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NASA NTRS2013

Packaging Technologies for High Temperature Electronics and Sensors

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500 C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550 C. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500 C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500 C are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Chen, Liang-Yu↗

NASA NTRS2013

Packaging Technologies for High Temperature Electronics and Sensors

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500degC silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chiplevel packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550degC. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500degC for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500degC are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Electronic packaging↗

NASA NTRS2013

Packaging Technologies for 500C SiC Electronics and Sensors

Various SiC electronics and sensors are currently under development for applications in 500C high temperature environments such as hot sections of aerospace engines and the surface of Venus. In order to conduct long-term test and eventually commercialize these SiC devices, compatible packaging technologies for the SiC electronics and sensors are required. This presentation reviews packaging technologies developed for 500C SiC electronics and sensors to address both component and subsystem level packaging needs for high temperature environments. The packaging system for high temperature SiC electronics includes ceramic chip-level packages, ceramic printed circuit boards (PCBs), and edge-connectors. High temperature durable die-attach and precious metal wire-bonding are used in the chip-level packaging process. A high temperature sensor package is specifically designed to address high temperature micro-fabricated capacitive pressure sensors for high differential pressure environments. This presentation describes development of these electronics and sensor packaging technologies, including some testing results of SiC electronics and capacitive pressure sensors using these packaging technologies.

Chen, Liang-Yu↗

NASA NTRS1972

Method for measuring static Young's modulus of tungsten to 1900 K

An instrument system was developed and tested to measure static Young's modulus of elasticity of refractory metals in tension at temperatures to 1900 K. The extensometer uses capacitance displacement sensors for measuring total elongation of a specimen and incorporates a unique high-resolution remote zero-adjusting mechanism. Details of a method for calibrating capacitance displacement sensors at temperatures to 800 K are included. The system was built to adapt to a vacuum furnace on a tensile machine and was tested on unalloyed tungsten rod specimens. The test results show that the system can measure the modulus of tungsten to 1900 K to within a precision of + or - 5 percent. The uncertainty of the measurement is estimated to be of the same order as the precision.

Harrigill, W. T., Jr.↗

NASA NTRS1991

Avoiding space robot collisions utilizing the NASA/GSFC tri-mode skin sensor

Sensor based robot motion planning research has primarily focused on mobile robots. Consider, however, the case of a robot manipulator expected to operate autonomously in a dynamic environment where unexpected collisions can occur with many parts of the robot. Only a sensor based system capable of generating collision free paths would be acceptable in such situations. Recently, work in this area has been reported in which a deterministic solution for 2DOF systems has been generated. The arm was sensitized with 'skin' of infra-red sensors. We have proposed a heuristic (potential field based) methodology for redundant robots with large DOF's. The key concepts are solving the path planning problem by cooperating global and local planning modules, the use of complete information from the sensors and partial (but appropriate) information from a world model, representation of objects with hyper-ellipsoids in the world model, and the use of variational planning. We intend to sensitize the robot arm with a 'skin' of capacitive proximity sensors. These sensors were developed at NASA, and are exceptionally suited for the space application. In the first part of the report, we discuss the development and modeling of the capacitive proximity sensor. In the second part we discuss the motion planning algorithm.

Prinz, F. B.↗

NASA NTRS1991

Commercial Capaciflector

A capacitive proximity/tactile sensor with unique performance capabilities ('capaciflector' or capacitive reflector) is being developed by NASA/Goddard Space Flight Center (GSFC) for use on robots and payloads in space in the interests of safety, efficiency, and ease of operation. Specifically, this sensor will permit robots and their attached payloads to avoid collisions in space with humans and other objects and to dock these payloads in a cluttered environment. The sensor is simple, robust, and inexpensive to manufacture with obvious and recognized commercial possibilities. Accordingly, NASA/GSFC, in conjunction with industry, is embarking on an effort to 'spin' this technology off into the private sector. This effort includes prototypes aimed at commercial applications. The principles of operation of these prototypes are described along with hardware, software, modelling, and test results. The hardware description includes both the physical sensor in terms of a flexible printed circuit board and the electronic circuitry. The software description will include filtering and detection techniques. The modelling will involve finite element electric field analysis and will underline techniques used for design optimization.

Vranish, John M.↗

NASA NTRS1992

On Capaciflector sensor data interpretation using the constrained deconvolution algorithm

The Capaciflector, a capacitive proximity sensor, is being developed by NASA for collision avoidance. Capaciflector provides a single output value as measure of altered base frequency. This value is a characteristic of an external object in the sensor's field of view. An attempt is made to use the Capaciflector for imaging with operating range from 1 to 2 inches. By positional arangement of sensors in a grid pattern and electronic activation of sensors over the grid one at a time an object characteristic image is obtained. The article describes the Capaciflector experimental imaging system and preliminary results obtained by the system.

Campbell, Charles E., Jr.↗

NASA NTRS2010

Mapping Capacitive Coupling Among Pixels in a Sensor Array

An improved method of mapping the capacitive contribution to cross-talk among pixels in an imaging array of sensors (typically, an imaging photodetector array) has been devised for use in calibrating and/or characterizing such an array. The method involves a sequence of resets of subarrays of pixels to specified voltages and measurement of the voltage responses of neighboring non-reset pixels.

Seshadri, Suresh↗

NASA NTRS1994

Capaciflector Camera

Sensing electrodes arranged in rows and columns used to generate capacitive images. Sensors of this type installed on robot arms, and three-dimensional capacitance images that they generate used by robot-control circuits to prevent collisions with capacitively sensed objects, to image and identify these objects, and to navigate amongst them.

Vranish, John M.↗

NASA NTRS2015

Packaging Technologies for 500 C SiC Electronics and Sensors: Challenges in Material Science and Technology

This paper presents ceramic substrates and thick-film metallization based packaging technologies in development for 500C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550C. The 96 alumina packaging system composed of chip-level packages and PCBs has been successfully tested with high temperature SiC discrete transistor devices at 500C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC junction field-effect-transistor (JFET) with a packaging system composed of a 96 alumina chip-level package and an alumina printed circuit board was tested on low earth orbit for eighteen months via a NASA International Space Station experiment. In addition to packaging systems for electronics, a spark-plug type sensor package based on this high temperature interconnection system for high temperature SiC capacitive pressure sensors was also developed and tested. In order to further significantly improve the performance of packaging system for higher packaging density, higher operation frequency, power rating, and even higher temperatures, some fundamental material challenges must be addressed. This presentation will discuss previous development and some of the challenges in material science (technology) to improve high temperature dielectrics for packaging applications.

dielectric properties↗

NASA NTRSDate not supplied

Minimally Intrusive Single-Chip Recession/Temperature Sensors for Spacecraft Thermal Protection Systems

We report the initial results of ongoing development of minimally intrusive, single-chip integrated capacitive recession/temperature sensors that would provide real-time monitoring of ablation recession of heatshield thermal protection systems (TPS) during spacecraft atmospheric entry. This work, which was performed using Phenolic Impregnated Carbon Ablator (PICA), is also to demonstrate the ease of sensor insertion during TPS manufacturing, thereby resulting in faster, low-cost, uniform sensor assembly, and spatial distribution, without compromising TPS structural integrity. Using oxy-acetylene flame at 500 W-cm-2 heat flux for 16 seconds, the average recession depth of 3.25 mm was obtained. Some measurement problems were encountered in this first attempt. However, the initial results obtained are in relatively good agreement with published data, and offer promise of future improvement based on lessons learned.

Recession↗

NASA NTRS1975

An aneroid pressure sensor for constant-level balloons

The pressure sensor for the Tropical Wind Energy conversion and Reference Level Experiment (TWERLE) is described. Key design features of the sensor are: capacitive coupling, reference at midrange, up-down counting, passive oven, storage at flight pressure and prelaunch calibration. Sensor specifications are given which are based on the production results of 440 units. Drift, as estimated from simulated life tests, is 1 mb per 6 months. The overall weight of the sensor, including thermal package, is 180 g.

Levanon, N.↗

NASA NTRS2004

Spiral Chip Implantable Radiator and Printed Loop External Receptor for RF Telemetry in Bio-Sensor Systems

The paper describes the operation of a patented wireless RF telemetry system, consisting of a bio-MEMS implantable sensor and an external hand held unit, operating over the frequency range of few hundreds of MHz. A MEMS capacitive pressure sensor integrated with a miniature inductor/antenna together constitute the implantable sensor. Signal processing circuits collocated with a printed loop antenna together form the hand held unit, capable of inductively powering and also receiving the telemetry signals from the sensor. The paper in addition, demonstrates a technique to enhance the quality factor and inductance of the inductor in the presence of a lower ground plane and also presents the radiation characteristics of the loop antenna.

Simons, Rainee N.↗

NASA NTRS1984

Eddy current jet engine disk-crack monitor

A disk-crack monitor is described that is suitable for use on the ground or in flight. The system consists of an engine-mounted eddy current sensor, a series capacitance in each leg of the sensor circuit, and a capacitance-conductance bridge followed by an oscilloscope capable of advanced signal processing. It was applied to the detection of service-induced cracks in the first-stage turbine wheel of a helicopter engine. A 3.5 mm long radial fatigue crack plus smaller cracks, all located in the blade root region of the wheel, were detected during engine test stand operation at ground idle speed and temperature. The calculation of the value of series capacitance is also presented.

Barranger, J. P.↗

NASA NTRS2004

High-Resolution Displacement Sensor Using a SQUID Array Amplifier

Improvement in the measurement of displacement has profound implications for both exploration technologies and fundamental physics. For planetary exploration, the new SQUID-based capacitive displacement sensor will enable a more sensitive gravity gradiometer for mapping the interior of planets and moons. A new concept of a superfluid clock to be reported by Penanen and Chui at this workshop is also based on a high-resolution displacement sensor. Examples of high-impact physics projects that can benefit from a better displacement sensor are: detection of gravitational waves, test of the equivalence principle, search for the postulated "axion" particle, and test of the inverse square law of gravity. We describe the concept of a new displacement sensor that makes use of a recent development in the Superconducting Quantum Interference Device (SQUID) technology. The SQUID array amplifier, invented by Welty and Martinis (IEEE Trans. Appl. Superconductivity 3, 2605, 1993), has about the same noise as a conventional SQUID; however, it can work at a much higher frequency of up to 5 MHz. We explain how the higher bandwidth can be translated into higher resolution using a bridge-balancing scheme that can simultaneously balance out both the carrier signal at the bridge output and the electrostatic force acting on the test mass.

Chui, Talso↗

NASA NTRS1999

Giant Magnetoresistive (GMR) Sensor Microelectromechanical System (MEMS) Device

The measurement of acceleration has been accomplished using several technologies in high-reliability applications such as guidance control, detonation, and shock/vibration measurement. Electromechanical, piezoelectric, piezoresistive, and capacitive acceleration sensors are available and the literature pertinent to giant magnetoresistive sensors (GMR) for the above applications are scanty.

acceleration MEMS GMR giant magnetoresistive senso↗

NASA NTRS1992

Dielectric measurement using an open ended coaxial line with an extended center conductor

Permittivity may be determined by measuring the complex reflection coefficient of an open-ended coaxial line placed in contact with a test sample. This method works best for liquid samples. For the measurement of non-liquid materials problems can arise. A perfect preparation is needed to provide a good contact between the tip and the dielectric medium. At times, the dimension of the sensor cannot be freely chosen, as is the case for the measurement of the dielectric constant of the xylem layer of a living tree. The influence of the installation of the sensor on a tree's water status must be minimized by using a small sensor. In such cases the capacitance cannot be optimized. By extending the center conductor of the open-ended coaxial line, some of these problems can be avoided. This provides an additional tool to tune the capacitance of the sensor by adjusting the length of the extension. Therefore the measurement accuracy can be optimized. The sensor also becomes sensitive to a larger volume. A comparative study of a flush and extended tipped probes shows that the ability to measure the dielectric constant of trees has been notably increased due to the extension of the center conductor.

Wegmueller, Urs↗

NASA NTRS2003

Microgyroscope with Vibrating Post as Rotation Transducer

The figure depicts a micromachined silicon vibratory gyroscope that senses rotation about its z axis. The rotation-sensitive vibratory element is a post oriented (when at equilibrium) along the z axis and suspended at its base by thin, flexible silicon bands oriented along the x and y axes, respectively. Unlike in the vibratory microgyroscopes described in the immediately preceding article ["Cloverleaf Vibratory Microgyroscope With Integrated Post" (NPO-20688)] and other previous articles in NASA Tech Briefs, the rotation-sensitive vibratory element does not include a cloverleaf-shaped structure that lies (when at equilibrium) in the x-y plane. As in the cases of the previously reported vibratory microgyroscopes, vibrations of the rotation-sensitive vibratory element are excited electrostatically, the vibrations are measured by use of capacitive proximity sensors, and the rate of rotation along the axis of sensitivity is deduced from the effect of the Coriolis force upon the vibrations. To create electrodes for electrostatic excitation and capacitive sensing of vibrations, portions of the facing surfaces of the post and of the four stationary members that surround the post are rendered electrically conductive; this can be accomplished by either depositing metal films or else doping the silicon in the affected areas.

Tang, Tony K.↗