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At least 91 records · Page 5

Development of advanced high strength tantalum base alloys. Part 2: Scale-up investigation

Three experimental tantalum alloy compositions containing 14-16% W, 1% Re, 0.7% Hf, 0.025% C or 0.015% C and 0.015% N were prepared as two inch diameter ingots by consumable electrode vacuum arc melting. The as-cast ingots were processed by extrusion and swaging to one inch and 0.4 inch diameter rod and evaluated. Excellent high temperature forging behavior was exhibited by all three compositions. Creep strength at 2000 F to 2400 F was enhanced by higher tungsten additions as well as substitution of nitrogen for carbon. Weldability of all three compositions was determined to be adequate. Room temperature ductility was retained in the advanced tantalum alloy compositions as well as a notched/unnotched strength ratio of 1.4 for a notched bar having a K sub t = 2.9.

Ammon, R. L.↗

Evaluation of wet tantalum capacitors after exposure to extended periods of ripple current, volume 2

The application of tantalum capacitors in the Viking Lander includes dc voltage and ripple current electrical stress, high temperature during nonoperating times (sterilization), and high vibration and shock loads. The capacitors must survive these severe environments without any degradation if reliable performance is to be achieved. A test program was established to evaluate both wet-slug tantalum and wet-foil capacitors under conditions accurately duplicating actual Viking applications. Test results of the electrical performance characteristics during extended periods of ripple current, the characteristics of the internal silver migration as a function of extended periods of ripple current, and the existence of any memory characteristics are presented.

Ward, C. M.↗

Alkali oxide-tantalum, niobium and antimony oxide ionic conductors

The phase equilibrium relations of four systems were investigated in detail. These consisted of sodium and potassium antimonates with antimony oxide and tantalum and niobium oxide with rubidium oxide as far as the ratio 4Rb2O:llB2O5 (B=Nb, Ta). The ternary system NaSbO3-Sb2O4-NaF was investigated extensively to determine the actual composition of the body centered cubic sodium antimonate. Various other binary and ternary oxide systems involving alkali oxides were examined in lesser detail. The phases synthesized were screened by ion exchange methods to determine mobility of the mobility of the alkali ion within the niobium, tantalum or antimony oxide (fluoride) structural framework. Five structure types warranted further investigation; these structure types are (1) hexagonal tungsten bronze (HTB), (2) pyrochlore, (3) the hybrid HTB-pyrochlore hexagonal ordered phases, (4) body centered cubic antimonates and (5) 2K2O:3Nb2O5. Although all of these phases exhibit good ion exchange properties only the pyrochlore was prepared with Na(+) ions as an equilibrium phase and as a low porosity ceramic. Sb(+3) in the channel interferes with ionic conductivity in this case, although relatively good ionic conductivity was found for the metastable Na(+) ion exchanged analogs of RbTa2O5F and KTaWO6 pyrochlore phases.

Roth, R. S.↗

Mechanical properties of low tantalum alloys

The mechanical property behavior of equiaxed cast B-1900 + Hf alloy as a function of tantalum content was studied. Tensile and stress rupture characterization was conducted on cast to size test bars containing tantalum at the 4.3% (standard level), 2.2% and 0% levels. Casting parameters were selected to duplicate conditions used to prepare test specimens for master metal heat qualification. The mechanical property results as well as results of microstructural/phase analysis of failed test bars are presented.

Kortovich, C. S.↗

Thermal and electrical interaction of tantalum with a low temperature chemically active plasma flow

The paper deals with an experimental study of radiative heat transfer and charge transfer processes from the surface of tantalum plates under conditions of unsteady high-temperature heating and oxidation. It is shown that at plate temperatures of 1800 K, the heat flux may be as high as 400 kW/sq m. Heating is shown to stimulate the emissivity of tantalum and the temperature of the free electrons which surface, through a gas boundary layer, from the plasma onto the metal.

Zake, M. V.↗

Effect of Mechanical Stresses on Characteristics of Chip Tantalum Capacitors

The effect of compressive mechanical stresses on chip solid tantalum capacitors is investigated by monitoring characteristics of different part types under axial and hydrostatic stresses. Depending on part types, an exponential increase of leakage currents was observed when stresses exceeded 10 MPa to 40 MPa. For the first time, reversible variations of leakage currents (up to two orders of magnitude) with stress have been demonstrated. Mechanical stresses did not cause significant changes of AC characteristics of the capacitors, whereas breakdown voltages measured during the surge current testing decreased substantially indicating an increased probability of failures of stressed capacitors in low impedance applications. Variations of leakage currents are explained by a combination of two mechanisms: stress-induced scintillations and stress-induced generation of electron traps in the tantalum pentoxide dielectric.

Teverovsky, Alexander A.↗

Effect of Surge Current Testing on Reliability of Solid Tantalum Capacitors

Tantalum capacitors manufactured per military specifications are established reliability components and have less than 0.001% of failures per 1000 hours for grades D or S, thus positioning these parts among electronic components with the highest reliability characteristics. Still, failures of tantalum capacitors do happen and when it occurs it might have catastrophic consequences for the system. To reduce this risk, further development of a screening and qualification system with special attention to the possible deficiencies in the existing procedures is necessary. The purpose of this work is evaluation of the effect of surge current stress testing on reliability of the parts at both steady-state and multiple surge current stress conditions. In order to reveal possible degradation and precipitate more failures, various part types were tested and stressed in the range of voltage and temperature conditions exceeding the specified limits. A model to estimate the probability of post-surge current testing-screening failures and measures to improve the effectiveness of the screening process has been suggested.

Teverovsky, Alexander↗

High efficiency tantalum-based ceramic composite structures

Tantalum-based ceramics are suitable for use in thermal protection systems. These composite structures have high efficiency surfaces (low catalytic efficiency and high emittance), thereby reducing heat flux to a spacecraft during planetary re-entry. These ceramics contain tantalum disilicide, molybdenum disilicide and borosilicate glass. The components are milled, along with a processing aid, then applied to a surface of a porous substrate, such as a fibrous silica or carbon substrate. Following application, the coating is then sintered on the substrate. The composite structure is substantially impervious to hot gas penetration and capable of surviving high heat fluxes at temperatures approaching 3000.degree. F. and above.

Stewart, David A.↗

Degradation of Leakage Currents in Solid Tantalum Capacitors Under Steady-State Bias Conditions

Degradation of leakage currents in various types of solid tantalum capacitors under steady-state bias conditions was investigated at temperatures from 105 oC to 170 oC and voltages up to two times the rated voltage. Variations of leakage currents with time under highly accelerated life testing (HALT) and annealing, thermally stimulated depolarization currents, and I-V characteristics were measured to understand the conduction mechanism and the reason for current degradation. During HALT the currents increase gradually up to three orders of magnitude in some cases, and then stabilize with time. This degradation is reversible and annealing can restore the initial levels of leakage currents. The results are attributed to migration of positively charged oxygen vacancies in tantalum pentoxide films that diminish the Schottky barrier at the MnO2/Ta2O5 interface and increase electron injection. A simple model allows for estimation of concentration and mobility of oxygen vacancies based on the level of current degradation.

Teverovsky, Alexander A.↗

Effect of Preconditioning and Soldering on Failures of Chip Tantalum Capacitors

Soldering of molded case tantalum capacitors can result in damage to Ta205 dielectric and first turn-on failures due to thermo-mechanical stresses caused by CTE mismatch between materials used in the capacitors. It is also known that presence of moisture might cause damage to plastic cases due to the pop-corning effect. However, there are only scarce literature data on the effect of moisture content on the probability of post-soldering electrical failures. In this work, that is based on a case history, different groups of similar types of CWR tantalum capacitors from two lots were prepared for soldering by bake, moisture saturation, and longterm storage at room conditions. Results of the testing showed that both factors: initial quality of the lot, and preconditioning affect the probability of failures. Baking before soldering was shown to be effective to prevent failures even in lots susceptible to pop-corning damage. Mechanism of failures is discussed and recommendations for pre-soldering bake are suggested based on analysis of moisture characteristics of materials used in the capacitors' design.

multilayer ceramic capacitor (MLCC)↗

NEPP Evaluation of Automotive Grade Tantalum Chip Capacitors

Automotive grade tantalum (Ta) chip capacitors are available at lower cost with smaller physical size and higher volumetric efficiency compared to military/space grade capacitors. Designers of high reliability aerospace and military systems would like to take advantage of these attributes while maintaining the high standards for long-term reliable operation they are accustomed to when selecting military-qualified established reliability tantalum chip capacitors (e.g., MIL-PRF-55365). The objective for this evaluation was to assess the long-term performance of off-the-shelf automotive grade Ta chip capacitors (i.e., manufacturer self-qualified per AEC Q-200). Two (2) lots of case size D manganese dioxide (MnO2) cathode Ta chip capacitors from 1 manufacturer were evaluated. The evaluation consisted of construction analysis, basic electrical parameter characterization, extended long-term (2000 hours) life testing and some accelerated stress testing. Tests and acceptance criteria were based upon manufacturer datasheets and the Automotive Electronics Council's AEC Q-200 qualification specification for passive electronic components. As-received a few capacitors were marginally above the specified tolerance for capacitance and ESR. X-ray inspection found that the anodes for some devices may not be properly aligned within the molded encapsulation leaving less than 1 mil thickness of the encapsulation. This evaluation found that the long-term life performance of automotive grade Ta chip capacitors is generally within specification limits suggesting these capacitors may be suitable for some space applications.

Automotive↗

Effects of hand soldering MIL-PRF 55365 tantalum capacitors

Different values of MIL-PRF-55365 tantalum capacitors were subjected to three different types of soldering conditions— Convection Reflow, JPL Standard Hand Soldering, and Optimized Hand Soldering. The electrical parameters for a large number of capacitors of each value were measured before and after thermal soldering stress. The results indicate that tantalum capacitors subjected to convection reflow conditions experience detectable changes in electrical parameters; capacitors subjected to hand solder conditions show reduced changes in electrical parameters when compared to the reflow samples. Optimized hand solder conditions are shown to have a minimal effect on electrical parameters.

Sheldon, Douglas↗

Effect of High Temperature Storage on AC Characteristics of Polymer Tantalum Capacitors

Replacement of MnO2 with conductive polymers as cathode materials in chip tantalum capacitors allows for a substantial reduction of the equivalent series resistance (ESR), improvement of frequency characteristics, and elimination of the possibility of ignition during failures. One of the drawbacks of chip polymer tantalum capacitors (CPTCs) is a relatively poor long-term stability at high temperatures. In this work, variations of capacitance, dissipation factor, and ESR in different types of capacitors including automotive grade parts from three manufacturers have been monitored during storage at temperatures from 100 ºC to 175 ºC for up to 18,000 hours. Results show that ESR is the most and capacitance the least sensitive to degradation parameter. Times to parametric failures have been simulated using a Weibull-Arrhenius model that allowed for assessments of activation energies of the degradation and prediction of times to failure at the use temperature. Degradation of CPTCs was explained by thermo-oxidative processes in conductive polymers that result in exponential increasing of the resistivity with time of ageing. This process starts after a certain incubation period that depends on packaging materials and design and corresponds to the time that is necessary to form delamination between the encapsulating molding compound and lead frame. The effectiveness of the existing qualification procedures to assure stable operation of CPTCs is discussed.

Alexander A Teverovsky↗

Test Methods and Analysis of Anomalous Charging Currents in Polymer Tantalum Capacitors

Due to dry environments, anomalous charging currents (ACC) in polymer tantalum capacitors (PTC) could cause malfunctions or failures in space systems. Currently, there is no standard metric to assess this effect, and factors affecting ACC are not well understood. This paper discusses the benefits and drawbacks of different methods used to reveal ACC including constant voltage ramp and constant current stress and suggest a power surge testing (PST) as a procedure for screening and qualification of PTCs for space applications. The suggested test is similar to the surge current testing that is currently used for MnO2 tantalum capacitors but assures dissipation of high power in the part throughout testing. Using various types of capacitors, the reproducibility of test results for different manufacturing lots of PTCs and from sample to sample within a lot were estimated. The impact of moisture content, test temperature, stress voltages, and preconditioning were assessed. Thermal effects associated with ACC and the possibility of catastrophic failures were studied experimentally using an IR camera and calculated at adiabatic heating conditions. Possible mechanisms of the phenomenon are discussed and recommendations for testing to avoid failures related to ACC are suggested.

Alexander A.Teverovsky↗

Power Surge Testing for Polymer Tantalum Capacitors

Due to dry environments, anomalous charging currents (ACC) in polymer tantalum capacitors (PTC) might cause malfunctions and failures in space systems. Currently, there is no standard metrics to assess this effect and factors affecting ACC are not well understood. This paper discusses benefits and drawbacks of different methods used to reveal ACC and suggest a power surge testing (PST) as a procedure for screening and qualification of PTCs. The suggested test is similar to the surge current testing that is currently used for MnO2 tantalum capacitors but assures dissipation of high power in the part during the whole period of testing. Using various types of capacitors, the reproducibility of test results for different lots of PTCs and from sample to sample in a lot were estimated. The impact of moisture content, test temperature, stress voltages, and preconditioning is assessed. Thermal effects associated with ACC and the possibility of catastrophic failures were studied experimentally using an IR camera and calculated at adiabatic heating conditions. Possible mechanisms of the phenomenon are discussed and recommendations for testing to avoid failures related to ACC are suggested.

Alexander A Teverovsky↗

Degradation of Aluminum and Tantalum Wet Electrolytic Capacitors during High Temperature Storage

Aluminum electrolytic capacitors (AEC) are available to higher ranges of capacitance and voltage compared to tantalum electrolytic capacitors (TEC). However, evaporation of the electrolyte during operation or storage of conventional AEC that is accelerated with temperature does not allow use of these parts in space electronics. Instead, for systems requiring large value capacitors and high operating voltages, designers must use banks of TECs that increases substantially the size and weight of electronic modules. Development of hermetically sealed AECs might be beneficial for space systems provided the necessary reliability is assured. Increase in leakage current during storage of AEC is well known and is often explained by dissolution of aluminum oxide in electrolyte. However, other possible mechanisms of this effect have not been discussed. Although hermetically sealed TEC have been used in space systems for years, there is a lack of information about the effects of storage on their characteristics that is of great interest as a comparison for aluminum capacitors. This work explores degradation of AC characteristics (capacitance, dissipation factor, and equivalent series resistance) and DC characteristics (leakage and absorption currents) in different types of aluminum and tantalum hermetically sealed capacitors during long-term storage at high temperatures (100 °C, 125 °C, and 150 °C). It is shown that leakage currents are degrading in both types of capacitors, but this degradation is reversible after bias application. Mechanisms of degradation are discussed, and explanations based on the processes common for both types of capacitors are suggested. Problems associated with assessments of hermeticity and evaporation of the electrolyte in hermetically sealed capacitors are analyzed.

Alexander Teverovsky↗

Tantalum oxide stabilized molybdenum-doped ruthenium oxide electrocatalysts for PEM water electrolysis

Proton exchange membrane (PEM) water electrolysis offers key advantages, including high current density, high efficiency, and compact system architecture for hydrogen production. However, its widespread implementation is limited by the scarcity and high cost of Ir-based anodic catalysts. Herein, we report an Ir-free electrocatalyst for the acidic oxygen evolution reaction (OER): tantalum oxide (TaO x )–coated molybdenum-doped RuO 2 (TaO x -MoRuO 2 ). The catalyst exhibits a low overpotential of 180 mV at 10 mA cm -2 and excellent durability, with a degradation rate of 0.034 mV h -1 over a 150-hour test at 50 mA cm -2 —surpassing other Ru-based catalysts evaluated under similar conditions. A PEM electrolyzer employing TaO x -MoRuO 2 as the anode maintained stable operation for 100 hours at 500 mA cm -2 . In conclusion, the TaO x coating layer suppresses Ru and Mo dissolution, thus enhancing their stability likely via interfacial electronic reconfiguration of Ru and Mo mediated by bridging oxygen atoms.

Durability↗

High strain-rate strength response of single crystal tantalum through in-situ hole closure imaging experiments

The properties of crystalline materials often depend on directionality and operating conditions. Specifically, the strength of materials can depend anisotropically on crystal direction and the loading condition. To probe these effects, a preliminary series of high strain-rate (> 105/s) strength plate-impact hole closure experiments were performed on high purity single crystal Tantalum cubes. The orientation of the single crystals with respect to impact/loading were varied to provide data to inform crystal plasticity modeling efforts. The experiments consist of in-situ high-resolution X-ray radiographic imaging of the hole collapse under dynamic compression conditions to infer the material strength via its resistance to closure at increasing levels of plastic strain. The experiments are compared against hydrocode simulation predictions. Here, a comparison with simple elastic perfectly plastic strength model predictions is presented to elucidate the response of the different crystal orientations at high strain-rate and large plastic strains.

36 MATERIALS SCIENCE↗