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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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78 records · Page 5

All sources NASA NTRS DOE OSTI

NASA NTRS1996

Studies of Two-Phase Flow Dynamics and Heat Transfer at Reduced Gravity Conditions

The ability to predict gas-liquid flow patterns is crucial to the design and operation of two-phase flow systems in the microgravity environment. Flow pattern maps have been developed in this study which show the occurrence of flow patterns as a function of gas and liquid superficial velocities as well as tube diameter, liquid viscosity and surface tension. The results have demonstrated that the location of the bubble-slug transition is affected by the tube diameter for air-water systems and by surface tension, suggesting that turbulence-induced bubble fluctuations and coalescence mechanisms play a role in this transition. The location of the slug-annular transition on the flow pattern maps is largely unaffected by tube diameter, liquid viscosity or surface tension in the ranges tested. Void fraction-based transition criteria were developed which separate the flow patterns on the flow pattern maps with reasonable accuracy. Weber number transition criteria also show promise but further work is needed to improve these models. For annular gas-liquid flows of air-water and air- 50 percent glycerine under reduced gravity conditions, the pressure gradient agrees fairly well with a version of the Lockhart-Martinelli correlation but the measured film thickness deviates from published correlations at lower Reynolds numbers. Nusselt numbers, based on a film thickness obtained from standard normal-gravity correlations, follow the relation, Nu = A Re(sup n) Pr(exp l/3), but more experimental data in a reduced gravity environment are needed to increase the confidence in the estimated constants, A and n. In the slug flow regime, experimental pressure gradient does not correlate well with either the Lockhart-Martinelli or a homogeneous formulation, but does correlate nicely with a formulation based on a two-phase Reynolds number. Comparison with ground-based correlations implies that the heat transfer coefficients are lower at reduced gravity than at normal gravity under the same flow conditions. Nusselt numbers can be correlated in a fashion similar to Chu and Jones.

Witte, Larry C.↗

NASA NTRS1998

Thermoelectric materials development

A systematic search for advanced thermoelectric materials was initiated at JPL several years ago to evaluate candidate materials which includes consideration of the following property attributes: (1) semiconducting properties; (2) large Seebeck coefficient; (3) high carrier mobility and high electrical conductivity; (4) low lattice thermal conductivity; and (5) chemical stability and low vapor pressure. Through this candidate screening process, JPL identified several families of materials as promising candidates for improved thermoelectric materials including the skutterudite family. As part of an ongoing effort to develop skutterudite materials with lower thermal conductivity values, several solid solutions and filled skutterudite materials were investigated under the effort sponsored by DOE. The efforts have primarily focused on: (1) study of existence and properties of solid solutions between the binary compounds CoSb3 and IrSb3, and RuSb2Te, and (2) CeFe(4-x)Sb12 based filled compositions. For the solid solutions, the lattice thermal conductivity reduction was expected to be reduced by the introduction of the Te and Ru atoms while in the case of CeFe(4-x)Ru(x)Sb12 based filled compositions. For the solid solutions, the lattice thermal conductivity reduction was expected to be reduced by the introduction of the Te and Ru atoms while in the case of CeFe(4-x)Ru(x)Sb12 filled compositions, the reduction would be caused by the rattling of Ce atoms located in the empty voids of the skutterudite structure and the substitution of Fe for Ru. The details of the sample preparation and characterization of their thermoelectric properties are reported in this report.

Fleurial, J. P.↗

NASA NTRS1988

Thermal cycling of tungsten-fibre-reinforced superalloy composites

The thermal cycling of a tungsten-fiber-reinforced superalloy (TFRS) composite is typical of its application in high-temperature engine environments. The mismatch in thermal expansion coefficients between fiber and matrix causes substantial longitudinal (0 deg) stresses in the composite, which can produce inelastic damage-producing matrix strains. The case of thermal fatigue is explored as a "worst case" of the possible matrix damage, in comparison with specimens which are also mechanically loaded in tension. The thermally generated cyclic stresses and the attendant matrix plasticity may be estimated using a nonlinear finite-element program, by proposing a physical analog to the micromechanics equations. A damage metric for the matrix is proposed using the Coffin-Manson criterion, which metric can facilitate comparisons of damage among different candidate materials, and also comparisons for a given material subjected to different temperature cycles. An experimental program was carried out for thermal cycling of a 37 vol pct TFRS composite to different maximum temperatures. The results confirm the prediction that thermal cycling produces matrix degradation and composite strength reduction, which become more pronounced with increasing maximum cyclic temperature. The strength of the fiber is shown to be identical for the as-fabricated and thermally cycled specimens, suggesting that the reduction in composite strength is due to the loss of matrix contribution and also to notching effects of the matrix voids on the fiber.

Wetherhold, Robert C.↗

DOE OSTI2022

Fine Pitch Bonding for High Density Interconnects

CTE (coefficient of thermal expansion) mismatch between two wafers has potential for brittle failure when large areas are bonded on top of one another (wafer to wafer or wafer to die bonds). To address this type of failure, we proposed patterning a polymer around metallic interconnects. For this project, utilized benzo cyclobutene (BCB) to form the bond and accommodate stress. For the metal interconnects, we used indium. To determine the benefits of utilizing BCB, mechanical shear testing of die bonding with just BCB were compared to die bonded just with oxide. These tests demonstrated that BCB, when cured for only 30 minutes and bonded at 200°C, the BCB was able to withstand shear forces similar to oxide. Furthermore, when the BCB did fail, it experienced a more ductile failure, allowing the silicon to crack, rather than shatter. To demonstrate the feasibility of using BCB between indium interconnects, wafers were pattered with layers of BCB with vias for indium or ENEPIG (electroless nickel, electroless palladium, immersion gold). Subsequently, these wafers were pattered with a variety of indium or ENEPIG interconnect pitches, diameters, and heights. These dies were bonded under a variety of conditions, and those that held a bond, were cross-sectioned and imaged. Images revealed that certain bonding conditions allow for interconnects and BCB to achieve a void-less bond and thus demonstrate that utilizing polymers in place of oxide is a feasible way to reduce CTE stress.

36 MATERIALS SCIENCE↗

DOE OSTI2022

Interdiffusion and Formation of Intermetallic Compounds in High-Temperature Power Electronics Substrate Joints Fabricated by Transient Liquid Phase Bonding

Power electronics packages typically comprise a dielectric substrate bonded to a metal layer and attached to heat sinks using a low-thermal-conductivity solder. These multiple layers increase the effective thermal resistance of the package and are responsible for package failures under cyclic thermal loads. Bonding the aluminum nitride dielectric layer (AlN) directly to a low coefficient of thermal expansion (CTE) aluminum silicon carbide (AlSiC) cold plate using copper-aluminum (Cu-Al) transient liquid phase (TLP) bonding has been shown to improve the mechanical reliability of the power electronic packages while making the package more compact by bringing the cooling solutions closer to the devices. This study aims to characterize the Cu-Al bonds formed during the TLP bonding of AlSiC with three different power electronics substrates: pure aluminum nitride (AlN), aluminum (DBA), and copper (DBC). The material compositions and microstructures of the bonds were analyzed using scanning electron microscopy (SEM), x-ray spectroscopy (EDS), confocal scanning acoustic microscopy (C-SAM), and x-ray diffraction (XRD). ..alpha..-Al solid compound was identified as the dominant phase in AlN-AlSiC and Al-AlSiC, with a notable presence of SiC particles. In contrast, three intermetallic phases - ..theta..-CuAl2, ..eta..-CuAl, and ..gamma..'- Cu9Al4 - were observed in the Cu-AlSiC bond. A computational solid-state diffusion model was developed to predict the intermetallic compounds (IMCs) formed during Cu-Al TLP bonding in each system, which supported the observation that an initial Cu volume fraction of 20 % in the material layers produced a final bond composition of >95 % Al with minimal IMC growth. However, increased Cu concentrations produced higher concentration gradients, leading to increased growth of IMCs, Kirkendall voids, and interstitial cracks.

DIRECT ENERGY CONVERSION↗

DOE OSTI2024

Improving the modeling of near-wall interphase heat transfer in porous media models of Pebble Bed Reactors

Here, this work aims to improve capabilities for modeling localized effects in porous media models of Pebble Bed Reactors. The wall-channeling effect is the primary local phenomenon of interest in a PBR, where the presence of the reflector wall disrupts the pebble packing, causing the pebbles near the wall to pack less efficiently and creating large void regions. Accurate modeling of the near-wall region is important as it will affect core bypass flow and temperature predictions. Porous media models are commonly used for design scoping and plant-level simulations of PBRs. Although these models have some capabilities to model the near-wall region, the correlations that are available in porous media codes are often inaccurate when a multi-region model is used to discretize the near-wall region. This work employs a high-to-low analysis to study the accuracy of available interphase heat transfer closures. NekRS, a spectral element computational fluid dynamics code, is used to perform Large Eddy Simulations. These LES simulation results are compared to porous media model results from the Pronghorn porous media code. The friction term of the KTA drag closure is first improved, reducing the error in the prediction of the near-wall velocity from over 50% to less than 5%. This is combined with improvements to the form term from previous works to produce a drag closure that is capable of accurately modeling the wall-channeling effect across a variety of flow conditions. The Nusselt number predictions of several heat transfer correlations are compared to the high-fidelity results where it is found that the KTA heat transfer correlation is capable of accurately predicting the local Nusselt numbers that were determined in the high-fidelity simulation. Comparison of the radial solid temperature profiles, however, reveal discrepancies between NekRS and Pronghorn. It is discovered that the implementation of the interphase heat transfer coefficient that exists in many current porous media codes is not valid when local porosities are modeled. Instead, it is suggested that the interphase heat transfer coefficient should be dependent on the local porosity, the Nusselt number, and the local solid surface-to-volume ratio. Implementation of this change produces improvement in the agreement between the results obtained by NekRS and Pronghorn while using the KTA heat transfer correlation.

interphase heat transfer↗