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At least 91 records · Page 5

A 28 nm multiply-accumulate ASIC architecture for on-chip data compression in MHz frame rate X-ray and electron pixel detectors

Modern X-ray detector systems urgently require compact, efficient, and fast data compression schemes to handle the transmission of big data from pixel arrays, enabling frame rates in the MHz regime. Here, in this work, a data compression ASIC that implements a streaming fixed-length lossy compression scheme is introduced and analyzed, proving the feasibility and benefits of on-chip compression. The compression scheme utilizes a vector matrix product logic, which performs a number of floating-point multiplications, additions, and accumulations. The logic is verified, synthesized, and shown to fit in the area resource available for the X-ray detector under study, which comprises 192 × 168 pixels each of 12-bit width, and having a total area of 20 mm× 20 mm, about 2 mm× 20 mm of which are available for the digital logic. Several system architectures, precisions, and compression ratios ranging from 100 to 250 were analyzed to pave the way for on-chip fixed-length compression (e.g., principal component analysis, singular value decomposition) and data reduction (e.g., azimuthal integration) for X-ray and electron detectors.

Data compression↗

Wafer-scale pixelated detector system

A large area, gapless, detection system comprises at least one sensor; an interposer operably connected to the at least one sensor; and at least one application specific integrated circuit operably connected to the sensor via the interposer wherein the detection system provides high dynamic range while maintaining small pixel area and low power dissipation. Thereby the invention provides methods and systems for a wafer-scale gapless and seamless detector systems with small pixels, which have both high dynamic range and low power dissipation.

42 ENGINEERING↗

Wafer-scale pixelated detector system

A large area, gapless, detection system comprises at least one sensor; an interposer operably connected to the at least one sensor; and at least one application specific integrated circuit operably connected to the sensor via the interposer wherein the detection system provides high dynamic range while maintaining small pixel area and low power dissipation. Thereby the invention provides methods and systems for a wafer-scale gapless and seamless detector systems with small pixels, which have both high dynamic range and low power dissipation.

Fahim, Farah↗

Digital encoding algorithm for pixelated detectors

A detector for imaging and efficiently digitizing a spatial distribution of photon flux includes pixel circuits that compressively encode pixel values generated by integrated analog to digital converters (ADCs). On-pixel digital compression circuits (DCCs) implement compression to increase continuous frame rate by reducing the number of bits per pixel while keeping quantization error below Poisson noise. Several mapping algorithms for photon-counting and charge-integrating detectors and compact digital logic implementations are presented.

Hammer, Michael P.↗

Dynamically Reconfigurable Data Readout of Pixel Detectors for Automatic Synchronization with Data Acquisition Systems

Reconfigurable detectors with dynamically selectable sensing and readout modes are highly desirable for implementing edge computing as well as enabling advanced imaging techniques such as foveation. The concept of a camera system capable of simultaneous passive imaging and dynamic ranging in different regions of the detector is presented. Such an adaptive-autonomous detector with both spatial and temporal control requires programmable window of exposure (time frames), ability to switch between readout modes such as full-frame imaging and zero-suppressed data, modification of the number of pixel data bits and independent programmability for distinct detector regions. In this work, a method is presented for seamlessly changing time frames and readout modes without data corruption while still ensuring that the data acquisition system (DAQ) does not need to stop and resynchronize at each change of setting, thus avoiding significant dead time. Data throughput is maximized by using a minimum unique data format, rather than lengthy frame headers, to differentiate between consecutive frames. A data control and transmitter (DCT) synchronizes data transfer from the pixel to the periphery, reconfigures the data to transmit it serially off-chip, while providing optimized decision support based on a DAQ definable mode. Measurements on a test structure demonstrate that the DCT can operate at 1 GHz in a 65 nm LP CMOS process.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Forward Pixel Detector for the Phase 2 Upgrade of CMS And Module Testing at UIC

High-Luminosity Large Hadron Collider (HL-LHC) upgrade aims to increase performance. In order to efficiently handle the larger particle flux and increased radiation, an upgrade is planned for the inner Tracker of the Compact Muon Solenoid (CMS) detector, which is located at the innermost part of the CMS. To efficiently reconstruct and track particles, the existing pixel tracker will be upgraded with novel sensors, readout chips, and front-end electronics designed to handle increased data rates. These improvements will allow the detector to track particles more precisely. In the United States, we are working on assembling new sensor modules to be inserted into disks, referred to as TFPX, for installation in the CMS detector for the HL-LHC era. We are currently testing the prototype of TFPX modules to ensure the upgrade is carried out in the best way possible. The University of Ilinois Chicago has been tasked with testing the final versions of the TFPX sensor modules before they are sent to CERN to be installed into the CMS detector. This work is supported by NSF.

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗

Tests of a high rate pixel detector for CMS upgrade

This is a Technical Scope of Work (TSW) between the Fermi National Accelerator Laboratory (Fermilab) and the experimenters of the CMS Pixel group, which consists of individuals from the Bristol University, CERN, Fermilab, Rutherford Laboratory (UK), and National Taiwan University who have committed to participate in beam tests to be carried out during the 2013 - 2014 Fermilab Test Beam Facility program. The TSW is intended solely for the purpose of recording expectations for budget estimates and work allocations for Fermilab, the funding agencies and the participating institutions. It reflects an arrangement that currently is satisfactory to the parties; however, it is recognized and anticipated that changing circumstances of the evolving research program will necessitate revisions. The parties agree to modify this TSW to reflect such required adjustments. Actual contractual obligations will be set forth in separate documents. This TSW fulfills Article 1 (facilities and scope of work) of the User Agreements signed (or still

43 PARTICLE ACCELERATORS↗

Response of a hybrid pixel detector (MEDIPIX3) to different radiation sources for medical applications

The development in semiconductor CMOS technology has enabled the creation of sensitive detectors for a wide range of ionizing radiation. These devices are suitable for photon counting and can be used in imaging and tomography X-ray diagnostics. The Medipix[1] radiation detection system is a hybrid silicon pixel chip developed for particle tracking applications in High Energy Physics. Its exceptional features (high spatial and energy resolution, embedded ultra fast readout, different operation modes, etc.) make the Medipix an attractive device for applications in medical imaging. In this work the energy characterization of a third-generation Medipix chip (Medipix3) coupled to a silicon sensor is presented. We used different radiation sources (strontium 90, iron 55 and americium 241) to obtain the response curve of the hybrid detector as a function of energy. We also studied the contrast of the Medipix as a measure of pixel noise. Finally we studied the response to fluorescence X rays from different target materials (In, Pd and Cd) for the two data acquisition modes of the chip; single pixel mode and charge summing mode.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

The INFN R&D: New pixel detector for the High Luminosity upgrade of the LHC

The High Luminosity upgrade of the CERN-LHC (HL-LHC) demands for a new high-radiation tolerant solid-state pixel sensor capable of surviving fluencies up to a few 10 16 particles/cm 2 at ~3 cm from the interaction point. To this extent the INFN ATLAS-CMS joint research activity, in collaboration with Fondazione Bruno Kessler-FBK, is aiming at the development of thin n-in-p type pixel sensors for the HL-LHC. The R&D covers both planar and single-sided 3D columnar pixel devices made with the Si-Si Direct Wafer Bonding technique, which allows for the production of sensors with 100 μm and 130 μm active thickness for planar sensors, and 130 μm for 3D sensors, the thinnest ones ever produced so far. The first prototypes of hybrid modules bump-bonded to the present CMS and ATLAS readout chips have been tested in beam tests. Furthermore, the preliminary results on their performance before and after irradiation are presented.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Skipper-in-CMOS: Nondestructive Readout With Subelectron Noise Performance for Pixel Detectors

The Skipper-in-CMOS image sensor integrates the nondestructive readout capability of skipper charge coupled devices (Skipper-CCDs) with the high conversion gain of a pinned photodiode (PPD) in a CMOS imaging process while taking advantage of in-pixel signal processing. This allows both single photon counting as well as high frame rate readout through highly parallel processing. The first results obtained from a ${15} \times {15}~\mu $ m2 pixel cell of a Skipper-in-CMOS sensor fabricated in Tower Semiconductor’s commercial 180-nm CMOS image sensor process are presented. Measurements confirm the expected reduction of the readout noise with the number of samples down to deep subelectron noise of $0.15\text {e}^ - $ , demonstrating the charge transfer operation from the PPD and the single photon counting operation when the sensor is exposed to light. This article also discusses new testing strategies employed for its operation and characterization.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Search for Dark Matter using mono-Higgs and the ATLAS Pixel Detector (Final Report)

A large component of the mass-energy of the universe is composed of dark matter (DM), whose properties and interactions with known particles are not yet understood. Searches for DM at the Large Hadron Collider (LHC) provide important information, complementary to direct and indirect detection experiments, that is necessary to determine whether an observed signal indeed stems from DM. Furthermore, the discovery of the Higgs boson provides a unique avenue to search for DM because the potential interaction of the Higgs with DM would lead to the unique signature of a Higgs boson recoiling against DM. This process is typically referred to as mono-Higgs because DM does not interact strongly with most known particles and will therefore pass unseen through the detector, leading to a single detected Higgs boson and a large imbalance of momentum. Due to the strength of the interactions of the Higgs with Standard Model particles, it is unlikely for a Higgs boson to be radiated from initial state quarks. Therefore, the observation of this process would provide direct insight into the mechanism by which DM couples to known particles. The objective of this research program is to search for the dark matter particles produced in association with a Higgs boson at the LHC using the ATLAS (A Toroidal LHC Apparatus) detector, specifically when the Higgs boson decays to two bottom quarks. This research will benefit greatly from the development of innovative identification techniques of boosted Higgs bosons. The program includes the upgrade of the ATLAS Pixel readout system, which is critical to maintain high performance of tracking, vertexing, and boosted Higgs tagging in the planned higher luminosity run of the LHC.

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗