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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 91 records · Page 5
All sourcesNASA NTRSDOE OSTI
DOE OSTI2025

A 28 nm multiply-accumulate ASIC architecture for on-chip data compression in MHz frame rate X-ray and electron pixel detectors

Modern X-ray detector systems urgently require compact, efficient, and fast data compression schemes to handle the transmission of big data from pixel arrays, enabling frame rates in the MHz regime. Here, in this work, a data compression ASIC that implements a streaming fixed-length lossy compression scheme is introduced and analyzed, proving the feasibility and benefits of on-chip compression. The compression scheme utilizes a vector matrix product logic, which performs a number of floating-point multiplications, additions, and accumulations. The logic is verified, synthesized, and shown to fit in the area resource available for the X-ray detector under study, which comprises 192 × 168 pixels each of 12-bit width, and having a total area of 20 mm× 20 mm, about 2 mm× 20 mm of which are available for the digital logic. Several system architectures, precisions, and compression ratios ranging from 100 to 250 were analyzed to pave the way for on-chip fixed-length compression (e.g., principal component analysis, singular value decomposition) and data reduction (e.g., azimuthal integration) for X-ray and electron detectors.

Data compression↗
DOE OSTI2025

On-chip pulse shaping of entangled photons

The miniaturization of optical systems via integrated photonics is critical to the ultimate scalability and performance of photonic quantum processors, yet many longstanding optical signal processing capabilities—such as Fourier-transform pulse shaping—remain unrealized on chip. In this work, we demonstrate on-chip spectral shaping of entangled photons using a multichannel microring-resonator-based silicon photonic pulse shaper. Achieving line-by-line phase control on a 3 GHz grid for two frequency-bin-entangled qudits, the pulse shaper's fine spectral resolution enables control of nanosecond-scale temporal features, which are observed by direct coincidence detection of biphoton correlation functions that show excellent agreement with theory. This work marks a demonstration of biphoton pulse shaping using an integrated spectral shaper and holds significant promise for applications in photonic quantum information processing.

Entanglement manipulation↗
DOE OSTI2026

NeuroCoreX: An Open-Source FPGA-Based Spiking Neural Network Emulator with On-Chip Learning

Spiking Neural Networks (SNNs) are computational models inspired by the event-driven communication and connectivity patterns of biological neural circuits. They enable high energy efficiency and natural support for diverse architectures ranging from layered networks to small-world and graphstructured topologies. In this work, we introduce NeuroCoreX, an open-source, FPGA-based spiking neural network emulator that provides real-time, on-chip learning and flexible network organization. NeuroCoreX supports both feedforward sensory inputs streamed directly from sensors or PCs via UART and recurrent on-chip connectivity, enabling simultaneous processing and learning from external stimuli and internal network dynamics-capabilities rarely available in existing FPGA SNN platforms. The system implements a Leaky Integrate-and-Fire (LIF) neuron model with current-based synapses and supports pair-based STDP learning on both feedforward and recurrent synapses. A lightweight Python interface enables interactive configuration, live monitoring, weight read-back, and experiment control. Importantly, NeuroCoreX is tightly integrated with the SuperNeuroMAT simulator, allowing SNN models to be transferred seamlessly from software to hardware for hardware-in-the-loop development. By combining real-time plasticity, flexible connectivity, and an open-source VHDL implementation, NeuroCoreX provides an extensible and accessible platform for neuromorphic research, algorithm-hardware co-design, and energy-efficient edge intelligence.

Gautam, Ashish [ORNL]↗
DOE OSTI2026

Spectral characterization and performance of SPT-SLIM on-chip filterbank spectrometers

The South Pole Telescope Shirokoff Line Intensity Mapper (SPT-SLIM) experiment is a pathfinder for demonstrating the use of on-chip spectrometers for millimeter (mm) Line Intensity Mapping (LIM). We present spectral bandpass measurements of the SPT-SLIM spectrometer channels made on site using a Fourier Transform Spectrometer during the first deployment of SPT-SLIM in the 2024-2025 Austral summer season. We note the effect of FTS systematics on measurements of on-chip filterbank spectrometer resolutions and demonstrate a technique for measuring the narrow band passes of the SPT-SLIM filterbanks that improves beyond the intrinsic resolution of a Fourier Transform Spectrometer.

Benson, C. S. [Cardiff U.]↗
DOE OSTI2020

Cut–and–chip harvester material capacity and fuel performance on commercial-scale willow fields for varying ground and crop conditions

Shrub willow (Salix spp.) is capable of producing commercially attractive amounts of biomass in short rotations, but harvesting costs and logistics remain a concern. There is a particular need for information about harvesting operations on larger, commercial short–rotation woody crop systems. Another recent issue on commercial fields in northern New York is commercial growers conducting harvests during the growing season rather than the recommended dormant season when fields may be too wet to harvest. This study evaluated and modeled the in–field performance of a cut–and–chip harvester for almost 700 wagonloads of chips operating in commercial willow fields in a wider array of crop and field conditions than have been previously reported. Analysis indicated that the time of harvest (leaf–on or leaf–off) and whether site conditions were wet or dry affected the harvester's material capacity. Mean material capacity was greatest for leaf–off, dry conditions (71.8 Mg/hr) and lowest for leaf–on harvests, which were similar for wet (30.4 Mg/hr) and dry conditions (29.7 Mg/hr). Mean crop specific fuel consumption ranged between 1.3 and 3.3 L/Mg, but can get considerably higher for standing biomasses below 40 Mg/ha. Wet ground conditions and leaf–on harvests tend to decrease material capacity and increase fuel consumption as the harvester has to divert power to forward movement and material processing. Relationships for material capacity and fuel consumption based on standing biomass, time of harvest and ground conditions will be essential for evaluating and modeling the economic and environmental impacts of commercial–scale willow operations.

09 BIOMASS FUELS↗
DOE OSTI2026

Scalable multiplexed machine learning gas sensor chips for food classification

Multiplexed gas sensor arrays combined with machine learning have unlocked previously inaccessible applications for scent-based sensing. Current platforms are limited by overlapping sensing materials with similar compositions, leading to highly correlated responses, or multistep deposition processes that hinder scalability. In this work, we developed a 16-element monolithic chip with fully distinct sensing layers, enabling a truly heterogeneous array. The system consists of highly sensitive carbon nanotube field effect transistors that are functionalized through a single-step microdispensing method compatible with automated pipetting systems. The resulting chip produces characteristic signal patterns in response to object-specific scent profiles and, when combined with machine learning algorithms, can perform automated object identification. We demonstrate the classification of 16 different objects, including food spoilage and nut allergens, with a 92.6% overall prediction accuracy.

Bassil, Carla [University of California, Berkeley,↗
DOE OSTI2019

Gas Ingress and Egress of MEMS Multi-Chip Modules and MEMS Devices

Hermetic microcircuit packaging was the dominant method of protecting semiconductor devices in the 1960s and 1970s. After losing majority market sectors to plastic encapsulated microelectronics over the last a few decades, hermetic packaging remains the preferred method of protecting semiconductor devices for critical applications such as in military, space, and medical fields, where components and systems are required to serve for several decades. MEMS devices impose additional challenges to packaging by requiring specific internal cavity pressures to function properly or deliver the needed quality (Q) factors. In MEMS multichip modules, internal pressure requirement conflicts arise when different MEMS devices require different internal gases and pressures. The authors developed a closed-formed equation to model pressure changes of hermetic enclosures due to gas ingression. This article expands the authors mathematical model to calculate gas pressure of a MEMS multichip module package as well as those of MEMS devices inside the multichip module package. These equations are not only capable of calculating service lifetimes of MEMS devices and multi-chip modules but can also help develop MEMS device packaging strategies to extend the service life of MEMS multi-chip modules.

36 MATERIALS SCIENCE↗
DOE OSTI2020

Chirped-grating spectrometer-on-a-chip

We demonstrate an on-chip spectrometer readily integrable with CMOS electronics. The structure is comprised of a SiO 2 /Si 3 N 4 /SiO 2 waveguide atop a silicon substrate. A transversely chirped grating is fabricated, in a single-step optical lithography process, on a portion of the waveguide to provide angle and wavelength dependent coupling to the guided mode. The spectral and angular information is encoded in the spatial dependence of the grating period. A uniform pitch grating area, separated from the collection area by an unpatterned propagation region, provides the out-coupling to a CMOS detector array. A resolution of 0.3 nm at 633 nm with a spectral coverage tunable across the visible and NIR (to ∼ 1 µm limited by the Si photodetector) by changing the angle of incidence, is demonstrated without the need for any signal processing deconvolution. This on-chip spectrometer concept will cost effectively enable a broad range of applications that are beyond the reach of current integrated spectroscopic technologies.

Nezhadbadeh, Shima↗
DOE OSTI2021

Optics-on-a-chip for ultrafast manipulation of 350-MHz hard x-ray pulses

Microelectromechanical systems (MEMS) are miniature devices integrated into a vast range of industrial and consumer applications. Optical MEMS are developed for dynamic spatiotemporal control in lightwave manipulation and communication as modulators, switches, multiplexers, spectrometer, etc. However, they have not been shown to function similarly in sub-nm wavelength regimes, namely, with hard x-rays, as high-brilliance pulsed x-rays have proven powerful for addressing challenges in time-domain science, from energy conversion to neurobiological control. While desirable temporal properties of x-ray pulses can be enhanced by optics, conventional x-ray optics are inherently massive in size, hence, never dynamic. We demonstrate highly ultrafast x-ray optics-on-a-chip based on MEMS capable of modulating hard x-ray pulses exceeding 350 MHz, 10 3 × higher than any other mechanical modulator, with a pulse purity >10 6 without compromising the spectral brilliance. Moreover, the timing characteristics of the devices can be tuned on-the-fly to deliver optimal pulse properties to create a host of dynamic x-ray instruments and applications, impossible with traditional optics of 10 9 × bulkier and more massive. The advent of the ultrafast optics-on-a-chip heralds a new paradigm of x-ray photonics, time-domain science, and accelerator diagnostics, especially at not only the future-generation light sources that offer coherent and high-frequency pulses but also lab-based facilities that normally do not offer timing structures.

42 ENGINEERING↗
DOE OSTI2021

Photonic integration of Er 3+ :Y 2 SiO 5 with thin-film lithium niobate by flip chip bonding

Rare earth ions are known as promising candidates for building quantum light-matter interface. However, tunable photonic cavity access to rare earth ions in their desired host crystal remains challenging. Here, we demonstrate the integration of erbium doped yttrium orthosilicate (Er 3+ :Y 2 SiO 5 ) with thin-film lithium niobate photonic circuit by plasma-activated direct flip chip bonding. Resonant coupling to erbium ions is realized by on-chip electro-optically tuned high Q lithium niobate micro-ring resonators. Fluorescence and absorption of erbium ions at 1536.48 nm are measured in the waveguides, while the collective ion-cavity cooperativity with micro-ring resonators is assessed to be 0.36. This work presents a versatile scheme for future rare earth ion integrated quantum devices.

71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSIC↗
DOE OSTI2023

Chip-scale frequency combs for data communications in computing systems

Recent developments in chip-based frequency-comb technology demonstrate that comb devices can be implemented in applications where photonic integration and power efficiency are required. The large number of equally spaced comb lines that are generated make combs ideal for use in communication systems, where each line can serve as an optical carrier to allow for massively parallel wavelength-division multiplexing (WDM) transmission. In this review, we summarize the developments in integrated frequency-comb technology for use as a WDM source for communication systems in data centers and high-performance computing systems. We highlight the following three approaches for chip-scale comb generation: semiconductor modelocked lasers, electro-optic combs, and Kerr frequency combs.

Okawachi, Yoshitomo (ORCID:0000000196390549)↗
DOE OSTI2025

Scalable low-loss cryogenic packaging of quantum memories in CMOS-foundry processed photonic chips

Optically linked solid-state quantum memories such as color centers in diamond are a promising platform for distributed quantum information processing and networking. Photonic integrated circuits (PICs) have emerged as a crucial enabling technology for these systems, integrating quantum memories with efficient electrical and optical interfaces in a compact and scalable platform. Packaging these hybrid chips into deployable modules while maintaining low optical loss and resiliency to temperature cycling is a central challenge to their practical use. We demonstrate a packaging method for PICs using surface grating couplers and angle-polished fiber arrays that is robust to temperature cycling, offers scalable channel count, applies to a wide variety of PIC platforms and wavelengths, and offers pathways to automated high-throughput packaging. Using this method, we show optically and electrically packaged quantum memory modules integrating all required qubit controls on chip, operating at millikelvin temperatures with <3 dB losses achievable from fiber to quantum memory for the TE 0 mode at a wavelength of 737 nm.

Bernson, Robert [Tyndall National Institute, Cork ↗
DOE OSTI2025

Telecom-to-visible quantum frequency converter on a silicon nitride chip

Quantum frequency conversion serves a key role in the realization of hybrid quantum networks by interfacing between wavelength-incompatible platforms. Here we present what is believed to be the first quantum frequency converter connecting visible and telecom domains on a silicon nitride (SiN) chip, using Bragg-scattering four-wave mixing to upconvert heralded single photons from 1260 to 698 nm, which covers a 192 THz span. We examine the noise sources in SiN and devise approaches to suppress noise photons at the source and target frequencies to enable measurements at the single-photon level. We demonstrate an on-chip conversion efficiency of 5% in photon flux and describe design modifications that can be implemented to significantly improve it. Our results pave the way for the implementation of complementary metal-oxide-semiconductor (CMOS)-compatible devices in quantum networks.

59 BASIC BIOLOGICAL SCIENCES↗
DOE OSTI2024

Beam test results for the Endcap Timing ReadOut Chip (ETROC2) for the CMS ETL upgrade

The Endcap Timing ReadOut Chip (ETROC) for the Compact Muon Solenoid (CMS) Minimum ionizing particle Timing Detector (MTD) is designed to process Low Gain Avalanche Diode (LGAD) signals with a time resolution of 40-50ps per hit, with 30-35 ps per charged particle using two layer detector. The ETROC2, is the first full size (16x16 pixels) and full functionally design that has been tested in hadron and electron beams at CERN and DESY (Sep 2023 - June 2024). Precision timing studies at these test beams are done using a self-referential beam telescope composed of up to 4 layers/chips. This talk describes the ETROC2 beam telescope and summarizes the performance of the ETROC2 chips bump-bonded to (16x16) Fondazione Bruno Kessler (FBK) and Hamamatsu Photonics K.K. (HPK) LGAD sensors using results from recent test beams. The experiences and lessons learned during the course of these test beams are also detailed in this talk.

Safdari, Murtaza↗
DOE OSTI2024

The Single Event Error (SEE) test and analysis of the CMS Endcap Timing Layer readout chip

The ETROC2, the first full size and full functionality prototype chip for the CMS Endcap Timing Layer readout, is strategically designed to meet the SEE immunity requirements of detector operation with the low power constraint. The triplicated periphery and pixel I2C configuration registers are designed with self-correction feature. The pixel readout control is centralized in the global readout and fully triplicated. The pixel readout is not triplicated, instead protected with power-efficient one-bit correction Hamming code. The TMR protection of the on-pixel threshold calibration can be turned off allowing the detection of the beam spot during the beam test by checking the bit-flips of the internal memory cells. In the initial proton beam test in January 2024, the chip readout process did not hang throughout the tests. The Hamming code correction strategy works because the error corrected TDC data were observed in the data frames. The error-injection simulation is performed to analy ze the small number of bit-flips in the configuration registers. We also performed SEE testing with a heavy ion beam in April and the data analysis is ongoing. The detailed design on the SEE immunity and the testing as well as simulation results will be presented, including follow-up SEE testing results in May and June 2024.

Gong, Datao↗
DOE OSTI2025

Shear Assisted Processing and Extrusion of Magnesium Alloy Machining Chips

The Pacific Northwest National Laboratory (PNNL) utilized Shear Assisted Processing and Extrusion (ShAPE) to convert magnesium alloy machining chips directly into wrought material. PNNL fabricated 0.25” and 0.50” round rod from cold compacted briquettes pressed from dry-machined chips by Loukus Technologies. The alloy composition is proprietary and protected by a Materials Transfer Agreement (MTA) between PNNL and Loukus. Extrusions were fabricated using the ShAPE 2.0 machine, tooling, and process. PNNL is evaluating tensile properties per ASTM E8 and microstructure for grain size, texture, and porosity using Scanning Electron Microscopy (SEM) and Electron Backscatter Diffraction (EBSD). Tensile properties and microstructure results were not available at the time of writing this document. Extruded rods have also been sent to Loukus for evaluation.

36 MATERIALS SCIENCE↗
DOE OSTI2025

Automated Detection of Qubit Structures on Quantum Chips

In this study, YOLO (You Only Look Once), a well-known object detection and image segmentation model, is used to detect qubits on a quantum chip. The model is trained by exposing it to various images of objects of interest and by setting various training parameters to allow the model to learn in unconventional conditions. We were able to provide the model with numerous images of qubits and various prominent features of note located on a qubit. We then created a simple GUI to display the model's live detections that would be integrated with the SEMs. This allowed us to create various functions such as auto-imagery of the qubits across a chip, auto-focusing, auto-contrasting, automatic staging, and directional corrections, enabling users to scan and analyze qubit surfaces in a fast and effective manner.

Perjuste, Ruth [Wellesley Coll.]↗
DOE OSTI2021

Rolled-up electromagnetic component for on-chip applications and method of making a rolled-up electromagnetic component

A rolled-up electromagnetic component for on-chip applications comprises: a multilayer sheet in a rolled configuration comprising at least one turn about a longitudinal axis; a core defined by a first turn of the rolled configuration; and a soft magnetic material disposed within the core, where the multilayer sheet comprises a conductive pattern layer on a strain-relieved layer. A method of making a rolled-up electromagnetic component for on-chip applications includes forming a rolled-up device comprising: a multilayer sheet in a rolled configuration having at least one turn about a longitudinal axis, where the multilayer sheet comprises a conductive pattern layer on a strain-relieved layer; and a core defined by a first turn of the rolled configuration. The method further includes introducing a soft magnetic material into the core.

Li, Xiuling↗