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At least 91 records · Page 5

Comparison of IC and MEMS packaging reliability approaches

This paper reviews the current status of IC and MEMS packaging technology with emphasis on reliability, compares the norm for IC packaging reliability evaluation and identifies challenges for development of reliability methodologies for MEMS, and finally, proposes the use of COTS MEMS in order to start generating statistically meaningful reliability data as a vehicle for future standardization of reliability test methodology for MEMS packaging.

microelectromechanical systems (MEMS) chip scale p↗

Review of Stack CSP Technologies

CSP is an emerging technology with significant potential growth in stacking. Many of the stacking techniques for conventional packages could be implemented for CSP once materials, process, and system development for finer features are developed.

3D CSP stack CSP Chip Scale Package MCM Mulitchip ↗

A system for the functional testing and simulation of custom and semicustom VLSI chips

A system for the functional testing and simulation of custom and semicustom very large scale integrated (VLSI) chips that are designed using the integrated UNIX-based computer-aided design (CAD) system is described. The testing and simulation system consists of two parts. One of these is a special purpose hardware device that is capable of controlling the digital imputs and outputs on a custom chip. This device, the Digital Microcircuit Functionality Tester (DMFT) system, can be operated by itself or in conjunction with the VAX host computer on the CAD system. The DMFT is integrated into a microprobe station so that these signals can be injected or read from nodes inside the chip, as well as at the pins. The second part of the system is a software package that is installed on the VAX. This software package, logic, includes a full-screen editor for developing chip test sequences and drivers for both the DMFT and the esim logic simulator.

Olson, E. M.↗

On testing VLSI chips for the big Viterbi decoder

A general technique that can be used in testing very large scale integrated (VLSI) chips for the Big Viterbi Decoder (BVD) system is described. The test technique is divided into functional testing and fault-coverage testing. The purpose of functional testing is to verify that the design works functionally. Functional test vectors are converted from outputs of software simulations which simulate the BVD functionally. Fault-coverage testing is used to detect and, in some cases, to locate faulty components caused by bad fabrication. This type of testing is useful in screening out bad chips. Finally, design for testability, which is included in the BVD VLSI chip design, is described in considerable detail. Both the observability and controllability of a VLSI chip are greatly enhanced by including the design for the testability feature.

Hsu, I. S.↗

Advanced techniques and technology for efficient data storage, access, and transfer

Advanced techniques for efficiently representing most forms of data are being implemented in practical hardware and software form through the joint efforts of three NASA centers. These techniques adapt to local statistical variations to continually provide near optimum code efficiency when representing data without error. Demonstrated in several earlier space applications, these techniques are the basis of initial NASA data compression standards specifications. Since the techniques clearly apply to most NASA science data, NASA invested in the development of both hardware and software implementations for general use. This investment includes high-speed single-chip very large scale integration (VLSI) coding and decoding modules as well as machine-transferrable software routines. The hardware chips were tested in the laboratory at data rates as high as 700 Mbits/s. A coding module's definition includes a predictive preprocessing stage and a powerful adaptive coding stage. The function of the preprocessor is to optimally process incoming data into a standard form data source that the second stage can handle.The built-in preprocessor of the VLSI coder chips is ideal for high-speed sampled data applications such as imaging and high-quality audio, but additionally, the second stage adaptive coder can be used separately with any source that can be externally preprocessed into the 'standard form'. This generic functionality assures that the applicability of these techniques and their recent high-speed implementations should be equally broad outside of NASA.

Rice, Robert F.↗

An Integrated Unix-based CAD System for the Design and Testing of Custom VLSI Chips

A computer aided design (CAD) system that is being used at the Jet Propulsion Laboratory for the design of custom and semicustom very large scale integrated (VLSI) chips is described. The system consists of a Digital Equipment Corporation VAX computer with the UNIX operating system and a collection of software tools for the layout, simulation, and verification of microcircuits. Most of these tools were written by the academic community and are, therefore, available to JPL at little or no cost. Some small pieces of software have been written in-house in order to make all the tools interact with each other with a minimal amount of effort on the part of the designer.

Deutsch, L. J.↗

Design, processing and testing of LSI arrays, hybrid microelectronics task

Mathematical cost models previously developed for hybrid microelectronic subsystems were refined and expanded. Rework terms related to substrate fabrication, nonrecurring developmental and manufacturing operations, and prototype production are included. Sample computer programs were written to demonstrate hybrid microelectric applications of these cost models. Computer programs were generated to calculate and analyze values for the total microelectronics costs. Large scale integrated (LST) chips utilizing tape chip carrier technology were studied. The feasibility of interconnecting arrays of LSU chips utilizing tape chip carrier and semiautomatic wire bonding technology was demonstrated.

Himmel, R. P.↗

Systolic VLSI Reed-Solomon Decoder

Decoder for digital communications provides high-speed, pipelined ReedSolomon (RS) error-correction decoding of data streams. Principal new feature of proposed decoder is modification of Euclid greatest-common-divisor algorithm to avoid need for time-consuming computations of inverse of certain Galois-field quantities. Decoder architecture suitable for implementation on very-large-scale integrated (VLSI) chips with negative-channel metaloxide/silicon circuitry.

Shao, H. M.↗

VLSI Architectures for the Multiplication of Integers Modulo a Fermat Number

Multiplication is central in the implementation of Fermat number transforms and other residue number algorithms. There is need for a good multiplication algorithm that can be realized easily on a very large scale integration (VLSI) chip. The Leibowitz multiplier is modified to realize multiplication in the ring of integers modulo a Fermat number. This new algorithm requires only a sequence of cyclic shifts and additions. The designs developed for this new multiplier are regular, simple, expandable, and, therefore, suitable for VLSI implementation.

Chang, J. J.↗

Stanford Hardware Development Program

Architectures for high performance, digital signal processing, particularly for high resolution, wide band spectrum analysis were developed. These developments are intended to provide instrumentation for NASA's Search for Extraterrestrial Intelligence (SETI) program. The real time signal processing is both formal and experimental. The efficient organization and optimal scheduling of signal processing algorithms were investigated. The work is complemented by efforts in processor architecture design and implementation. A high resolution, multichannel spectrometer that incorporates special purpose microcoded signal processors is being tested. A general purpose signal processor for the data from the multichannel spectrometer was designed to function as the processing element in a highly concurrent machine. The processor performance required for the spectrometer is in the range of 1000 to 10,000 million instructions per second (MIPS). Multiple node processor configurations, where each node performs at 100 MIPS, are sought. The nodes are microprogrammable and are interconnected through a network with high bandwidth for neighboring nodes, and medium bandwidth for nodes at larger distance. The implementation of both the current mutlichannel spectrometer and the signal processor as Very Large Scale Integration CMOS chip sets was commenced.

Peterson, A.↗