The use of geared spring tabs for elevator control
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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Vacuum thermionic work function and thermal stability measurements on crystal surfaces, discussing results on carbides, diborides and disilicades
Surface electron and ion emission from refractory metal compounds in cesium vapor, showing electron emission S curves and surface ionization critical temperature envelopes
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Plating three layer tape lead frames, used for tape automated bonding, offers a challenge to the electroplater because of nonuniform topography. Each lead frame contains large (typically .05 x. .05 inch) flat test pads located around the perimeter of the frame. These test pads are electrically connected to the bondable lead frame fingers which extend into an area in the center of the frame called the feature hole. The feature hole exposes these fingers to plating on all sides, while the test pads are exposed on only one side. In addition, the fingers are small in cross section (typically .003 x .0015 inches). Recent thickness measurements indicate that plating around the lead frame fingers is nearly twice as thick as that on test pad areas. Procedures and equipment were developed for measuring the thickness of the deposited material. Discussion was centered on the data obtained using the various measurement techniques and equipment.