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All sourcesNASA NTRSDOE OSTI
NASA NTRS1999

MEMS Reliability Assurance Guidelines for Space Applications

This guide is a reference for understanding the various aspects of microelectromechanical systems, or MEMS, with an emphasis on device reliability. Material properties, failure mechanisms, processing techniques, device structures, and packaging techniques common to MEMS are addressed in detail. Design and qualification methodologies provide the reader with the means to develop suitable qualification plans for the insertion of MEMS into the space environment.

Stark, Brian↗
NASA NTRS2000

Coupling, Q-Factor, and Integration Aspects of Microsphere Applications

With suggested applications varying from microlaser and cavity QED through optical locking of diode lasers to modulators and sensors, high-Q silica microspheres with whispering-gallery (WG) modes so far remain the subject of tabletop feasibility demonstrations. Despite the uniquely high quality-factor and submillimeter dimensions suitable for tight packaging, this novel type of high-finesse cavity still has to be adapted to fiber- and integrated-optic hardware. In the visible and near infrared-band experiments (633-850nm) measuring the ringdown time tau of free oscillations, Q = (0.6 to 0.8 ) x 10(exp 10) has been obtained in silica spheres of diameter -800 microns (corresponding tau = 3 to 4 microseconds). It was proved that under normal laboratory conditions, quality-factor is subject to deterioration within several-minute scale down to (2 ... 3 ) x 10(exp 9). The responsible mechanism was identified as adsorption of a monolayer of atmospheric water, so that preservation of the ultimate Q requires manipulation in dry environment, or fast packaging into sealed devices. Larger Q can be expected closer to minimum of attenuation in fused silica alpha = 0.2 dB/km; Q greater than or equal to 1 x 10(exp 11) at lambda=1.55 microns, with corresponding energy storage time tau approx. 0.1ms. Experiments are currently underway to determine whether this high Q can be realized experimentally. The evident difficulty is that OH-related optical absorption has its peaks located near the reported minimum of attenuation in silica. We can also mention here that some of proposed fiber materials, yet not ready for fiber drawing, have been predicted to have smaller attenuation than fused silica and may be suitable for microsphere fabrication (sodium-magnesium silicate glass, alpha = 0.06dB/km). WG modes possess very small radiative loss (it does not prevent Q-10(exp 20) and more) and therefore are electromagnetically isolated and cannot be excited by free-space beams. If no modification (such as grating) is made on the sphere surface, the coupling has to he provided by an appropriate near-field device. A systematic theoretical approach has been recently developed to quantify the performance of near-field couplers for WG modes. Efficient coupling can be obtained upon fulfillment of two main conditions: (1) mode matching and (2) sufficient coupling strength to provide the buildup of a WG mode with a given intrinsic loss. In other words, the wave in the coupler has to be phase-matched and sufficiently overlapped with the WG mode to provide enough buildup in the cavity. If the coupling efficiency is characterized by the fractional depth K(sup 2) of the resonance dip in intensity transmittance observed upon varying the frequency of the exciting wave in the coupler.

Ilchenko, V. S.↗
NASA NTRS2006

Cryogenic Cooling for Myriad Applications-A STAR Is Born

Cryogenics, the science of generating extremely low temperatures, has wide applicability throughout NASA. The Agency employs cryogenics for rocket propulsion, high-pressure gas supply, breathable air in space, life support equipment, electricity, water, food preservation and packaging, medicine, imaging devices, and electronics. Cryogenic liquid oxygen and liquid hydrogen systems are also replacing solid rocket motor propulsion systems in most of the proposed launch systems, a reversion to old-style liquid propellants. In the late 1980s, NASA wanted a compact linear alternator/motor with reduced size and mass, as well as high efficiency, that had unlimited service life for use in a thermally driven power generator for space power applications. Prior development work with free-piston Stirling converters (a Stirling engine integrated with a linear actuator that produces electrical power output) had shown the promise of that technology for high-power space applications. A dual use for terrestrial applications exists for compact Stirling converters for onsite combined heat and power units. The Stirling cycle is also usable in reverse as a refrigeration cycle suitable for cryogenic cooling, so this Stirling converter work promised double benefits as well as dual uses. The uses for cryogenic coolers within NASA abound; commercial applications are similarly wide-ranging, from cooling liquid oxygen and nitrogen, to cryobiology and bio-storage, cryosurgery, instrument and detector cooling, semiconductor manufacturing, and support service for cooled superconducting power systems.

Source record↗
NASA NTRS2010

Photonic Choke-Joints for Dual-Polarization Waveguides

Photonic choke joint (PCJ) structures for dual-polarization waveguides have been investigated for use in device and component packaging. This interface enables the realization of a high performance non-contacting waveguide joint without degrading the in-band signal propagation properties. The choke properties of two tiling approaches, symmetric square Cartesian and octagonal quasi-crystal lattices of metallic posts, are explored and optimal PCJ design parameters are presented. For each of these schemes, the experimental results for structures with finite tilings demonstrate near ideal transmission and reflection performance over a full waveguide band.

Wollack, Edward J.↗
NASA NTRS2018

SiAl Alloy Feedhorn Arrays: Material Properties, Feedhorn Design, and Astrophysical Applications

We present here a study of the use of the SiAl alloy CE7 for the packaging of silicon devices at cryogenic temperatures. We report on the development of baseplates and feedhorn arrays for millimeter wave bolometric detectors for astrophysics. Existing interfaces to such detectors are typically made either of metals, which are easy to machine but mismatched to the thermal contraction profile of Si devices, or of silicon, which avoids the mismatch but is difficult to directly machine. CE7 exhibits properties of both Si and Al, which makes it uniquely well suited for this application. We measure CE7 to a) superconduct below a critical transition temperature, T (sub c), 1.2 K, b) have a thermal contraction profile much closer to Si than metals, which enables simple mating, and c) have a low thermal conductivity which can be improved by Au-plating. Our investigations also demonstrate that CE7 can be machined well enough to fabricate small structures, such as #0-80 threaded holes, to tight tolerances (approximately 25 microns) in contrast with pure silicon and similar substrates. We have fabricated CE7 baseplates being deployed in the 93 gigahertz polarimetric focal planes used in the Cosmology Large Angular Scale Surveyor (CLASS). We also report on the development of smooth-walled feedhorn arrays made of CE7 that will be used in a focal plane of dichroic 150/220 gigahertz detectors for the CLASS High-Frequency camera.

Ali, Aamir M.↗
NASA NTRS1995

BIB mixers

We have determined that the multi-pin 'microprocessor style' packages in which current Blocked Impurity Band (BIB) devices are mounted will not meet our IF bandwidth spec of greater than 2 GHz for a practical mixer. Hence we have started to repackage the Ga:Ge BIB devices in new microwave compatible packages. The smaller size of the microwave package mount necessitates cutting the BIB array down to include only the 3 smallest detectors: 0.2, 0.4, and 0.6 mm sq. A FIR beam incident at f/1.5 can be focussed on the smallest element for wavelengths shorter than 100 microns. A more typical (easier) beam convergence of f/3 will require 0.4 mm elements at 100 microns and 0.6 mm elements at 170 microns wavelength. Since the device capacitance (parasitic loss) scales with detector size, there is a tradeoff of speed of response and optical convenience. Our existing optics produce only the slower convergence beam, so we need to redesign the optical layout and are looking at long focal length all-reflective microscope objectives. BIB detectors and the edge-coupled microbolometers have restricted IF bandwidths, an order of magnitude less than what is possible with the Schottky-diode mixers we currently use for astronomical observations. Consequently the frequencies of the FIR laser lines must be close to the astronomical line of interest to be an effective Local Oscillator (LO). We have therefore begun a coordinated effort to discover and measure new FIR laser transition lines in close frequency coincidence with important astrophysical lines. Most of this effort involves pumping isotopic variants of known good laser molecules with laser lines from isotopic variants of CO2. We have been most successful in detecting new FIR lines in deuterated ammonia. One line in particular is very close to the frequency of HD rotational line at 2675 GHz.

Source record↗
NASA NTRS2006

Sensor Amplifier for the Venus Ground Ambient

Previous Venus Landers employed high temperature pressure vessels, with thermally protected electronics, to achieve successful missions, with a maximum surface lifetime of 127 minutes. Extending the operating range of electronic systems to the temperatures (480 C) and pressures (90 bar) of the Venus ground ambient would significantly increase the science return of future missions. Toward that end, the current work describes the innovative design of a sensor preamplifier, capable of working in the Venus ground ambient and designed using commercial components (thermionic vacuum tubes, wide band gap transistors, thick film resistors, advanced high temperature capacitors, and monometallic interfaces) To identify commercial components and electronic packaging materials that are capable of operation within the specified environment, a series of active devices, passive components, and packaging materials were screened for operability at 500C, assuming a 10x increase in the mission lifetime. In addition. component degradation as a function of time at 500(deg)C was evaluated. Based on the results of these preliminary evaluations, two amplifiers were developed.

Venus electronics↗
NASA NTRS2000

Technical Challenges in Reliable Microelectronics Packaging of Microelectromechanical Systems (MEMS) for Space Applications

MEMS have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, chemical sensors, artificial nose, etc. Standard semiconductor microelectronics packaging needs the integrated circuits (IC) to be protected from the harsh environment, and provide electrical communication with the other parts of the circuit, facilitate thermal dissipation efficiently, and impart mechanical strength to the silicon die. Microelectronics packaging involves wafer dicing, bonding, lead attachment, encapsulation to protect from the environment, electrical integrity, and package leak tests to assure the reliable IC packaging technology. Active elements or microstructures in MEMS devices often interfaces with the hostile environment where packaging leak tests and testing of such devices using chemical and mechanical parameters will be very difficult and expensive. Packaging of MEMS is significantly complex as they serve to protect from the environment and microstructures interact with the same environment to measure or affect the desired physical or chemical parameters. The most of the silicon circuitry is sensitive to temperature, moisture, magnetic field, light, and electromagnetic interference. The package must then protect the on-board silicon circuitry while simultaneously exposing the microsensor to the effect it measures to assure the packaging technology of MEMS. MEMS technology has a major application in developing a microspacecraft for space systems provided reliability of MEMS packaging technology is sufficiently addressed. This MEMS technology would eventually miniaturize many of the components of the spacecraft to reach the NASA's goal by building faster, cheaper, better, smaller spacecraft to explore the space more effectively. This paper discusses the latest developments in the MEMS technology and challenging technical issues in the packaging of hermetically sealed and non-hermetically sealed MEMS sensor devices for microspacecraft applications.

Ramesham, Rajeshuni↗
NASA NTRS2004

High-Temperature Probe Station Developed to Characterize Microwave Devices Through 500 C

A photograph and a block diagram of the high-temperature probe station are shown. The system consists of the ceramic heater mounted on a NASA shuttle tile insulator, a direct current power supply, a personal-computer-based data acquisition and temperature controller, microwave probes, a microscope, and a network analyzer. The ability to perform microwave tests at high temperatures is becoming necessary. There is now a need for sensors and communication circuits that can operate at 500 C and above for aircraft engine development and monitoring during flight. To address this need, researchers have fabricated devices using wide bandgap semiconductors such as SiC with targeted operating temperatures of 500 to 600 C. However, the microwave properties of these devices often change drastically with temperature, so any designs that are intended to be used in such an environment must be characterized at high temperatures. For some reliability, lifetime, and direct-current testing, the device under test can be packaged and characterized in an oven. However, for RF and microwave measurements, it is usually not possible to establish a calibrated reference plane at the device terminals within a package. In addition, the characteristics of the package would vary over a 500 C temperature range, and this would have to be accounted for when the data were analyzed. A high temperature probe station allows circuits and devices to be characterized through on wafer measurements across a broad temperature range with known reference plane. The conventional, commercially available thermal wafer-probe stations that are used to evaluate microwave devices across a controlled temperature range have a typical upper limit of 200 C. Standalone thermal heating chucks are available with an extended upper temperature range of 300 to 400 C. To effectively characterize devices at temperatures up to and surpassing 500 C, Glenn researchers developed a custom probe station. In the past, custom probe stations have been developed to test devices under other extreme environments, such as cryogenic temperatures as low as 37 K. Similarly, this custom probe station was specifically modified for high-temperature use. It allows devices to be measured quickly and flexibly, without the use of wire bonds and test fixtures. The probe station is shown making scattering parameter measurements from 1 to 50 GHz with a Hewlett-Packard 8510C Network Analyzer. There is a half-wafer of silicon directly on top of the heater to provide a uniform heated platform for our sample. A quarter wafer of silicon carbide forms the substrate for our test circuit of several transmission lines.

Downey, Alan N.↗
NASA NTRS2016

Regrowth-Free Mid-Infrared Distributed Feedback Quantum Cascade Lasers with Sub-Watt Power Consumption

We report on room-temperature, continuous-wave operation of single-mode quantum cascade lasers designed for minimal threshold power consumption in the 4 to 10 µm spectral range. Narrow-ridge distributed feedback lasers were developed with plasma-etched sidewall corrugations and infrared-transparent dielectric cladding, enabling fabrication without any epitaxial steps beyond the initial growth of the planar laser wafer. The devices exhibit single-mode emission with stable, mode-hop-free tuning and side-mode suppression greater than 25 dB. We demonstrate packaged single-mode devices with continuous-wave threshold power consumption near 1 W above room temperature.

infrared absorption spectroscopy↗
NASA NTRS1995

Advanced packaging for Integrated Micro-Instruments

The relationship between packaging, microelectronics, and micro-electrical-mechanical systems (MEMS) is an important one, particularly when the edges of performance boundaries are pressed, as in the case of miniaturized systems. Packaging is a sort of physical backbone that enables the maximum performance of these systems to be realized, and the penalties imposed by conventional packing approaches is particularly limiting for MEMS devices. As such, advanced packaging approaches, such as multi-chip modules (MCM's) have been touted as a true means of electronic 'enablement' for a variety of application domains. Realizing an optimum system of packaging, however, in not as simple as replacing a set of single chip packages with a substrate of interconnections. Research at Phillips Laboratory has turned up a number of integrating options in the two- and three-dimensional rending of miniature systems with physical interconnection structures with intrinsically high performance. Not only do these structures motivate the redesign of integrated circuits (IC's) for lower power, but they possess interesting features that provide a framework for the direct integration of MEMS devices. Cost remains a barrier to the application of MEMS devices, even in space systems. Several innovations are suggested that will result in lower cost and more rapid cycle time. First, the novelty of a 'constant floor plan' MCM which encapsulates a variety of commonly used components into a stockable, easily customized assembly is discussed. Next, the use of low-cost substrates is examined. The anticipated advent of ultra-high density interconnect (UHDI) is suggested as the limit argument of advanced packaging. Finally, the concept of a heterogeneous 3-D MCM system is outlined that allows for the combination of different compatible packaging approaches into a uniformly dense structure that could also include MEMS-based sensors.

Lyke, James L.↗
NASA NTRS2007

An Overview of Wide Bandgap Silicon Carbide Sensors and Electronics Development at NASA Glenn Research Center

A brief overview is presented of the sensors and electronics development work ongoing at NASA Glenn Research Center which is intended to meet the needs of future aerospace applications. Three major technology areas are discussed: 1) high temperature SiC electronics, 2) SiC gas sensor technology development, and 3) packaging of harsh environment devices. Highlights of this work include world-record operation of SiC electronic devices including 500?C JFET transistor operation with excellent properties, atomically flat SiC gas sensors integrated with an on-chip temperature detector/heater, and operation of a packaged AC amplifier. A description of the state-of-the-art is given for each topic. It is concluded that significant progress has been made and that given recent advancements the development of high temperature smart sensors is envisioned.

Hunter, Gary W.↗
NASA NTRS1996

Analysis of space radiation data of semiconductor memories

This article presents an analysis of radiation effects for several select device types and technologies aboard the Combined Release and Radiation Effects Satellite (CRRES) satellite. These space-flight measurements covered a period of about 14 months of mission lifetime. Single Event Upset (SEU) data of the investigated devices from the Microelectronics Package (MEP) were processed and analyzed. Valid upset measurements were determined by correcting for invalid readings, hard failures, missing data tapes (thus voids in data), and periods over which devices were disabled from interrogation. The basic resolution time of the measurement system was confirmed to be 2 s. Lessons learned, important findings, and recommendations are presented.

Flight Experiment↗
NASA NTRS1979

Circuit Connectors

The U-shaped wire devices in the upper photo are Digi-Klipsm; aids to compact packaging of electrical and electronic devices. They serve as connectors linking the circuitry of one circuit board with another in multi-board systems. Digi-Klips were originally developed for Goddard Space Flight Center to meet a need for lightweight, reliable connectors to replace hand-wired connections formerly used in spacecraft. They are made of beryllium copper wire, noted for its excellent conductivity and its spring-like properties, which assure solid electrical contact over a long period of time.

Source record↗
NASA NTRS2001

NASA Electronic Parts and Packaging (NEPP): Space Qualification Guidelines of Optoelectronic and Photonic Devices for Optical Communication Systems

Key elements of space qualification of opto-electric and photonic optical devices were overviewed. Efforts were concentrated on the reliability concerns of the devices needed for potential applications in space environments. The ultimate goal for this effort is to gradually establish enough data to develop a space qualification plan of newly developed specific photonic parts using empirical and numerical models to assess the life-time and degradation of the devices for potential long term space missions.

Kim, Quiesup↗
NASA NTRS1977

A condensed form of NASTRAN

The Interactive Graphics Finite Element System, IGFES, is described along with its supporting analysis software, graphics terminal support package and hardware configurations. IGFES provides an interactive design tool for structural engineers via pre- and postprocessing of finite element data. The system currently runs on an IBM 360/44 OS-MFT system or a PDP 11/40 DOS/BATCH system. Graphics devices are supported using an inhouse developed, device independent terminal support package. Support is available for the Calcomp 563 drum plotter, Tektronix 4002A storage display terminal and the Lundy Electronics 20 inch standalone refresh display system. IGFES and its associated systems are written in FORTRAN IV.

Rogers, J. L., Jr.↗
NASA NTRS2003

Removal of Biologically Active Organic Contaminants using Atomic Oxygen

Biomedical devices that are to come into contact with living tissue, such as prosthetic and other implants for the human body and the containers used to store and transport them, are together cleaned of non-living, but biologically active organic materials, including endotoxins such as lipopolysaccharides, and assembled into a hermetically sealed package without recontamination. This is achieved by cleaning both the device and package components together in an apparatus, which includes a hermetically sealed chamber, in which they are contacted with atomic oxygen which biocleans them, by oxidizing the biologically active organic materials. The apparatus also includes means for manipulating the device and container and hermetically sealing the cleaned device into the cleaned container to form the package. A calibrated witness coupon visually indicates whether or not the device and container have received enough exposure to the atomic oxygen to have removed the organic materials from their surfaces. Gamma radiation is then used to sterilize the device in the sealed container.

Bruce A Banks↗