Nanoporous Wood Chips Based Sizable, Robust, and Low-Cost Honeycomb Vacuum Insulation Panels (DOE BENEFIT Final Research Performance Progress Report (RPPR))
Conventional vacuum insulation panels (VIPs) suffer from severe limitations including high cost, vulnerability to perforation, and significant performance degradation over time due to vacuum loss. InventWood Inc. (IW) and partnering teams completely re-engineered the VIP structure by constructing arrays of isolated vacuum-cells to enable limited cutting at designated areas (in between vacuum cells) and reduced consequential vacuum loss due to puncture. The teams also replaced the expensive vacuum insulation core materials with a low-cost commercial wood pulp and recycled long fiber. The wood pulp derived VIP can deliver an overall panel insulation of R15 (<0.01W/m·K) with over 90% thermal resistance retention after cutting (R13.5 overall, R5 along the cut edges). In addition, the vacuum-cell-array design minimizes edge losses, resulting in more durable performance, longer service life (>50 years), and higher R-value per dollar towards a cost target of <$1/ft 2 ·in. It is anticipated that the Nanochip-VIP will attract strong market interest and become an affordable insulation solution for energy efficient buildings and retrofits, leading to significant reductions in energy usage.