Engineering PapersSearch

SEARCH · Engineering Papers

Results for “power electronic packaging”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 91 records · Page 5

Electrical Prototype Power Processor for the 30-cm Mercury electric propulsion engine

An Electrical Prototpye Power Processor has been designed to the latest electrical and performance requirements for a flight-type 30-cm ion engine and includes all the necessary power, command, telemetry and control interfaces for a typical electric propulsion subsystem. The power processor was configured into seven separate mechanical modules that would allow subassembly fabrication, test and integration into a complete power processor unit assembly. The conceptual mechanical packaging of the electrical prototype power processor unit demonstrated the relative location of power, high voltage and control electronic components to minimize electrical interactions and to provide adequate thermal control in a vacuum environment. Thermal control was accomplished with a heat pipe simulator attached to the base of the modules.

Biess, J. J.

Fiber-optic three axis magnetometer prototype development

The goal of this research program was to develop a high sensitivity, fiber optic, interferometric, three-axis magnetometer for interplanetary spacecraft applications. Dynamics Technology, Inc. (DTI) has successfully integrated a low noise, high bandwidth interferometer with high sensitivity metallic glass transducers. Also, DTI has developed sophisticated signal processing electronics and complete data acquisition, filtering, and display software. The sensor was packaged in a compact, low power and weight unit which facilitates deployment. The magnetic field sensor had subgamma sensitivity and a dynamic range of 10(exp 5) gamma in a 10 Hz bandwidth. Furthermore, the vector instrument exhibited the lowest noise level when only one axis was in operation. A system noise level of 1 gamma rms was observed in a 1 Hz bandwidth. However, with the other two channels operating, the noise level increased by about one order of magnitude. Higher system noise was attributed to cross-channel interference among the dither fields.

Wang, Thomas D.

Phytoplankton-Fluorescence-Lifetime Vertical Profiler

A battery-operated optoelectronic instrument is designed to be lowered into the ocean to measure the intensity and lifetime of fluorescence of chlorophyll A in marine phytoplankton as a function of depth from 0 to 300 m. Fluorescence lifetimes are especially useful as robust measures of photosynthetic productivity of phytoplankton and of physical and chemical mechanisms that affect photosynthesis. The knowledge of photosynthesis in phytoplankton gained by use of this and related instruments is expected to contribute to understanding of global processes that control the time-varying fluxes of carbon and associated biogenic elements in the ocean. The concentration of chlorophyll in the ocean presents a major detection challenge because in order to obtain accurate values of photosynthetic parameters, the intensity of light used to excite fluorescence must be kept very low so as not to disturb the photosynthetic system. Several innovations in fluorometric instrumentation were made in order to make it possible to reach the required low detection limit. These innovations include a highly efficient optical assembly with an integrated flow-through sample interface, and a high-gain, low-noise electronic detection subsystem. The instrument also incorporates means for self-calibration during operation, and electronic hardware and software for control, acquisition and analysis of data, and communications. The electronic circuitry is highly miniaturized and designed to minimize power demand. The instrument is housed in a package that can withstand the water pressure at the maximum depth of 300 m. A light-emitting diode excites fluorescence in the sample flow cell, which is placed at one focal point of an ellipsoidal reflector. A photomultiplier tube is placed at the other focal point. This optical arrangement enables highly efficient collection of fluorescence emitted over all polar directions. Fluorescence lifetime is measured indirectly, by use of a technique based on the same principle as the one described in "Fluorometer for Analysis of Photosynthesis in Phytoplankton" (SSC-00110), NASA Tech Briefs, Vol. 24, No. 1 (November 2000), page 79. The excitation is modulated at a frequency of 70 MHz, and the phase shift between the excitation light and the emitted fluorescence is measured by a detection method in which the 70 MHz signal is down-converted to a 400 Hz signal. The fluorescence lifetime can be computed from the known relationship among the fluorescence lifetime, phase shift, and modulation frequency

Fernandez, Salvador M.

AIN-Coated Al(2)O(3) Substrates For Electronic Circuits

Type of improved ceramic substrate for high-frequency, high-power electronic circuits combines relatively high thermal conductivity of aluminum nitride with surface smoothness of alumina. Consists of 15-micrometer layer of AIN deposited on highly polished alumina. Used for packaging millimeter-wave gallium arsenide transmitter chips, power silicon chips, and like.

Kolawa, Elzbieta

Packaging printed circuit boards: A production application of interactive graphics

The structure and use of an Interactive Graphics Packaging Program (IGPP), conceived to apply computer graphics to the design of packaging electronic circuits onto printed circuit boards (PCB), were described. The intent was to combine the data storage and manipulative power of the computer with the imaginative, intuitive power of a human designer. The hardware includes a CDC 6400 computer and two CDC 777 terminals with CRT screens, light pens, and keyboards. The program is written in FORTRAN 4 extended with the exception of a few functions coded in COMPASS (assembly language). The IGPP performs four major functions for the designer: (1) data input and display, (2) component placement (automatic or manual), (3) conductor path routing (automatic or manual), and (4) data output. The most complex PCB packaged to date measured 16.5 cm by 19 cm and contained 380 components, two layers of ground planes and four layers of conductors mixed with ground planes.

Perrill, W. A.

Installation package for integrated programmable electronic controller and hydronic subsystem - solar heating and cooling

A description is given of the Installation, Operation, and Maintenance Manual and information on the power panel and programmable microprocessor, a hydronic solar pump system and a hydronic heating hot water pumping system. These systems are integrated into various configurations for usages in solar energy management, control and monitoring, lighting control, data logging and other solar related applications.

Source record

Heterogeneous Integration Technologies for High-temperature, High-density, Low-profile Power Modules of Wide Bandgap Devices in Electric Drive Applications (Final Technical Report)

The goal of this project is to develop packaging technologies for making high-temperature, high-density, and low-profile wide-bandgap (WBG) power electronics modules for electric drives. These modules are aimed at enabling the DOE’s University Consortium to reach its 2025 inverter targets of ≥ 100 kW/L and ≤ 2.7 $/kW. The specific objectives are to: design and fabricate SiC half-bridge power modules with double-sided cooling and parasitic inductances < 5 nH, heat flux density > 400 W/cm 2 , and working junction temperature of 200 o C; design, fabricate, and deliver a gate driver with double-sided cooled modules for the construction of a 100 kW/L inverter at Oak Ridge National Lab; and design and prototype intelligent gate drivers with integrated current sensor and a low-profile DC-DC power supply with air-core transformer for testing power modules at 200 o C junction temperature. We followed an iterative technical approach of design, simulation, fabrication, and testing of various versions of modules, current sensors, and power supply. The state-of-the-art silicon carbide devices rated at 1.2 kV and 149 A were packaged by sintered-silver bonding on an aluminum nitride direct-bond-copper substrate for high thermal conductivity, high working temperature, and high joint reliability. Porous silver posts were used to interconnect the device’s source pads to the other direct-bond-copper substrate for low mechanical stresses, ease of manufacturing, and double-sided cooling. A current sensor based on package parasitic inductance was developed to measure switching current. A dynamic feedback scheme was developed to compensate the effect of parasitic resistance and temperature variation. A constant-current class-E dc-dc converter with air-core transformer was developed. Air-core transformer was used due to the unavailability of magnetic core at high temperatures. Gate driver and power supply were integrated with the double-side cooled, high temperature SiC power modules for testing the modules at 200 o C junction temperature. Double-pulse and continuous testing of the integrated technologies validated the design and fabrication of the three component technologies. Throughout the project, we overcame the challenge for design verification caused by low prototyping yield, which then helped train the graduate students, the future workforce, to learn the engineering know-how for low-cost manufacturing of reliable products. Below is a summary of the major accomplishments of this project: development of a prototyping process for fabricating double-side cooled (1200 V, 149 A) SiC phase-leg modules capable of working to 200 o C Tj; simulation and experimental verification of the improvement of thermo-mechanical reliability of the double-side cooled SiC phase-leg module by using rigid encapsulant; design and experimental validation of a current sensor based on package parasitic inductance and a compensation solution for eliminating the effect of parasitic resistance; design and experimental validation of a low-profile power supply with six-output air-core transformer for gate driver; functional demonstration of a SiC phase-leg module integrated with its gate driver, current sensor, and an air-core power supply at 200 o C Tj in a double-pulse switching test setup and Buck converter continuous test setup; successful completion of six PhD and two MS students who are or will work at Apple Inc., Tesla Inc., Wolfspeed Inc., Microchip Inc., Monolithic Power Systems Inc., and LG Magna Inc.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI

Pt/HTCC Alumina based Electronic Packaging System and Integration Processes for High Temperature Harsh Environment Applications

Electronic devices capable of operation at 500°C are required for long term Venus surface missions, as well as for in situ monitoring and control of next generation aeronautical engines. High temperature sensors and electronics can also find many applications in military, and energy and automobile industries. Various silicon carbide (SiC) sensors and electronic devices have been developed for operation at 500 °C, and a compatible packaging system is needed for long term test and deployment of these high temperature devices. High temperature co-fired ceramics (HTCC) alumina with platinum (Pt) conductor was proposed for high temperature electronic packaging. A prototype Pt/HTCC alumina packaging system including chip-level package and circuit board has been briefly reported previously for long-term electrical testing of SiC integrated circuits at 500 °C, and brief testing at much higher temperatures. HTCC alumina is an excellent dielectric material with acceptable dielectric constant and low dielectric loss over wide temperature and frequency ranges. Pt is chemically noble and can be co-fired with HTCC alumina in air ambient producing a viable electronic packaging material system for high temperature applications. This paper presents a more detailed description of this packaging system including prototype low power packages and circuit boards based on HTCC alumina and Pt metallization for 500°C and other harsh environment applications. The key technical considerations for chip-level packaging and circuit board assembly, including materials and processes for 500 °C durable wire-bonding and SiC die attach, and integration of multi-chip circuit boards, are presented. Experimental test results of this packaging approach applied to SiC integrated circuits at 500 °C and 700°C are discussed as well.

electronic packaging

The Heterogeneous Integration of Electronic Components

Heterogeneous integration (HI) of electronics components is broadly recognized as a powerful and crucial enabler for the continued growth of computing and communication. From 2010 onwards, the value of HI is increasingly visible in the advanced packaging used in artificial intelligence, high-performance computing, smartphones and communications product implementations. In this Perspective, we argue that HI is crucial to semiconductors and more broadly to the continued evolution of computing and communications. We use leading-edge advanced packaging examples to represent the value, advancements and opportunities for HI. To succeed, it is critical to develop comprehensive HI roadmaps that inform collaborations across the design, manufacturing and reliability spectrum between systems architects, packaging and semiconductor technologists to common goals. Although this article does not provide a full roadmap, we instead detail additional parameters for artificial intelligence, smartphone and other cellular communication devices, and their constituent building blocks including interconnects, power electronics, photonics, thermal management, reliability, modelling and co-design, to foster greater collaboration opportunities among academia, research laboratories and industry.

42 ENGINEERING

Pt/HTCC Alumina based Electronic Packaging System and Integration Processes for High Temperature Harsh Environment Applications

Electronic devices capable of operation at 500°C are required for long term Venus surface missions, as well as for in situ monitoring and control of next generation aeronautical engines. High temperature sensors and electronics can also find many applications in military, and energy and automobile industries. Various silicon carbide (SiC) sensors and electronic devices have been developed for operation at 500 °C, and a compatible packaging system is needed for long term test and deployment of these high temperature devices. High temperature co-fired ceramics (HTCC) alumina with platinum (Pt) conductor was proposed for high temperature electronic packaging. A prototype Pt/HTCC alumina packaging system including chip-level package and circuit board has been briefly reported previously for long-term electrical testing of SiC integrated circuits at 500 °C, and brief testing at much higher temperatures. HTCC alumina is an excellent dielectric material with acceptable dielectric constant and low dielectric loss over wide temperature and frequency ranges. Pt is chemically noble and can be co-fired with HTCC alumina in air ambient producing a viable electronic packaging material system for high temperature applications. This paper presents a more detailed description of this packaging system including prototype low power packages and circuit boards based on HTCC alumina and Pt metallization for 500°C and other harsh environment applications. The key technical considerations for chip-level packaging and circuit board assembly, including materials and processes for 500 °C durable wire-bonding and SiC die attach, and integration of multi-chip circuit boards, are presented. Experimental test results of this packaging approach applied to SiC integrated circuits at 500 °C and 700°C are discussed as well.

High temperature

Phase 1 Final Report: Titan Submarine

The conceptual design of a submarine for Saturn's moon Titan was a funded NASA Innovative Advanced Concepts (NIAC) Phase 1 for 2014. The proposal stated the desire to investigate what science a submarine for Titan's liquid hydrocarbon seas might accomplish and what that submarine might look like. Focusing on a flagship class science system (100 kg), it was found that a submersible platform can accomplish extensive science both above and below the surface of the Kraken Mare. Submerged science includes mapping using side-looking sonar, imaging and spectroscopy of the lake, as well as sampling of the lake's bottom and shallow shoreline. While surfaced, the submarine will not only sense weather conditions (including the interaction between the liquid and atmosphere) but also image the shoreline, as much as 2 km inland. This imaging requirement pushed the landing date to Titan's next summer period (2047) to allow for lighted conditions, as well as direct-to-Earth communication, avoiding the need for a separate relay orbiter spacecraft. Submerged and surfaced investigation are key to understanding both the hydrological cycle of Titan as well as gather hints to how life may have begun on Earth using liquid, sediment, and chemical interactions. An estimated 25 Mb of data per day would be generated by the various science packages. Most of the science packages (electronics at least) can be safely kept inside the submarine pressure vessel and warmed by the isotope power system.The baseline 90-day mission would be to sail submerged and surfaced around and through Kraken Mare investigating the shoreline and inlets to evaluate the sedimentary interaction both on the surface and then below. Depths of Kraken have yet to be sensed (Ligeia to the north is thought to be 200 m (656 ft) deep), but a maximum depth of 1,000 m (3,281 ft) for Kraken Mare was assumed for the design). The sub would spend 20 d at the interface between Kraken Mare and Ligeia Mare for clues to the drainage of liquid methane into the currently predicted predominantly ethane Kraken Mare. During an extended ninety-day mission, it would transit the throat of Kraken (now Seldon Fretum) and perform similar explorations in other areas of Kraken Mare. Once this half year of exploration is completed the submarine could be tasked to revisit points of interest and perhaps do a complete sonar mapping of the seas. All in all, the submarine could explore over 3,000 km (1,864 mi) in its primary mission at an average speed of 0.3 meters per second.

Titan

Titan Submarine: Exploring The Depths of Kraken Mare

The conceptual design of a submarine for Saturn's moon Titan was a funded NASA Innovative Advanced Concepts (NIAC) Phase I for 2014. The effort investigated what science a submarine for Titan's liquid hydrocarbon approximately 93 Kelvin (-180 degrees Centigrade) seas might accomplish and what that submarine might look like. Focusing on a flagship class science system (approximately100 kilograms) it was found that a submersible platform can accomplish extensive and exciting science both above and below the surface of the Kraken Mare The submerged science includes mapping using side looking sonar, imaging and spectroscopy of the sea at all depths, as well as sampling of the sea's bottom and shallow shoreline. While surfaced the submarine will not only sense weather conditions (including the interaction between the liquid and atmosphere) but also image the shoreline, as much as 2 kilometers inland. This imaging requirement pushed the landing date to Titan's next summer period (approximately 2047) to allow for continuous lighted conditions, as well as direct-to-Earth (DTE) communication, avoiding the need for a separate relay orbiter spacecraft. Submerged and surfaced investigation are key to understanding both the hydrological cycle of Titan as well as gather hints to how life may have begun on Earth using liquid/sediment/chemical interactions. An estimated 25 megabits of data per day would be generated by the various science packages. Most of the science packages (electronics at least) can be safely kept inside the submarine pressure vessel and warmed by the isotope power system. This paper discusses the results of Phase I as well as the plans for Phase II.

submarine

Harnessing the Digital Transformation for Development of Electrified Aircraft Propulsion Control Systems

Hybrid electric aircraft propulsion is an emerging technology that presents a variety of potential benefits along with technical integration challenges. Developing these new propulsion architectures with their complex control systems, and ultimately proving their benefit, is a multistep process that goes from concept, to analysis, to dynamic simulation, to hardware in the loop testing, to full scale testing and beyond. This effort is being revolutionized and indeed enabled by new digital tools that support the increasing technology readiness level throughout the maturation process. NASA has developed and made available a suite of digital tools that ease the path from concept to implementation. The three packages are the Toolbox for the Modeling and Analysis of Thermodynamic Systems (T-MATS), the Electrical Modeling and Thermal Analysis Toolbox (EMTAT), and the Thermal Systems Analysis Toolbox (TSAT). These tools are interactive, complementary, and compatible with each other. T-MATS is a modular thermodynamic modeling framework designed for creating custom component level models of jet engines. EMTAT is a modeling framework used to simulate a variety of power electronic devices, using both physics-based and power flow calculations. TSAT is a framework for modeling and analysis of dynamic heat transfer. These packages all consist of graphical, drag-and-drop, parameterizable building blocks representing various components of the system to be modeled, e.g., compressors, turbines, motors, energy storage devices, etc. They are designed to enable the user to model and simulate the end-to-end dynamic operation of a hybrid powertrain at the timescale of the turbomachinery, capturing mechanical, electrical, and thermal interactions. This paper will describe through multiple examples how these tools have been used successfully in several of the early stages of hybrid electric propulsion system development, from the initial system modeling to real-time interactive pilot-in-the-loop simulation to physical hardware-in-the-loop testing, each step bringing the technology closer to fruition.

Hybrid electric propulsion

Harnessing the Digital Transformation for Development of Hybrid Electric Aircraft Propulsion Control Systems

Hybrid electric aircraft propulsion is an emerging technology that presents a variety of potential benefits along with technical integration challenges. Developing these new propulsion architectures with their complex control systems, and ultimately proving their benefit, is a multistep process that goes from concept, to analysis, to dynamic simulation, to hardware in the loop testing, to full scale testing and beyond. This effort is being revolutionized and indeed enabled by new digital tools that support the increasing technology readiness level throughout the maturation process. NASA has developed and made available a suite of digital tools that ease the path from concept to implementation. The three packages are the Toolbox for the Modeling and Analysis of Thermodynamic Systems (T-MATS), the Electrical Modeling and Thermal Analysis Toolbox (EMTAT), and the Thermal Systems Analysis Toolbox (TSAT). These tools are interactive, complementary, and compatible with each other. T-MATS is a modular thermodynamic modeling framework designed for creating custom component level models of jet engines. EMTAT is a modeling framework used to simulate a variety of power electronic devices, using both physics-based and power flow calculations. TSAT is a framework for modeling and analysis of dynamic heat transfer. These packages all consist of graphical, drag-and-drop, parameterizable building blocks representing various components of the system to be modeled, e.g., compressors, turbines, motors, energy storage devices, etc. They are designed to enable the user to model and simulate the end-to-end dynamic operation of a hybrid powertrain at the timescale of the turbomachinery, capturing mechanical, electrical, and thermal interactions. This paper will describe through multiple examples how these tools have been used successfully in several of the early stages of hybrid electric propulsion system development, from the initial system modeling to real-time interactive pilot-in-the-loop simulation to physical hardware-in-the-loop testing, each step bringing the technology closer to fruition.

Electrified Propulsion

Harnessing the Digital Transformation for Development of Electrified Aircraft Propulsion Control Systems

Hybrid electric aircraft propulsion is an emerging technology that presents a variety of potential benefits along with technical integration challenges. Developing these new propulsion architectures with their complex control systems, and ultimately proving their benefit, is a multistep process. This process includes concept development and analysis, dynamic simulation, hardware-in-the-loop testing, full-scale testing, and so on. This effort is being revolutionized and indeed enabled by new digital tools that support increasing the technology readiness level throughout the maturation process. As part of this Digital Transformation, NASA has developed a suite of publicly available digital tools that facilitate the path from concept to implementation. This paper describes the NASA-developed tools and puts them in the context of control system development for hybrid electric aircraft propulsion. The three MATLAB®-based software packages are the Toolbox for the Modeling and Analysis of Thermodynamic Systems (T-MATS), the Electrical Modeling and Thermal Analysis Toolbox (EMTAT), and the Thermal Systems Analysis Toolbox (TSAT). These tools are interactive, complementary, and compatible with each other. T-MATS is a modular thermodynamic modeling framework designed for creating custom component level models of jet engines. EMTAT is a modeling framework used to simulate a variety of power electronic devices, using both physics-based and power flow calculations. TSAT is a framework for modeling and analysis of dynamic heat transfer. These packages all consist of graphical, drag-and-drop, parameterizable building blocks representing various components of the system to be modeled, e.g., compressors, turbines, motors, energy storage devices, etc. They are designed to enable the user to model and simulate the end-to-end dynamic operation of a hybrid electric gas turbine engine powertrain at the timescale of the turbomachinery, capturing mechanical, electrical, and thermal interactions. This paper demonstrates through multiple examples how these tools have been used successfully in a variety of applications, including several of the early stages of hybrid electric gas turbine engine propulsion system development, from the initial system modeling to real-time interactive pilot-in-the-loop simulation to physical hardware-in-the-loop testing, each step bringing the technology closer to fruition.

hybrid electric propulsion

Spinoff 2012

Topics covered include: Water Treatment Technologies Inspire Healthy Beverages; Dietary Formulas Fortify Antioxidant Supplements; Rovers Pave the Way for Hospital Robots; Dry Electrodes Facilitate Remote Health Monitoring; Telescope Innovations Improve Speed, Accuracy of Eye Surgery; Superconductors Enable Lower Cost MRI Systems; Anti-Icing Formulas Prevent Train Delays; Shuttle Repair Tools Automate Vehicle Maintenance; Pressure-Sensitive Paints Advance Rotorcraft Design Testing; Speech Recognition Interfaces Improve Flight Safety; Polymers Advance Heat Management Materials for Vehicles; Wireless Sensors Pinpoint Rotorcraft Troubles; Ultrasonic Detectors Safely Identify Dangerous, Costly Leaks; Detectors Ensure Function, Safety of Aircraft Wiring; Emergency Systems Save Tens of Thousands of Lives; Oxygen Assessments Ensure Safer Medical Devices; Collaborative Platforms Aid Emergency Decision Making; Space-Inspired Trailers Encourage Exploration on Earth; Ultra-Thin Coatings Beautify Art; Spacesuit Materials Add Comfort to Undergarments; Gigapixel Images Connect Sports Teams with Fans; Satellite Maps Deliver More Realistic Gaming; Elemental Scanning Devices Authenticate Works of Art; Microradiometers Reveal Ocean Health, Climate Change; Sensors Enable Plants to Text Message Farmers; Efficient Cells Cut the Cost of Solar Power; Shuttle Topography Data Inform Solar Power Analysis; Photocatalytic Solutions Create Self-Cleaning Surfaces; Concentrators Enhance Solar Power Systems; Innovative Coatings Potentially Lower Facility Maintenance Costs; Simulation Packages Expand Aircraft Design Options; Web Solutions Inspire Cloud Computing Software; Behavior Prediction Tools Strengthen Nanoelectronics; Power Converters Secure Electronics in Harsh Environments; Diagnostics Tools Identify Faults Prior to Failure; Archiving Innovations Preserve Essential Historical Records; Meter Designs Reduce Operation Costs for Industry; Commercial Platforms Allow Affordable Space Research; Fiber Optics Deliver Real-Time Structural Monitoring; Camera Systems Rapidly Scan Large Structures; Terahertz Lasers Reveal Information for 3D Images; Thin Films Protect Electronics from Heat and Radiation; Interferometers Sharpen Measurements for Better Telescopes; and Vision Systems Illuminate Industrial Processes.

Source record

Controlling Precision Stepper Motors in Flight Using (Almost) No Parts

This concept allows control of high-performance stepper motors with minimal parts count and minimal flight software complexity. Although it uses a small number of common flight-qualified parts and simple control algorithms, it is capable enough to meet demanding system requirements. Its programmable nature makes it trivial to implement changes to control algorithms both during integration & test and in flight. Enhancements such as microstepping, half stepping, back-emf compensation, and jitter reduction can be tailored to the requirements of a large variety of stepper motor based applications including filter wheels, focus mechanisms, antenna tracking subsystems, pointing and mobility. The hardware design (using an H-bridge motor controller IC) was adapted from JPL's MER mission, still operating on Mars. This concept has been fully developed and incorporated into the MCS instrument on MRO, currently operating in Mars orbit. It has been incorporated into the filter wheel mechanism and linear stage (focus) mechanism for the AMT instrument. On MCS/MRO, two of these circuits control the elevation and azimuth of the MCS telescope/radiometer assembly, allowing the instrument to continuously monitor the limb of the Martian atmosphere. Implementation on MCS/MRO resulted in a 4:1 reduction in the volume and mass required for the motor driver electronics (100:25 square inches of PCB space), producing a very compact instrument. In fact, all of the electronics for the MCS instrument are packaged within the movable instrument structure. It also saved approximately 3 Watts of power. Most importantly, the design enabled MCS to meet very its stringent maximum allowable torque disturbance requirements.

Randall, David

U.S. Space Radioisotope Power Systems and Applications: Past, Present and Future

Radioisotope power systems (RPS) have been essential to the U.S. exploration of outer space. RPS have two primary uses: electrical power and thermal power. To provide electrical power, the RPS uses the heat produced by the natural decay of a radioisotope (e.g., plutonium-238 in U.S. RPS) to drive a converter (e.g., thermoelectric elements or Stirling linear alternator). As a thermal power source the heat is conducted to whatever component on the spacecraft needs to be kept warm; this heat can be produced by a radioisotope heater unit (RHU) or by using the excess heat of a radioisotope thermoelectric generator (RTG). As of 2010, the U.S. has launched 41 RTGs on 26 space systems. These space systems have ranged from navigational satellites to challenging outer planet missions such as Pioneer 10/11, Voyager 1/2, Galileo, Ulysses, Cassini and the New Horizons mission to Pluto. In the fall of 2011, NASA plans to launch the Mars Science Laboratory (MSL) that will employ the new Multi-Mission Radioisotope Thermoelectric Generator (MMRTG) as the principal power source. Hundreds of radioisotope heater units (RHUs) have been launched to provide warmth to Apollo 11, used to provide heating of critical components in a seismic experiment package, Pioneer 10/11, Voyager 1/2, Galileo, Cassini, Mars Pathfinder, MER rovers, etc. to provide temperature control to critical spacecraft electronics and other mechanical devices such as propulsion system propellant valves. A radioisotope (electrical) power source or system (RPS) consists of three basic elements: (1) the radioisotope heat source that provides the thermal power, (2) the converter that transforms the thermal power into electrical power and (3) the heat rejection radiator. Figure 1 illustrates the basic features of an RPS. The idea of a radioisotope power source follows closely after the early investigations of radioactivity by researchers such as Henri Becquerel (1852-1908), Marie Curie (1867-1935), Pierre Curie (1859-1906) and R. J. Strut. Almost 100 years ago, in 1913, English physicist H. G. J. Moseley (1887-1915) constructed the first nuclear battery using a vacuum flask and 20 mCi of radium (Corliss and Harvey, 1964, Proceedings of the Royal Society, 1913). After World War II, serious interest in radioisotope power systems in the U.S. was sparked by studies of space satellites such as North American Aviation s 1947 report on nuclear space power and the RAND Corporation s 1949 report on radioisotope power. (Greenfield, 1947, Gendler and Kock, 1949). Radioisotopes were also considered in early studies of nuclear-powered aircraft (Corliss and Harvey, 1964). In 1951, the U.S. Atomic Energy Commission (AEC) signed several contracts to study a 1-kWe space power plant using reactors or radioisotopes. Several of these studies, which were completed in 1952, recommended the use of RPS. (Corliss and Harvey, 1964). In 1954, the RAND Corporation issued the summary report of the Project Feedback military satellite study in which radioisotope power was considered (Lipp and Salter, 1954, RAND). Paralleling these studies, in 1954, K. C. Jordan and J. H. Birden of the AEC s Mound Laboratory conceived and built the first RTG using chromel-constantan thermocouples and a polonium-210 (210Po or Po-210) radioisotope heat source (see Figure 2). While the power produced (1.8 mWe) was low by today s standards, this first RTG showed the feasibility of RPS. A second thermal battery was built with more Po-210, producing 9.4 mWe. Jordan and Birden concluded that the Po-210 thermal battery would have about ten times the energy of ordinary dry cells of the same mass (Jordan and Birden, 1954). The heat source consisted of a 1-cm-diameter sphere of 57 Ci (1.8 Wt) of Po-210 inside a capsule of nickel-coated cold-rolled steel all inside a container of Lucite. The thermocouples were silver-soldered chromel-constantan. The thermal battery produced 1.8 mWe.

Cataldo, Robert L.