosphourus thermally polymerized. New maleimido- or citraconimido-end-capped monomers, have relatively low melting temperatures, polymerized at moderate temperatures to rigid bisimide resins without elimination of volatiles. Monomers dissolve in such solvents as methyl ethyl ketone, acetone, and tetrahydrofuran, suitable and perferred as "varnish solvents" for composite fabrication. Low melting points of these componds allow use as adhesives without addition of solvents.

Kourtides, Demetrius A.↗