Recommendation regarding package related tests
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plastic encapsulated microcircuits PEM↗
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3D Chip Scale Package (CSP)
Package/die stacking technology enhances most aspects of electronic systems such as size, weight, speed, yield, and power consumption.
Chip Scale Packaging (CSP) 3D CSP Stack TSOP D2CSP↗
Accelerated thermal and mechanical testing of CSP assemblies
Chip Scale Packages (CSP) are now widely used for many electronic applications including portable and telecommunication products. A test vehicle (TV-1) with eleven package types and pitches was built and tested by the JPL MicrotypeBGA Consortium during 1997 to 1999. Lessons learned by the team were published as a guidelines document for industry use. The finer pitch CSP packages which recently became available were indluded in the next test vehicle of the JPL CSP Consortium.
Chip Scale Package CSP thermal cycle fatigue solde↗
CSP, BGA, and SM Packages for Harsh Environmental Applications
Different aspects of advanced surface mount package technology have been investigated for aerospace applications.
SMA reliability BGA Packages Asembly Reliability C↗
Chip Scale Package Joint Integrity of CSP under Isothermal Aging
The popularity of emerging miniaturized Chip Scale Packages (CSPs) is rapidly growing because of their benefits and smaller size, though they may be considered to be an interim solution.
Chip Scale Packages (CSPs) Microtype BGA SEM↗
Challenges in Interconnection and Packaging of Microelectromechanical Systems (MEMS)
Integrated circuit packaging and their testing is well advanced because of the maturity of the IC industry, their wide applications, and availability of industrial infrastructure.
COTS MEMS packaging interconnections reliability↗
Characterization of Kova-Pyrex Anodically Bonded Samples: A New Packaging Approach for MEMS Devices
The ability to anodically bond Kovar to Pyrex 7740 significantly expands the packaging approaches available for MEMS devices. This technique greatly simplifies and reliably interconnects micropropulsion MEMS components (thrusters, valves) with the attached propellant system.
anodic bonding packaging Pyrex Kovar↗
An examination of automation and robotics in the context of Space Station operations
A NASA-sponsored review of Space Station automation and robotics (A&R) applications from an operations and utilization perspective is presented. The goals of the A&R panel and this report are to identify major suggestions for advanced A&R operations application in Space Station as well as key technologies that have emerged or gained prominence since the completion of previous reports; to review and incorporate the range of possible Space Station A&R applications into a framework for evaluation of A&R opportunities; and to propose incentives for the government, work packages, and subcontractors to more aggressively identify, evaluate, and incorporate advanced A&R in Space Station Operations. The suggestions for A&R focused on narrow objectives using a conservative approach tuned to Space Station at IOC and limiting the Station's growth capabilities. A more aggressive stance is to identify functional needs over the Program's life, exploit and leverage available technology, and develop the key advanced technologies permitting effective use of A&R. The challenge is to systematically identify candidate functions to be automated, provide ways to create solutions resulting in savings or increased capabilities, and offer incentives that will promote the automation.
Criswell, David R.↗
CSP Assembly Reliability and Effects of Underfill and Double-Sided Population
The JPL-led MicrotypeBGA Consortium of enterprises representing government agencies and private companies have jointed together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects.
chip scale package CSP solder joint reliability un↗
Getters for Reliable Hermetic Packages
A variety of sealed-off devices such as cathode ray tubes (CRT's) electron tubes, plasma displays, particle accelarators and colliders vacuum thermal insulation, ultra-high vacuum (UHV), extreme high vacuum (XHV) systems for semiconductor processing, X-ray tubes, lamps, field-emission displays (FEDs) flat panel displays (FPDs), some microelectromechanical systems (MEMS) and science instruments for space applications, nuclear systems require a vacuum for their successful operation.
getters hermetic packaging electronic↗
Piezoelectric transducer
Transducer consists of a hybrid thin film and a piezoelectric transistor that acts as a stress-sensitive device with built-in gain. It provides a stress/strain transducer that incorporates a signal amplification stage and sensor in a single package.
Conragan, J.↗
Apollo experience report: Thermal design of Apollo lunar surface experiments package
The evolution of the thermal design of the Apollo lunar surface experiments package central station from the basic concept to the final flight hardware is discussed, including results of development, prototype, and qualification tests that were used to verify that the flight hardware would operate adequately on the lunar surface. In addition, brief discussions of the thermal design of experiments included in the experiments package are presented. The flight thermal performance is compared with analytical results and thermal-vacuum test results, and design modifications for future lunar surface experiment packages are presented.
Harris, R. S., Jr.↗
Room temperature stretch forming of scale space shuttle external tank dome gores. Volume 1: Technical
An account of activities and data gathered in the Room Temperature Stretch Forming of One-third Scale External Tank Bulkhead Gores for space shuttle study, and a tooling design and production cost study are reported. The following study phases are described: (1) the stretch forming of three approximately one-third scale external tank dome gores from single sheets of 2219-T37 aluminum alloy; (2) the designing of a full scale production die, including a determination of tooling requirements; and (3) the determination of cost per gore at the required production rates, including manufacturing, packaging, and shipping.
Blunck, R. D.↗
Tool for use in lifting pin supported objects
A tool for use in lifting a pin-supported, electronic package mounted in juxtaposition with the surface of an electronic circuit board is described. The tool is configured to be received beneath a pin-supported package and is characterized by a manually operable linkage, including an elongated, rigid link is supported for axial reciprocation and a pivotal link pinned to the body and supported for oscillation induced in response to axial motion imparted to the rigid link. A lifting plate is pivotally coupled to the distal end of the pivotal link so that oscillatory motion imparted to the pivotal link serves to move the plate vertically for elevating the plate into lifting engagement with the electronic package positioned thereabove.
Marzek, R. A.↗
Spoked wheels to deploy large surfaces in space-weight estimates for solar arrays
Extensible booms were used to deploy and support solar cell arrays of varying areas. Solar cell array systems were built with one or two booms to deploy and tension a blanket with attached cells and bussing. A segmented and hinged rim supported by spokes joined to a common hub is described. This structure can be compactly packaged and deployed.
Crawford, R. F.↗
A dual-mode generalized likelihood ratio approach to self-reorganizing digital flight control system design
The research is reported on the problems of failure detection and reliable system design for digital aircraft control systems. Failure modes, cross detection probability, wrong time detection, application of performance tools, and the GLR computer package are discussed.
Bueno, R.↗
Evaluation of advanced microelectronic fluxless solder-bump contacts for hybrid microcircuits
Technology for interconnecting monolithic integrated circuit chips with other components is investigated. The advantages and disadvantages of the current flip-chip approach as compared to other interconnection methods are outlined. A fluxless solder-bump contact technology is evaluated. Multiple solder-bump contacts were formed on silicon integrated circuit chips. The solder-bumps, comprised of a rigid nickel under layer and a compliant solder overlayer, were electroformed onto gold device pads with the aid of thick dry film photomasks. Different solder alloys and the use of conductive epoxy for bonding were explored. Fluxless solder-bump bond quality and reliability were evaluated by measuring the effects of centrifuge, thermal cycling, and high temperature storage on bond visual characteristics, bond electrical continuity, and bond shear tests. The applicability and suitability of this technology for hybrid microelectronic packaging is discussed.
Mandal, R. P.↗
The Vermont operational LANDSAT data analysis system
The implementation of the Office of Remote Sensing of Earth Resources (ORSER) software package from Pennsylvania State University onto the University of Vermont's IBM model 3031 computer is discussed. This version of ORSER was found to be much more user-friendly than remote access to the Penn State ORSER package.
Smith, G.↗