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DOE OSTI2024

Beyond the Bridge: Contention-Based Covert and Side Channel Attacks on Multi-GPU Interconnect

Recently, high-speed interconnects like NVLink have become a standard integration in modern multi-GPU systems, serving as a crucial bridge between CPUs and GPUs. This study highlights the vulnerability of multi-GPU systems to covert and side-channel attacks arising from congestion on these interconnects. An adversary, operating without special permissions, can extract private information about a victim's activities by monitoring NVLink congestion. Specifically, we leverage this insight to develop a covert channel attack across two GPUs, achieving a respectable bandwidth of 33 Kbps. Additionally, we introduce a side-channel attack that allows attackers to fingerprint applications on a remote GPU by probing the shared NVLink interconnect. We underscore the urgent nature of the threats posed by these attacks and advocate for heightened awareness within both industry and academia to implement multi-GPU interconnects with enhanced security measures.

Zhang, Yicheng↗

DOE OSTI2022

Phase-field simulations of fission gas bubble growth and interconnection in U-(Pu)-Zr nuclear fuel

Abstract The growth and interconnection of fission gas bubbles in the hotter central regions of U-(Pu)-Zr nuclear fuel has been simulated with a phase-field model. The Cahn-Hilliard equation was used to represent the two-phase microstructure, with a single defect species. The volume fraction of the bubble phase and surface area of the bubble-matrix interface were determined during growth and interconnection. Surface area increased rapidly during the initial stages of growth, then slowed and finally decreased as bubble interconnection began and coarsening acted to reduce surface area. The fraction of the bubbles vented to a simulation domain boundary, f V , was quantified as a measure of the microstructure’s interconnectivity and plotted as a function of porosity p . The defect species diffusivity was varied; although changes in diffusivity significantly affected the microstructure, the plots of f V vs. p did not change significantly. The percolation threshold p c was calculated to be approximately 0.26, depending on the assumed diffusivity and using an initial bubble number density based on experimental observations. This is slightly smaller than the percolation threshold for continuum percolation of overlapping 3D spheres. The simulation results were used to parameterize two different engineering-scale swelling models for U-(Pu)-Zr in the nuclear fuel performance code BISON.

Aagesen, Larry K. (ORCID:000000034936676X)↗

DOE OSTI2024

Low loss fiber-coupled volumetric interconnects fabricated via direct laser writing

Photonic integrated circuits (PICs) are vital for high-speed data transmission. However, optical routing is limited in PICs composed of only one or a few stacked planes. Further, coupling losses must be low in deployed systems. Previously, we developed the subsurface controllable refractive index via beam exposure (SCRIBE) technique to write accurate 3D gradient refractive index (GRIN) profiles within a mesoporous silica scaffold. Here, we apply SCRIBE to fabricate low loss, broadband, polarization insensitive, fiber-coupled, single-mode volumetric interconnects that include waveguides traversing arbitrary 3D paths. By seamlessly integrating mode-matching subsurface lenses and GRIN waveguide tapers, calibrating for positional writing errors, implementing multipass exposure, automating alignment, and switching to antireflection coated fibers, we reduced the insertion loss for a fiber-PIC-fiber interconnect from 50 to 2.14 dB, or 1.47 dB, excluding the fiber array’s loss. Further, we establish an upper bound of 0.45 dB loss per coupler. We report quality factors of 27,000 and 77,000 and bending losses of 6 and 3 dB/cm for 15 and 30 µm radii microrings, respectively. We also demonstrate Bézier escalators, polarization-rotating and polarization-splitting interconnects, and a seven-channel 25 µm pitch volumetric interconnect. The SCRIBE platform presents a clear path toward realizing 3D PICs with unique functionality.

Optics↗

DOE OSTI2021

Queued Up: Characteristics of Power Plants Seeking Transmission Interconnection As of the End of 2020

Proposed large-scale electric generation and storage projects must apply for interconnection to the bulk power system via interconnection queues. While many projects that apply for interconnection are not subsequently built, data from these queues nonetheless provide a general indicator for mid-term trends in developer interest. Berkeley Lab compiled and analyzed data from all seven ISOs/RTOs in concert with 35 non-ISO utilities, representing an estimated 85% of all U.S. electricity load. We include all "active" projects in these generation interconnection queues through the end of 2020, as well as data on "completed" and "withdrawn" projects for five of the ISOs (CAISO, ISO-NE, MISO, NYISO, PJM). We find that the total capacity active in the queues is growing year-over-year, with over 750 GW of generation and an estimated 200 GW of storage capacity as of the end of 2020. Solar (462 GW) accounts for a large – and growing – share of generator capacity in the queues. Substantial wind (209 GW) capacity is also in development, 29% of which is for offshore projects (61 GW). In total, about 680 GW of zero-carbon capacity is currently seeking transmission access, as is 74 GW of natural gas capacity. Hybrids now comprise a large – and increasing – share of proposed projects, particularly in CAISO and the non-ISO West. 159 GW of solar hybrids (primarily solar+battery) and 13 GW of wind hybrids are currently active in the queues. However, much of this proposed capacity will not ultimately be built. Among a subset of queues for which data are available, only 24% of the projects seeking connection from 2000 to 2015 have subsequently been built. Completion percentages appear to be declining, and are even lower for wind and solar than other resources. Additionally, wait times are on the rise: in four ISOs, the typical duration from connection request to commercial operation increased from ~1.9 years for projects built in 2000-2009 to ~3.5 years for those built in 2010-2020. There are growing calls for queue reform to reduce cost, lead times, and speculation.

24 POWER TRANSMISSION AND DISTRIBUTION↗

DOE OSTI2021

Seamless Hybrid-integrated Interconnect NEtwork (SHINE)

Large-scale date centers are becoming increasingly limited by the capacity of interconnects due to the rapid increasing power consumption and bandwidth demands driven by the rigorous down scaling of CMOS critical dimensions in according with the Moore’s Law. As a result of the continuing bandwidth scaling, optical interconnects based on parallel optics, where data are simultaneously transmitted along more than one lane, have becoming a preferred interconnected solution over copper cables. To building an efficient optical interconnect system, optical coupling between different elements, such as optical fibers, photonics chips, is a critical step, which is challenging due to the mode mismatch of varies optical ports. In this project, we proposed and demonstrated an optical interfacing scheme, which provided a light coupling approach with low energy loss, broadband operation, high alignment tolerance and compatible with scalable fabrication and testing. Here, the mode transformation is achieved by a total internal reflection from a chip integrated microscale freefrom surface. Due to the enormous light wavefront manipulating ability associated with the gigantic design space, the freeform couplers platform is universally applicable to a wide range of optical coupling scenarios, such as the interfacing between a waveguide to a fiber, another waveguide, surface normal device, or free space.

42 ENGINEERING↗

DOE OSTI2024

Distributed Energy Resource Interconnection Roadmap

Adopting strategic reforms to DER interconnection can help reduce interconnection delays, fairly allocate costs, improve transparency and equity, and support efficient and strategic investment in distribution and sub-transmission grids that can accommodate a rapidly evolving energy landscape. The Interconnection Innovation e-Xchange envisions this roadmap and its transmission system companion volume as collaborative resources to facilitate continued stakeholder discussions, problem-solving, and innovation as the U.S. works together to enable simpler, faster, and fairer interconnection of clean energy resources all while enhancing the reliability, resiliency, and security of our electric grid.

24 POWER TRANSMISSION AND DISTRIBUTION↗

DOE OSTI2025

IM3 Projected U.S. Western Interconnection Grid Stress Dataset

This dataset provides projected grid stress and reliability results (including all model inputs and outputs from GO WEST and TEP) for Integrated Multisector, Multiscale Modeling (IM3) Phase 2 simulations across eight different scenarios for the U.S. Western Interconnection through 2055. The scenarios include combinations of two Shared Socioeconomic Pathways (SSP3 and SSP5) with four high-resolution climate projections specific to the United States from a set of Thermodynamic Global Warming (TGW) simulations. These climate projections include "hotter" and "cooler" variants for two Representative Concentration Pathways (RCP4.5 and RCP8.5). The resulting eight simulations are: rcp45cooler_ssp3 rcp45cooler_ssp5 rcp45hotter_ssp3 rcp45hotter_ssp5 rcp85cooler_ssp3 rcp85cooler_ssp5 rcp85hotter_ssp3 rcp85hotter_ssp5 GO WEST is an open-source power grid modeling framework for the U.S. Western Interconnection, which allows users to tailor the model depending on their research study and science questions. It covers 28 balancing authorities (BAs) and 12 states in U.S. Western Interconnection. GO WEST allows users to select different number of nodes and come up with a simplified network by utilizing 10,000 nodal topology of the U.S. Western Interconnection (ACTIVSg10k). Users can select different number of nodes, mathematical formulations (linear programming vs. mixed-integer linear programming), transmission line limit scaling factors, and hurdle rate scaling factors. GO WEST offers a unit commitment and economic dispatch (UC/ED) module to simulate grid operations on an hourly scale. In this sense, users can calibrate and validate their model versions by comparing model outputs to historical datasets. TEP is an open-source transmission capacity expansion model, built on the GO WEST framework. It utilizes linear programming to optimize transmission capacity addition investment on existing lines within the GO WEST framework. The TEP model only increases the thermal capacity of existing transmission lines and does not add new lines to the system, which leaves the topology preserved. In order to use TEP model, users need to create scenarios with the GO WEST framework. Please refer to README file for a detailed description of the dataset including individual files and references.

Capacity Expansion Model↗

NASA NTRS1977

Transequatorial loops interconnecting McMath regions 12472 and 12474

The paper reviews the life history of one transequatorial loop in a system observed in soft X-rays for at least 1.5 days and which interconnected a newly born active region with an old region. The birth of the selected loop is discussed along with properties of the interconnected active regions, sharpening and brightening of the loop, decay of the loop system, and physical relations between the interconnected regions. It is concluded that: (1) the loop was most probably born via reconnection of magnetic-field lines extending from the two active regions toward the equator, which occurred later than 33 hr after the younger region was born; (2) the fully developed interconnection was composed of several loops, all of which appeared to be rooted in a spotless magnetic hill of preceding northern polarity but were spread over two separate spotty regions of southern polarity in the magnetically complex new region; (3) the loop electron temperature increased from 2.1 million to 3.1 million K in one to three hours when the loop system brightened; and (4) the loops became twisted during the brightening, possibly due to their rise in the corona while remaining rooted in moving magnetic features in the younger region.

Svestka, Z.↗

NASA NTRS1981

Transient brightenings of interconnecting loops. II - Dynamics of the brightened loops

Three different kinds of dynamic events related to interconnecting loops observed in soft X-rays aboard Skylab are discussed: (1) a newly born transequatorial loop that was either emerging from subphotospheric layers or gradually filled in with hot plasma; (2) large-scale twists of interconnecting loops which never relax, and often only form after the loop brightenings, and (3) three events where the loop that later interconnected two active regions had been visible long before one of the interconnecting regions was born. Several impacts this observation might have upon the understanding of the process of flux emergence are suggested.

Svestka, Z.↗

NASA NTRS1982

Design solutions for the solar cell interconnect fatigue fracture problem

Mechanical fatigue of solar cell interconnects is a major failure mechanism in photovoltaic arrays. A comprehensive approach to the reliability design of interconnects, together with extensive design data for the fatigue properties of copper interconnects, has been published. This paper extends the previous work, developing failure prediction (fatigue) data for additional interconnect material choices, including aluminum and a variety of copper-Invar and copper-steel claddings. An improved global fatigue function is used to model the probability-of-failure statistics of each material as a function of level and number of cycles of applied strain. Life-cycle economic analyses are used to evaluate the relative merits of each material choce. The copper-Invar clad composites demonstrate superior performance over pure copper. Aluminum results are disappointing.

Mon, G. R.↗

NASA NTRS1987

Implementation of optical interconnections for VLSI

This paper reports on the progress in implementing optical interconnections for VLSI. Four areas are covered: (1) the holographic optical element (HOE), (2) the laser sources, (3) the detectors and associated circuits forming an optically addressed gate, and (4) interconnection experiments in which five gates are actuated from one source. A laser scanner system with a resolution of 12 x 20 microns has been utilized to generate the HOEs. Diffraction efficiency of the HOE and diffracted spot size have been measured. Stock lasers have been modified with a high-frequency package for interconnect experiments, and buried heterostructure fabrication techniques have been pursued. Measurements have been made on the fabricated photodetectors to determine dark current, responsivity, and response time. The optical gates and the overall chip have been driven successfully with an input light beam, as well as with the optical signal interconnected through the one to five holograms.

Wu, Wennie H.↗

NASA NTRS1990

Optical interconnections and networks; Proceedings of the Meeting, The Hague, Netherlands, Mar. 14, 15, 1990

The conference presents papers on interconnections, clock distribution, neural networks, and components and materials. Particular attention is given to a comparison of optical and electrical data interconnections at the board and backplane levels, a wafer-level optical interconnection network layout, an analysis and simulation of photonic switch networks, and the integration of picosecond GaAs photoconductive devices with silicon circuits for optical clocking and interconnects. Consideration is also given to the optical implementation of neural networks, invariance in an optoelectronic implementation of neural networks, and the recording of reversible patterns in polymer lightguides.

Bartelt, Hartmut↗

NASA NTRS2005

Process Developed for Generating Ceramic Interconnects With Low Sintering Temperatures for Solid Oxide Fuel Cells

Solid oxide fuel cells (SOFCs) have been considered as premium future power generation devices because they have demonstrated high energy-conversion efficiency, high power density, and extremely low pollution, and have the flexibility of using hydrocarbon fuel. The Solid-State Energy Conversion Alliance (SECA) initiative, supported by the U.S. Department of Energy and private industries, is leading the development and commercialization of SOFCs for low-cost stationary and automotive markets. The targeted power density for the initiative is rather low, so that the SECA SOFC can be operated at a relatively low temperature (approx. 700 C) and inexpensive metallic interconnects can be utilized in the SOFC stack. As only NASA can, the agency is investigating SOFCs for aerospace applications. Considerable high power density is required for the applications. As a result, the NASA SOFC will be operated at a high temperature (approx. 900 C) and ceramic interconnects will be employed. Lanthanum chromite-based materials have emerged as a leading candidate for the ceramic interconnects. The interconnects are expected to co-sinter with zirconia electrolyte to mitigate the interface electric resistance and to simplify the processing procedure. Lanthanum chromites made by the traditional method are sintered at 1500 C or above. They react with zirconia electrolytes (which typically sinter between 1300 and 1400 C) at the sintering temperature of lanthanum chromites. It has been envisioned that lanthanum chromites with lower sintering temperatures can be co-fired with zirconia electrolyte. Nonstoichiometric lanthanum chromites can be sintered at lower temperatures, but they are unstable and react with zirconia electrolyte during co-sintering. NASA Glenn Research Center s Ceramics Branch investigated a glycine nitrate process to generate fine powder of the lanthanum-chromite-based materials. By simultaneously doping calcium on the lanthanum site, and cobalt and aluminum on the chromium site, we could sinter the materials below 1400 C. The doping concentrations were adjusted so that the thermal expansion coefficient matched that of the zirconia electrolyte. Also, the investigation was focused on stoichiometric compositions so that the materials would have better stability. Co-sintering and chemical compatibility with zirconia electrolyte were examined by X-ray diffraction, scanning electron microscopy, and energy dispersive spectroscopy (line scanning and dot map). The results showed that the materials bond well, but do not react, with zirconia electrolyte. The electric conductivity of the materials measured at 900 C in air was about 20 S/cm.

Zhong, Zhi-Min↗

NASA NTRS2004

Electrode and interconnect for miniature fuel cells using direct methanol feed

An improved system for interconnects in a fuel cell. In one embodiment, the membranes are located in parallel with one another, and current flow between them is facilitated by interconnects. In another embodiment, all of the current flow is through the interconnects which are located on the membranes. The interconnects are located between two electrodes.

Narayanan, Sekharipuram R.↗

NASA NTRS2009

Free-Space Optical Interconnect Employing VCSEL Diodes

Sensor signal processing is widely used on aircraft and spacecraft. The scheme employs multiple input/output nodes for data acquisition and CPU (central processing unit) nodes for data processing. To connect 110 nodes and CPU nodes, scalable interconnections such as backplanes are desired because the number of nodes depends on requirements of each mission. An optical backplane consisting of vertical-cavity surface-emitting lasers (VCSELs), VCSEL drivers, photodetectors, and transimpedance amplifiers is the preferred approach since it can handle several hundred megabits per second data throughput.The next generation of satellite-borne systems will require transceivers and processors that can handle several Gb/s of data. Optical interconnects have been praised for both their speed and functionality with hopes that light can relieve the electrical bottleneck predicted for the near future. Optoelectronic interconnects provide a factor of ten improvement over electrical interconnects.

Simons, Rainee N.↗

DOE OSTI2024

Encoding of symbols for a computer interconnect based on frequency of symbol values

Data are serially communicated over an interconnect between an encoder and a decoder. The encoder includes a first training unit to count a frequency of symbol values in symbol blocks of a set of N number of symbol blocks in an epoch. A circular shift unit of the encoder stores a set of most-recently-used (MRU) amplitude values. An XOR unit is coupled to the first training unit and the first circular shift unit as inputs and to the interconnect as output. A transmitter is coupled to the encoder XOR unit and the interconnect and thereby contemporaneously sends symbols and trains on the symbols. In a system, a device includes a receiver and decoder that receive, from the encoder, symbols over the interconnect. The decoder includes its own training unit for decoding the transmitted symbols.

SeyedzadehDelcheh, SeyedMohammad↗

DOE OSTI2024

Foundations for the Future Power System: Inverter-Based Resource Interconnection Standards

As power systems evolve to become reliant on solar, wind, batteries, and other inverter-based resources (IBRs), it is essential that those resources meet certain minimum performance and capability criteria designed to ensure the power system operates stably and reliably. Because those criteria, as enshrined in interconnection standards, take years to develop and are very long lived, they need to account for not only the present state of the power system but also its expected future state over the lifetime of the power plants to which they will apply. In addition, they need to be specific enough to ensure reliability without over specifying and, thereby, impeding innovation. Because power systems are shifting rapidly from a state where IBRs make up a small to medium portion of generation to one where the generation will, at times, come predominantly from IBRs, interconnection standards are especially challenging to develop today. Good interconnection standards can make the power system more reliable and less costly to operate, whereas poorly designed standards can lead to major problems, like the famous German 50.2-Hz problem, which introduced a risk of losing many gigawatts of solar on a frequency excursion and resulted in many IBRs being retrofitted at great cost to mitigate a major system reliability risk. Readying the power system by specifying forward-looking technical minimum functional capabilities for IBRs can be an effective approach to avoid future retrofits.

data models↗

DOE OSTI2020

The Value of Increased HVDC Capacity Between Eastern and Western U.S. Grids: The Interconnections Seam Study

The Interconnections Seam Study examines the potential economic value of increasing electricity transfer between the Eastern and Western Interconnections using high-voltage direct-current (HVDC) transmission and cost-optimizing both generation and transmission resources across the United States. The study conducted a multi-model analysis that used co-optimized generation and transmission expansion planning and production cost modeling. Four transmission designs under eight scenarios were developed and studied to estimate costs and potential benefits. The results show benefit-to-cost ratios that reach as high as 2.9, indicating significant value to increasing the transmission capacity between the interconnections under the cases considered, realized through sharing generation resources and flexibility across regions.

13 HYDRO ENERGY↗