Uranium oxide fuel for nuclear thermionic converters.
Uranium oxide as nuclear fuel when in contact with tungsten, molybdenum and tungsten-25 percent rhenium thermionic emitter
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Uranium oxide as nuclear fuel when in contact with tungsten, molybdenum and tungsten-25 percent rhenium thermionic emitter
Vacuum thermionic work function for well-outgassed polycrystalline surfaces, noting techniques for accurate measurement of current, area and temperature values
Thermionic and electric properties of solid and liquid elements and compounds - tables
Vacuum thermionic work function and thermal stability measurements on crystal surfaces, discussing results on carbides, diborides and disilicades
Nomographic Richardson-Dushman equation solutions for thermionic electron emission devices, giving current density for various work functions and electrode temperatures
An experimental study of small area (2-micron diameter) Pt-GaAs Schottky barrier diodes has been made, by using a wafer chip with a matrix of these diodes lying within approximately a minority carrier diffusion length of one another. Using one diode as collector and another as emitter, transistor measurements indicated that the dominant contribution to the current is the majority-carrier thermionic field emission current for large forward-bias voltage of the emitter junction (V-EB no less than about 0.4 V), whereas the smaller forward-bias (V-EB no greater than about 0.4 V) recombination in the space-charge region was most important. The minority carrier injection ratio is measurable only for large forward-bias voltages, decreasing from about 0.02 to 0.00001 as VEB increases from 0.5 to 1.0 V. The minority carrier diffusion length was measured to be about 1.3 microns. These results are of considerable significance for the understanding and optimization of the performance of these devices as classical detectors and mixers.
Extremely low alloyed and nonalloyed ohmic contact resistances have been formed on n-type InAs/In(0.53)Ga(0.47)As/In(0.52)Al(0.48)As structures grown on InP(Fe) by molecular-beam epitaxy. To insure the accuracy of the small contact resistances measured, an extended transmission line model was used to extrapolate contact resistances from test patterns with multiple gap spacings varying from 1 to 20 microns. For a 150-A-thick InAs layer doped to 2 x 10 to the 18th/cu cm and a 0.1-micron-thick InGaAs layer doped to 1 x 10 to the 18th/cu cm, a specific contact resistance of 2.6 x 10 to the -8th ohm-asterisk sq cm was measured for the nonalloyed contact, while a resistance less than 1.7 x 10 to the -8th ohm-asterisk sq cm is reported for the alloyed contact. Conventional Au-Ge/Ni/Au was used for the ohmic metal contact and alloying was performed at 500 C for 50 s in flowing H2. Using a thermionic field emission model, the barrier height at the InAs/InGaAs interface was calculated to be 20 meV.
We present a theoretical investigation of the response of metal-semiconductor-metal (MSM) photodetectors made of InGaAs lattice-matched to InP using a two-dimensional drift-diffusion model with a thermionic-field emission boundary condition for the heterojunctions. The effect of including a top InAlAs layer to increase the effective barrier height of the metal fingers on the InGaAs active layer is thoroughly examined and found to limit the collection of the photocurrent signal due to the electron and hole barriers that it forms with InGaAs. Due to the thickness and height of the InAlAs barrier layer in existing designs, the tunneling current obtained from the model is found to be negligibly small to significantly affect the output signal current. In an attempt to obtain a better response, different design structures including one where a quasi-Schottky contact is utilized are studied and their speed of response, breakdown voltage, and dark current are compared to that of the usual InGaAs device.
The impulse and square-wave input response of different GaAs metal-semiconductor-metal photodetector (MSM) designs are theoretically examined using a two dimensional drift- diffusion numerical calculation with a thermionic-field emission boundary condition model for the heterojunctions. The rise time and the fall time of the output signal current are calculated for a simple GaAs, epitaxially grown, MSM device as well as for various double-heterostructure barrier devices. The double heterostructure devices consist of an AlGaAs layer sandwiched between the top GaAs active, absorption layer and the bottom GaAs substrate. The effect of the depth of the AlGaAs layer on the speed and responsivity of the MSM devices is examined. It is found that there is an optimal depth, at fixed applied bias, of the AlGaAs layer within the structure that provides maximum responsivity at minimal compromise in speed.
Silicon-compatible detectors are amoung the most promising infrared sensors for large focal plane array applications due to their advantages of uniformity, reliability, and easy integration with low-noise Si readout circuitry.
Limiting potential distributions for ion-rich and electron-rich emission at cathode of gaseous thermionic diode
Electron emission test of uranium carbide compatibility with tungsten alloys for nuclear fuel elements
High endurance thermionic cathodes for Kaufman thrustors, discussing emissive coatings and emissive layer starvation
Thermionic work functions and electron emission S curves for contaminated copper surface in oxygen and cesium vapors, separate and mixed
Spectral emittance of electrode material for thermionic converter
Saturation electron emission characteristics from incompletely outgassed Ta wire emitters immersed in Cs vapor using plasma anode technique, noting oxygen effects
Carbides as cathodes for thermionic space reactors - emission, stability, vaporization, and mechanical, irradiation, and diffusion properties of uranium and zirconium carbide
MHD generator cathode current-sheath voltage characteristics for thermionic arc spot emission mode, noting role of cathode temperature