Predictive Models and Novel Accelerated Tests for the Reliability of Cell Metallization and Solder Joints in Photovoltaic Modules
Interconnect, solder, and metallization-related failures are the primary reason for premature Si-based photovoltaic panel failure [1, 2] and can lead to a cascade of other failures, including thermal events. This combination of high severity and high occurrence means that understanding interconnect-related failures is key to the long-term health of the photovoltaic industry, and it is crucial that the industry adopt efficient and effective tests that aid in design-for-reliability and manufacturing quality control.