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At least 91 records · Page 5

Improved C/SiC Ceramic Composites Made Using PIP

Improved carbon-fiber-reinforced SiC ceramic-matrix composite (C/SiC CMC) materials, suitable for fabrication of thick-section structural components, are producible by use of a combination of raw materials and processing conditions different from such combinations used in the prior art. In comparison with prior C/SiC CMC materials, these materials have more nearly uniform density, less porosity, and greater strength. The majority of raw-material/processing-condition combinations used in the prior art involve the use of chemical vapor infiltration (CVI) for densifying the matrix. In contrast, in synthesizing a material of the present type, one uses a combination of infiltration with, and pyrolysis of, a preceramic polymer [polymer infiltration followed by pyrolysis (PIP)]. PIP processing is performed in repeated, tailored cycles of infiltration followed by pyrolysis. Densification by PIP processing takes less time and costs less than does densification by CVI. When one of these improved materials was tested by exposure to a high-temperature, inert-gas environment that caused prior C/SiC CMCs to lose strength, this material did not lose strength. (Information on the temperature and exposure time was not available at the time of writing this article.) A material of the present improved type consists, more specifically, of (1) carbon fibers coated with an engineered fiber/matrix interface material and (2) a ceramic matrix, containing SiC, derived from a pre-ceramic polymer with ceramic powder additions. The enhancements of properties of these materials relative to those of prior C/SiC CMC materials are attributable largely to engineering of the fiber/ matrix interfacial material and the densification process. The synthesis of a material of this type includes processing at an elevated temperature to a low level of open porosity. The approach followed in this processing allows one to fabricate not only simple plates but also more complexly shaped parts. The carbon fiber reinforcement in a material of this type can be in any of several alternative forms, including tow, fabric, or complex preforms containing fibers oriented in multiple directions.

Easler, Timothy↗

Relation of ultrasonic energy loss factors and constituent properties in unidirectional composites

A model is developed relating composite constituents properties with ultrasonic energy loss factors for longitudinal waves propagating in the principal directions of a unidirectional graphite/epoxy fiber composite. All the constituents are assumed to behave as linear viscoelastic materials with energy dissipation properties defined by loss factors. It is found that by introducing a new constituent called the interface material, the composite and constituent properties can be brought into consistency with simple series and parallel models. An expression relating the composite loss factors to the loss factors of the constituents is derived and its coefficients are evaluated.

Williams, J. H., Jr.↗

Ultrasonic wave propagation loss factor in composite in terms of constituent properties

A model is developed to relate the energy loss factors of ultrasonic longitudinal waves propagating in the principal directions of a unidirectional graphite fiber composite to the composite constituent properties. All the constituents are assumed to behave as linear viscoelastic materials with energy dissipation properties defined by loss factors. It is found that by introducing a new constituent called the interface material, the composite and constituent properties can be brought into consistency with simple series and parallel models. An expression relating the composite loss factors to the loss factors of the constituents is derived and its coefficients are evaluated.

Williams, J. H., Jr.↗

Chemical bonding technology

Primers employed in bonding together the various material interfaces in a photovoltaic module are being developed. The approach develops interfacial adhesion by generating actual chemical bonds between the various materials bonded together. The current status of the program is described along with the progress toward developing two general purpose primers for ethylene vinyl acetate (EVA), one for glass and metals, and another for plastic films.

Plueddemann, E.↗

Microwave radiometer for subsurface temperature measurement

A UHF radiometer, operating at a frequency of 800 MHz, was modified to provide an integral, three frequency voltage standing wave ratio (VSWR) circuit in the radio frequency (RF) head. The VSWR circuit provides readings of power transmission at the antenna-material interface with an accuracy of plus or minus 5 percent. The power transmission readings are numerically equal to the emissivity of the material under observation. Knowledge of material emissivity is useful in the interpretation of subsurface apparent temperatures obtained on phantom models of biological tissue. The emissivities of phantom models consisting of lean beefsteak were found to lie in the range 0.623 to 0.779, depending on moisture content. Radiometric measurements performed on instrumented phantoms showed that the radiometer was capable of sensing small temperature changes occurring at depths of at least 19 to 30 mm. This is consistent with previously generated data which showed that the radiometer could sense temperatures at a depth of 38 mm.

Porter, R. A.↗

Thermal grease replacement for the modular power subsystem

A comparative thermal conductance test was conducted to evaluate thermal interface materials for use on the Modular Power Subsystem. Materials tested included three thermal pads, four RTV adhesives, bare metal, and one thermal grease. The tests were conducted in a bell jar at vacuum conditions using a 1400 square centimeter footprint and two relatively low contact pressures, 207 kPa and 620 kPa. Power inputs ranged from 100 to 500 watts, and the thermal interface conductance values ranged from 100 to 1700 W/m2 C for the interstitial materials tested. In general, the thermal pads performed a little better than bare metal, while the RTV adhesives performed significantly better than the bare metal and comparable to the thermal grease.

Lapinski, John R., Jr.↗

Finite Element A Posteriori Error Estimation for Heat Conduction

This research investigates residual-based a posteriori error estimates for finite element approximations of heat conduction in single-layer and multi-layered materials. The finite element approximation, based upon hierarchical modelling combined with p-version finite elements, is described with specific application to a two-dimensional, steady state, heat-conduction problem. Element error indicators are determined by solving an element equation for the error with the element residual as a source, and a global error estimate in the energy norm is computed by collecting the element contributions. Numerical results of the performance of the error estimate are presented by comparisons to the actual error. Two methods are discussed and compared for approximating the element boundary flux. The equilibrated flux method provides more accurate results for estimating the error than the average flux method. The error estimation is applied to multi-layered materials with a modification to the equilibrated flux method to approximate the discontinuous flux along a boundary at the material interfaces. A directional error indicator is developed which distinguishes between the hierarchical modeling error and the finite element error. Numerical results are presented for single-layered materials which show that the directional indicators accurately determine which contribution to the total error dominates.

Lang, Christapher G.↗

Thermal conductivity of 3D-printed block-copolymer-inspired structures

This study primarily focuses on examining the impact that geometric structure has on thermal conductivity of multi-phase constructs in different 3D-printed poly(lactic acid), PLA, samples. The investigated structures are inspired by morphologies formed by diblock copolymers: lamellae, hexagonally packed cylinders, and gyroid. This research also investigates how volume percentage and material combination influence the thermal conductivity of these structures. Further, the samples can be tailored to simulate various thermal management structures observed in practical applications, such as thermal interface materials in electronic devices. Thermal conductivity ratio is controlled using air, the least conductive material at 0.026 W/(m K), PLA at 0.136 W/(m K), and thermal paste at 5.11 W/(m K). Different models were tested against thermal conductivity measurements in order to capture the effect of material type (PLA-Air versus PLA-Thermal Paste), volume percentage, structure, and orientation. Simple, effective medium models were good predictions of thermal conductivity in lamellar structures, but it was necessary to develop models for conduction through cylindrical and gyroid structures. Finally, all results were normalized to find a universal model that is independent of structure and material. This approach provides a simple method to predict how to reduce or enhance transport properties and heat management capabilities of 3D printed objects.

36 MATERIALS SCIENCE↗

Advanced composites structural concepts and materials technologies for primary aircraft structures: Structural response and failure analysis

Non-linear analysis methods were adapted and incorporated in a finite element based DIAL code. These methods are necessary to evaluate the global response of a stiffened structure under combined in-plane and out-of-plane loading. These methods include the Arc Length method and target point analysis procedure. A new interface material model was implemented that can model elastic-plastic behavior of the bond adhesive. Direct application of this method is in skin/stiffener interface failure assessment. Addition of the AML (angle minus longitudinal or load) failure procedure and Hasin's failure criteria provides added capability in the failure predictions. Interactive Stiffened Panel Analysis modules were developed as interactive pre-and post-processors. Each module provides the means of performing self-initiated finite elements based analysis of primary structures such as a flat or curved stiffened panel; a corrugated flat sandwich panel; and a curved geodesic fuselage panel. This module brings finite element analysis into the design of composite structures without the requirement for the user to know much about the techniques and procedures needed to actually perform a finite element analysis from scratch. An interactive finite element code was developed to predict bolted joint strength considering material and geometrical non-linearity. The developed method conducts an ultimate strength failure analysis using a set of material degradation models.

Dorris, William J.↗

What Is a Polyolefin? A Critical Overview of Ethylene Copolymers Used as Solar Photovoltaic Module Encapsulants

In recent years, photovoltaic (PV) encapsulant films marketed as polyolefins (POs), more specifically as PO elastomers (POEs) and thermoplastic POs (TPOs), have gained significant market share and are projected to become the dominant encapsulation films by 2030. Relative to other industries, there are significant misconceptions about the term PO in the PV industry. Both in the scientific literature as well as in sales and advertising, the terms PO, POE, and TPO are often misused to describe the same type of material with comparable properties, while in reality these may each consist of separate material classes. This paper provides a comprehensive literature and market review, to showcase a broad range of PO and other ethylene copolymer encapsulants from recent studies, and discusses the materials' properties to clarify what constitutes a “polyolefin.” In addition, to promote a clearer comparison of encapsulant properties, we propose a two‐dimensional taxonomy to categorize polymers used in module manufacturing, including POs. In terms of improving the reliability of solar PV modules, PO‐based encapsulants have several advantages (including lower water uptake and ion diffusion), but might come with disadvantages too, such as a more complex processing and a higher sensitivity to the storage conditions and shelf life. All this might prospectively impact adhesion properties of the encapsulant to other materials' interfaces (glass, cells etc.) and end‐product quality. Because the track record of field‐deployed PV modules containing PO encapsulants is also limited, we hope to contribute to better material understanding and precision in communication in PV to secure quality.

14 SOLAR ENERGY↗

Approximating the stress field within the unit cell of a fabric reinforced composite using replacement elements

This report concerns the prediction of the elastic moduli and the internal stresses within the unit cell of a fabric reinforced composite. In the proposed analysis no restrictions or assumptions are necessary concerning yarn or tow cross-sectional shapes or paths through the unit cell but the unit cell itself must be a right hexagonal parallelepiped. All the unit cell dimensions are assumed to be small with respect to the thickness of the composite structure that it models. The finite element analysis of a unit cell is usually complicated by the mesh generation problems and the non-standard, adjacent-cell boundary conditions. This analysis avoids these problems through the use of preprogrammed boundary conditions and replacement materials (or elements). With replacement elements it is not necessary to match all the constitutional material interfaces with finite element boundaries. Simple brick-shaped elements can be used to model the unit cell structure. The analysis predicts the elastic constants and the average stresses within each constituent material of each brick element. The application and results of this analysis are demonstrated through several example problems which include a number of composite microstructures.

Foye, R. L.↗

The Cryogenic Test Bed experiments: Cryogenic heat pipe flight experiment CRYOHP (STS-53). Cryogenic two phase flight experiment CRYOTP (STS-62). Cryogenic flexible diode flight experiment CRYOFD

This paper presents an overview of the Cryogenic Test Bed (CTB) experiments including experiment results, integration techniques used, and lessons learned during integration, test and flight phases of the Cryogenic Heat Pipe Flight Experiment (STS-53) and the Cryogenic Two Phase Flight Experiment (OAST-2, STS-62). We will also discuss the Cryogenic Flexible Diode Heat Pipe (CRYOFD) experiment which will fly in the 1996/97 time frame and the fourth flight of the CTB which will fly in the 1997/98 time frame. The two missions tested two oxygen axially grooved heat pipes, a nitrogen fibrous wick heat pipe and a 2-methylpentane phase change material thermal storage unit. Techniques were found for solving problems with vibration from the cryo-collers transmitted through the compressors and the cold heads, and mounting the heat pipe without introducing parasitic heat leaks. A thermally conductive interface material was selected that would meet the requirements and perform over the temperature range of 55 to 300 K. Problems are discussed with the bi-metallic thermostats used for heater circuit protection and the S-Glass suspension straps originally used to secure the BETSU PCM in the CRYOTP mission. Flight results will be compared to 1-g test results and differences will be discussed.

Thienel, Lee↗

Thermally-Conductive Metallic Coatings and Applications for Heat Removal on In-Space Cryogenic Vehicles

For large in-space cryogenic upper stages, substantial axial heat removal from a forward skirt by vapor-based heat interception may not be achieved by simple attachment methods unless sufficient thermal conductance from the skirt to the cooling fluid can be achieved. Preferable methods would allow for the addition of the cooling system to existing structure with minimal impact on the structure. Otherwise, significant modification to the basic structural design andor novel and complex attachment mechanisms with high effective thermal conductance are likely to be required. The approach being pursued by evolvable Cryogenics (eCryo) is to increase the thermal performance of a relatively simple attachment system by applying metallic or other thermally conductive material coatings to the mating surface area of the fluid channel where it is attached the skirt wall. The expectation of candidate materials is that the dramatic increase in conductivity of pure metals at temperatures close to liquid hydrogen vapor temperature will compensate for the reduced actual contact area typical of mechanical joints. Basic contact conductance data at low temperatures for candidate interface materials is required to enable the test approach. A test rig was designed at NASA Glenn Research Center to provide thermal contact resistance testing between small sample coupons coated with conductive material via electron beam evaporation, a low-temperature option that will not affect physical properties of base materials. Average coating thicknesses were 10 k. The test fixture was designed to mount directly to a cryocooler cold head within a vacuum test chamber. The purpose of this test was to determine qualitative contact conductance between various test samples. Results from this effort will be implemented in a sub-scale vapor-based heat interception test, where the applicability for increased heat removal on large structural skirts will be considered.

small scale testing↗

Compliant Turbomachine Sealing

Sealing interface materials and coatings are sacrificial, giving up their integrity for the benefit of the component. Seals that are compliant while still controlling leakage, dynamics, and coolant flows are sought to enhance turbomachine performance. Herein we investigate the leaf-seal configuration. While the leaf seal is classified as contacting, a ready modification using the leaf-housing arrangement in conjunction with an interface film rider (a bore seal, for example) provides for a film-riding noncontact seal. The leaf housing and leaf elements can be made from a variety of materials from plastic to ceramic. Four simplistic models are used to identify the physics essential to controlling leakage. Corroborated by CFD, these results provide design parameters for applications to within reasonable engineering certainty. Some potential improvements are proposed.

Hendricks, R. C.↗

Stress Compensating Multilayers

We present in-situ stress measurement results for single and multilayer thin-films deposited by magnetron sputtering. In particular, we report on the influence of the material interfaces on the ensuing stress in both the transient and steady-state regimes of film growth. This behavior is used to determine the appropriate thicknesses of the constituent layers that will result in a net tensile stress in multilayers composed of various material combinations. These multilayers can then be used to compensate the compressive integrated stress in single and multilayer EUV and x-ray optical coatings. The use of multilayers to compensate the integrated stress might be advantageous because, unlike single layers of chromium, the roughness is not expected to increase with the total thickness of the multilayer. In this paper, we demonstrate the technique for W/Si and Mo/Si multilayers and discuss its application to other material combinations.

Multilayer↗

Experimental Evaluation of Interfacial Bonding Strength Between 304 Stainless Steel Substrate and Electrodeposited Nickel Coating Using Mesoscale Mechanical Testing Methods

Electrodeposition is a commonly used method for depositing a metal layer on a metallic substrate, to provide a decorative finish or for functional purposes including wear and corrosion resistance. The interfacial bonding strength is a critical factor in determining the quality of electrodeposition, as it ensures the adhesion of the deposited layer to the substrate. Despite its importance, there has not previously been a suitable mechanical testing method to quantitatively characterize the bonding strength between the electrodeposited layers and the substrate, due to the high strength of the materials and to restrictions imposed by the geometry (due to the small thickness of the plating layer) to manufacture tensile bars. In this study, we introduce a novel mesoscale mechanical testing method to overcome these limitations. This technique was applied to assess the bonding strength between a 304 stainless steel (SS) substrate and electrodeposited nickel with three different plating formulae (nickel sulfamate, Watts bath, and hard nickel). The thickness of the pure nickel coatings achieved for each of the three electrolyte solutions was approximately 1 mm on each side of the substrate. Mesoscale tensile bars of 1 mm length were manufactured by a femtosecond laser, with the material interface at the center of the gauge section, and then tensile-tested with digital image correlation. Further, the results proved that the electrodeposition technique is able to produce a very high bonding strength that is close to the yield strength of both the substrate material and the electrodeposited nickel layer. Additionally, in the case of the Watts bath formula, the interfacial bonding strength between the SS 304 and electrodeposited nickel can exceed that of the nickel layer. This method is expected to be useful for quantifying the interfacial bonding strength in numerous applications.

36 MATERIALS SCIENCE↗

Fiber pushout test: A three-dimensional finite element computational simulation

A fiber pushthrough process was computationally simulated using three-dimensional finite element method. The interface material is replaced by an anisotropic material with greatly reduced shear modulus in order to simulate the fiber pushthrough process using a linear analysis. Such a procedure is easily implemented and is computationally very effective. It can be used to predict fiber pushthrough load for a composite system at any temperature. The average interface shear strength obtained from pushthrough load can easily be separated into its two components: one that comes from frictional stresses and the other that comes from chemical adhesion between fiber and the matrix and mechanical interlocking that develops due to shrinkage of the composite because of phase change during the processing. Step-by-step procedures are described to perform the computational simulation, to establish bounds on interfacial bond strength and to interpret interfacial bond quality.

Mital, Subodh K.↗