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Ultrasonic instrument has been developed for use in quantitative nondestructive evaluation of material defects such as cracks, voids, inclusions, and unbonds. Instrument is provided with standard pulse source and transducer for each frequency range selected and includes integral aids that allow calibration to prescribed standards.
Major rotor design criteria are discussed with particular emphasis on those aspects of rotor design that ensure long life component integrity. Dynamic considerations, that necessitate tuning of bladed disk and seal assemblies to avoid excessive vibratory stress at both design and off-design conditions are reviewed as well as low cycle fatigue considerations, which have resulted in detailed analysis procedures to establish part temperature and stress variation throughout an operating cycle and extensive specimen and component fatigue testing to establish safe cyclic operating limits. The frequency, size, and behavior of intrinsic material defects were investigated. Manufacturing process improvements, including the application of increasingly sophisticated inspection techniques and quality control procedures are reviewed in light of their impact on component durability.
The operating characteristics of large diameter rolling-element bearings in the ultra high speed regimes expected in advanced turbine engines for high performance aircraft were investigated. A high temperature lubricant, DuPont Krytox 143 AC, was evaluated at bearing speeds to 3 million DN. Compared to the results of earlier, similar tests using a MIL-L-23699 (Type II) lubricant, bearings lubricated with the high density Krytox fluid showed significantly higher power requirements. Additionally, short bearing lives were observed when this fluid was used with AISI M50 bearings in an air atmosphere. The primary mode of failure was corrosion initiated surface distress (fatigue) on the raceways. The potential of a case-carburized bearing to sustain a combination of high-tangential and hertzian stresses without experiencing race fracture was also investigated. Limited full scale bearing tests of a 120 mm bore ball bearing at a speed of 25,000 rpm (3 million DN) indicated that a carburized material could sustain spalling fatigue without subsequent propagation to fracture. Planned life tests of the carburized material had to be aborted, however, because of apparent processing-induced material defects.
The concept of welding crack tendency is explained and illustrated with practical examples. All pertinent causes are enumerated, and experimental measures are given through which the secondary effects can be removed and the principal causes analyzed: 1) welding stresses; and 2) material defects. The variations in length and stresses incident to welding a small bar as free weld, with restrained elongation and restrained elongation and contraction, are explored in three fundamental experiments.
The National Aeronautics and Space Administration and the Chinese Aeronautical Establishment participated in a Fatigue and Fracture Mechanics Cooperative Program. The program objectives were to identify and characterize crack initiation and growth of small cracks (10 microns to 2 mm long) in commonly used US and PRC aluminum alloys, to improve fracture mechanics analyses of surface- and corner-crack configurations, and to develop improved life-prediction methods. Fatigue and small-crack tests were performed on single-edgenotch tension (SENT) specimens and large-crack tests were conducted on center-crack tension specimens for constant-amplitude (stress ratios of -1, 0, and 0.5) and Mini-TWIST spectrum loading. The plastic replica method was used to monitor the initiation and growth of small fatigue cracks at the semicircular notch. Crack growth results from each laboratory on 7075-T6 bare and LC9cs clad aluminum alloys agreed well and showed that fatigue life was mostly crack propagation from a material defect (inclusion particles or void) or from the cladding layer. Finite-element and weight-function methods were used to determine stress intensity factors for surface and corner cracks in the SENT specimens. Equations were then developed and used in a crack growth and crack-closure model to correlate small- and large-crack data and to make life predictions for various load histories. The cooperative program produced useful experimental data and efficient analysis methods for improving life predictions. The results should ultimately improve aircraft structural reliability and safety.
The small crack effect was investigated in two high-strength aluminium alloys: 7075-T6 bare and LC9cs clad alloy. Both experimental and analytical investigations were conducted to study crack initiation and growth of small cracks. In the experimental program, fatigue tests, small crack and large crack tests A,ere conducted under constant amplitude and Mini-TWIST spectrum loading conditions. A pronounced small crack effect was observed in both materials, especially for the negative stress ratios. For all loading conditions, most of the fatigue life of the SENT specimens was shown to be crack propagation from initial material defects or from the cladding layer. In the analysis program, three-dimensional finite element and A weight function methods were used to determine stress intensity factors and to develop SIF equations for surface and corner cracks at the notch in the SENT specimens. A plastisity-induced crack-closure model was used to correlate small and large crack data, and to make fatigue life predictions, Predicted crack-growth rates and fatigue lives agreed well with experiments. A total fatigue life prediction method for the aluminum alloys was developed and demonstrated using the crack-closure model.
An advanced computational model is being developed to predict the formation of indium nitride (InN) film from the reaction of trimethylindium (In(CH3)3) with ammonia (NH3). The components are introduced into the reactor in the gas phase within a background of molecular nitrogen (N2). Organometallic chemical vapor deposition occurs on a heated sapphire surface. The model simulates heat and mass transport with gas and surface chemistry under steady state and pulsed conditions. The development and validation of an accurate model for the interactions between the diffusion of gas phase species and surface kinetics is essential to enable the regulation of the process in order to produce a low defect material. The validation of the model will be performed in concert with a NASA-North Carolina State University project.
Flaws exist in aircraft structures due to manufacturing operations and material defects. Under variable amplitude cyclic loading, these flaws grow as part-through cracks reducing the residual strength of structural components. To meet damage tolerant design requirements, accurate flaw growth predictions are needed which account for continual changes in crack shape as well as crack growth retardation and acceleration. Predicting the growth of part-through cracks under cyclic loading using an innovative and computationally efficient model is the focus of the research summarized in this report. In this research effort, a slice synthesis methodology was developed and used to construct a modified strip-yield model for the part-through semi-elliptical surface flaw, enabling prediction of plasticity-induced closure along the crack front and subsequent fatigue crack growth under constant amplitude and variable amplitude loading. While modeling the plasticity-induced closure in a part-through flaw may be performed using three dimensional elastic-plastic finite element analysis, this type of effort is impractical from an engineering perspective. A modified strip-yield model similar to that used in FASTRAN for part-through flaws is a much needed engineering design tool, particularly when computational resources are limited.
Room temperature measurements of the turn-off time (t(sub q)) are reported for several packaged, npnp developmental power thyristors based on 4H-type SiC and rated 400 V, 2 A. Turn-off is effected by a 50 V pulse of applied reverse voltage, from a state of a steady 1 A forward current. Plots of t(sub q) against the ramp rate (dV(sub AK)/dt) of reapplied forward voltage are presented for preset values of limiting anode-to-cathode voltage (V(sub AK,max)). The lowest t(sub q) measured was about 180 ns. A rapid rise of these t(sub q) curves was observed for values of V(sub AK,max) that are only about a fifth of the rated voltage, whereas comparative t(sub q) plots for a commercial, fast turn-off, Si-based thyristor at a proportionately reduced V(sub AK,max) showed no such behavior. Hence these SiC thyristors may have problems arising from material defects or surface passivation. The influence the R-C-D gate bypass circuit that was used is briefly discussed.
This presentation discusses fractured leads on field-programmable gate array (FPGA) during flight vibration. Actions taken to determine root cause and resolution of the failure include finite element analysis (FEA) and vibration testing and scanning electron microscopy (with X-ray microanalysis) and energy dispersive spectrometry (SEM/EDS) failure assessment. Bonding methods for surface mount parts is assessed, including critical analysis and assessment of random fatigue damage. Regarding ceramic quad flat pack (CQFP) lead fracture, after disassembling the attitude control electronics (ACE) configuration, photographs showed six leads cracked on FPGA RTSX72SU-1 CQ208B package located on the RWIC card. An identical package (FPGA RTSX32SU-1 CQ208B) mounted on the RWIC did not results in cracked pins due to vibration. FPGA lead failure theories include workmanship issues in the lead-forming, material defect in the leads of the FPGA packages, and the insecure mounting of the board in the card guides, among other theories. Studies were conducted using simple calculations to determine the response and fatigue life of the package. Shorter packages exhibited more response when loaded by out-of-plane displacement of PCB while taller packages exhibit more response when loaded by in-plane acceleration of PCB. Additionally, under-fill did not contribute to reducing stress in leads due to out-of-plane PCB loading or from component twisting, as much as corner bonding. The combination of corner bond and under-fill is best to address mechanical and thermal S/C environment. Test results of bonded parts showed reduced (dampened) amplitude and slightly shifted peaks at the un-bonded natural frequency and an additional response at the bonded frequency. Stress due to PCBB out-of-plane loading was decreased on in the corners when only a corner bond was used. Future work may address CQFP fatigue assessment, including the investigation of discrepancy in predicted fatigue damage, as well as comparing fatigue life and fatigue damage cycle ration computed using FEA and Miner's rule to results from a fatigue assessment software program.
Photovoltaic plant owners and insurance companies would like to be prepared for the forthcoming material warranty claims (material defects) and power warranty claims (degradation rate). To address the needs of these stakeholders, this presentation aims to introduce a new conceptual approach to perform accelerated testing right at the field of interest and it is called field accelerated stress testing (FAST). The primary goal of this presentation is to present a conceptual approach to forecast the field specific failure modes and degradation rates in advance by a factor of 2 to 5, right at the plant site using a few spare modules available at the plant location itself.
Quantum sensing and computation can be realized with superconducting microwave circuits. Qubits are engineered quantum systems of capacitors and inductors with non-linear Josephson junctions. They operate in the single-excitation quantum regime, photons of $27 \mu$eV at 6.5 GHz. Quantum coherence is fundamentally limited by materials defects, in particular atomic-scale parasitic two-level systems (TLS) in amorphous dielectrics at circuit interfaces.[1] The electric fields driving oscillating charges in quantum circuits resonantly couple to TLS, producing phase noise and dissipation. We use coplanar niobium-on-silicon superconducting resonators to probe decoherence in quantum circuits. By selectively modifying interface dielectrics, we show that most TLS losses come from the silicon surface oxide, and most non-TLS losses are distributed throughout the niobium surface oxide. Through post-fabrication interface modification we reduced TLS losses by 85% and non-TLS losses by 72%, obtaining record single-photon resonator quality factors above 5 million and approaching a regime where non-TLS losses are dominant. [1]M\"uller, C., Cole, J. H. & Lisenfeld, J. Towards understanding two-level-systems in amorphous solids: insights from quantum circuits. Rep. Prog. Phys. 82, 124501 (2019)
Phase stability, defect formation energies, and carrier concentrations are closely interrelated features of semiconductors. Due to their joint dependence on the multidimensional chemical potential space, it is challenging to quantitatively establish patterns between these quantities in a given semiconductor, especially when the semiconductor is comprised of multiple elements. To enable synchronous visualization and analysis of these complementary material properties and their interdependence, we developed the Visualization Toolkit for Analyzing Defects in Materials (VTAnDeM). This python-based toolkit allows users to interactively explore how defect formation energies and carrier concentrations vary across the composition and chemical potential spaces of multicomponent semiconductors. Here, we illustrate the computational workflow that employs VTAnDeM as a post-processing tool for first-principles calculations and describe the data organization and theory underlying the visualization scheme. Furthermore, we believe that this software will serve as a useful tool for simultaneously visualizing the often complex and non-intuitive chemical potential – defect – carrier concentration phase space of semiconductors.
No abstract prepared.
Leaky Lamb Wave (LLW) propagation in composite materials has been studied extensively since it was first observed in 1982. The wave is induced using a pitch-catch arrangement and the plate wave modes are detected by identifying minima in the reflected spectra to obtain the dispersion data.
Control of point defects and disorder in functional thin films and 2D materials is critical to realizing their full potential in applications ranging from energy storage to advanced electronics. However, these phenomena are often poorly understood, difficult to characterize, and challenging to direct with precision. This presentation explores emerging multi-modal computer vision to decipher and predict order in materials across multiple length scales in the electron microscope, from the atomic to the nanoscale. By fusing data from diverse sources, these powerful models provide unprecedented insights into materials' lifecycles, enabling the control of defects and their associated properties at a fundamental level. This capability promises to transform materials design and accelerate the development of next-generation technologies.
A method and apparatus for testing a material such as the water-wall tubes in boilers includes the use of a portable thermal line heater having radiation shields to control the amount of thermal radiation that reaches a thermal imager. A procedure corrects for variations in the initial temperature of the material being inspected. A method of calibrating the testing device to determine an equation relating thickness of the material to temperatures created by the thermal line heater uses empirical data derived from tests performed on test specimens for each material type, geometry, density, specific heat, speed at which the line heater is moved across the material and heat intensity.
Atomic scale defects critically limit performance of semiconductor materials. To improve materials, defect effects and defect formation mechanisms must be understood. In this paper, we demonstrate multiple examples where molecular dynamics simulations have effectively addressed these issues that were not well addressed in prior experiments. In the first case, we report our recent progress on modelling graphene growth, where we found that defects in graphene are created around periphery of islands throughout graphene growth, not just in regions where graphene islands impinge as believed previously. In the second case, we report our recent progress on modelling TlBr, where we discovered that under an electric field, edge dislocations in TlBr migrate in both slip and climb directions. The climb motion ejects extensive vacancies that can cause the rapid aging of the material seen in experiments. In the third case, we discovered that the growth of InGaN films on (0001) surfaces suffers from a serious polymorphism problem that creates enormous amounts of defects. Growth on ( $11\bar{2}0$ ) surfaces, on the other hand, results in single crystalline wurtzite films without any of these defects. In the fourth case, we first used simulations to derive dislocation energies that do not possess any noticeable statistical errors, and then used these error-free methods to discover possible misuse of misfit dislocation theory in past thin film studies. Lastly, we highlight the significance of molecular dynamics simulations in reducing defects in the design space of nanostructures.