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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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77 records · Page 5

All sources NASA NTRS DOE OSTI

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Exploration Helmet Permanent Anti-fog Study

For the current Extravehicular Mobility Unit (EMU) spacesuit, an astronaut applies an anti-fog solution to the interior of the helmet bubble before each EVA. However, the anti-fog solution has been reported to cause eye discomfort during at least seven EMU EVAs when the anti-fog solution contacted the crew member’s eyes. During STS-100, astronaut Chris Hadfield reported the eye irritation temporarily blinded him during his spacewalk. In addition, the wipe on anti-fog solution is a consumable that needs to be accounted for and a supply launched for missions. To solve this, the Exploration EMU (xEMU) pressure bubble investigated using a permanent anti-fog coating during Design Verification and Test (DVT) human in the loop (HITL) events. Chosen for previous use in Constellation Space Suit develop, HTAF-601, a water based permanent anti-fog solution, was tested. However, major issues have arisen with further HITL testing with the coating. Cleaning the helmet has been a challenge to avoid damaging the permanent anti-fog coating. NASA has completed a set of different methods for cleaning the anti-fog to try to document a preferred method. It was found isopropyl alcohol (IPA) cannot be used to clean the interior of the helmet because it will strip and delaminate the permanent anti-fog coating. Even with using a very gentle cleaning method of flushing with distilled or DI water and dabbing at facial oils, the permanent anti-fog starts to delaminate consistently after 50 hours manned pressurized time (MPT). Finally, the HTAF-601 coating is being discontinued by the vendor. Due to these issues, further investigation is being completed evaluating two solvent based anti-fog solutions: Exxene’s HCF-100 and FSI’s Visgard 106-94. Each coating will be evaluated on polycarbonate samples for application consistency, steam cycles (mimicking breath cycles), cleaning durability, haze, and light transmission. This study will determine if either coating is a viable option to pursue as a permanent anti-fog for spacesuit helmet applications.

spacesuit↗

DOE OSTI2021

Modeling and analyzing parasitic parameters in high frequency converters

This research focuses on electromagnetic interference (EMI) / electromagnetic compatibility (EMC) design and analysis in power electronics systems. To limit the EMI under the standards, different methods and strategies are investigated. Parasitic parameters of high frequency (HF) transformer are analyzed using a novel analytical method, finite element method (FEM), and experimental measurements for different structures and windings arrangements. Also, the magnetic field, electric field, electric displacement, and electric potential distribution are simulated and analyzed. Moreover, a high voltage system is considered and analyzed to improve the EMC. The EMI propagation paths are analyzed. The EMI noise level of the system is obtained and compared to the IEC61800-3 standard. To improve the EMC, the parasitic parameters of the transformer, as the main path of EMI circulation, are analyzed and optimized to block the propagation. Furthermore, the geometry structure of the HF transformer is optimized to lower the parasitics in the system. Three pareto-optimal techniques are investigated for the optimization. The models and results are verified by 3D-FEM and experimental results for several given scenarios. Furthermore, the EMC modeling and conducted EMI analysis are developed for a system including an AC-DC-DC power supply (rectifier and dual active bridge (DAB) converter). Moreover, the common mode (CM) EMI noise propagation through the system is discussed and the noise sources and effect of components on the noise are analyzed. Additionally, the CM impedance of different parts of the system and the noise levels are discussed. Finally, EMI attenuation techniques were applied to the system.

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DOE OSTI2025

Per-Phase Control for CHB Converters with Negative-Sequence Current and DC Voltage Balancing Control

This paper presents a per-phase controller for a grid-connected Cascaded H-Bridge (CHB) converter featuring negative sequence current regulation and DC bus voltage balancing capabilities. Unlike conventional three-phase controllers, each phase of the CHB can be separately and controlled to regulate the DC voltage and reactive power flow. per-phase negative sequence current control strategy is incorporated into the proposed controller to ensure compliance with IEEE Standard 2800-2022, which requires the absorption of negative-sequence reactive current during grid voltage disturbances. Furthermore, a feed-forward control-based DC bus voltage balancing method is employed, which eliminates the need for the integrator commonly used in traditional approaches. The performance of the proposed controller is validated under various unbalanced grid scenarios and DC bus voltage imbalances through electromagnetic transient (EMT) simulation using a three-phase, three-level grid-connected CHB–Dual Active Bridge (DAB) converter testbed developed on MATLAB/Simulink. Additionally, the performance of the negative-sequence current regulation is investigated through simulation under different unbalanced grid voltage scenarios.

negative sequence current↗

DOE OSTI2023

Isolated Single-stage Three-phase AC/DC Converter using Bidirectional Switches

The advent of the SiC Bidirectional FET (BiDFET), a monolithic 1.2 kV bidirectional switch, has rendered the single-stage three-phase AC/DC converter topology a promising approach for implementing AC/DC converters. This topology, which integrates a full-bridge converter with a single-phase to three-phase matrix converter via a high-frequency transformer, is particularly suitable for applications requiring galvanic isolation, buck-boost functionality, and bidirectional power flow. The single-stage design eliminates the need for bulky and unreliable electrolytic capacitors, and utilizes a single magnetic component for power transfer. In the matrix converter, bidirectional switches, which were traditionally implemented using combinations of multiple semiconductor devices such as MOSFETs, IGBTs, and diodes, can now be realized using the single-chip solution, BiDFET. This advancement leads to a lower switch count, compact converter implementation, with lower inductance commutation cells, thereby enhancing the overall efficiency and compactness of the system. The paper presents a unified model of the converter, considering all control parameters, including the duty cycles and phase shift of transformer voltages. Detailed expressions for power transfer, transformer currents, and currents at AC and DC ports are provided. Additionally, the paper outlines the conditions necessary for soft-switching of all switches and the commutation schemes required for the practical implementation of the matrix converter modulation scheme. A hardware prototype of a 10 kW, 480 VRMS, LL/ 800 V AC/DC system has been developed, and experimental results are presented to demonstrate its performance.

BiDFET↗

DOE OSTI2023

PV Inverter Systems Enabled by Monolithically Integrated SiC based Four Quadrant Power Switch (4-QPS) [BiDFET]

The purpose of this project was to develop a new breed of Power Conversion Systems (PCS) for PV integration that is enabled by the newly developed 4-Quadrant Single Die SiC Power Semiconductor Switches (4-QPS) or also referred to as “Bidirectional FET (BIDFET)”. This work includes semiconductor die development, advanced packaging, converter design, development, and testing of 4-QPS enabled hardware prototypes at 1 kW (for single phase residential application) and 10 kW (for three phase commercial application). The BiDirectional Field-Effect Transistor (BiDFET) can enable circuit topologies requiring four-quadrant switches, that were earlier designed using discrete combinations of MOSFETs, IGBTs, GaN HEMTs, and PiN diodes. The monolithic nature of the BiDFET allows lower device count, smaller switch volume, lower inductance, and simpler packaging, and hence more reliable and commercially viable implementation in power electronics converters. The matrix converter topologies, now feasible using BiDFETs, can eliminate the bulky and unreliable dc link capacitors or inductors required for conventional voltage-source or current-source converters in ac–ac and ac–dc applications. The 1.2 kV BiDFET has the potential to disrupt all the applications utilizing 1.2 kV switches, including electric vehicle (EV) drivetrain, bidirectional EV chargers, industrial motor drives, solid-state transformers, datacenter power supplies, elevator drives, dc microgrids, energy storage grid integration, solid-state breakers, etc.

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