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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 91 records · Page 5
All sourcesNASA NTRSDOE OSTI
DOE OSTI2021

Peripheral end face attachment of exposed copper layers of a first printed circuit board to the surface of a second printed circuit board by surface mount assembly

A printed circuit board (PCB) structure and mounting assembly for joining two PCBs. A first PCB has a top and bottom surface faces and a peripheral end face separating the top and bottom surface. The first PCB has one or more conductive wire ends exposed at a surface of the peripheral end face; the exposed conductive wire ends forming multiple separate electrical contacts across the thickness and length of the PEF surface. A second PCB has a top surface face and one or more conductive pads exposed at the top surface at locations corresponding to locations of the multiple electrical contacts. A surface mount solder material is disposed on one or more exposed conductive pads for electrically connecting with corresponding the multiple electrical contacts. The disposed solder material stably joins the PEF surface of the first PCB to the top surface of the second PCB in a relative perpendicular orientation.

Takken, Todd E.↗
DOE OSTI2015

An Internal ALD-Based High Voltage Divider and Signal Circuit for MCP-based Photodetectors

We describe a pin-less design for the high voltage (HV) resistive divider of the all-glass LAPPD (TM) 8 in,square thin photodetector module. The divider, which distributes high voltage applied to the photocathode to the two micro-channel plates (MCPs) that constitute the amplification stage, is comprised of the two MCPs and three glass mechanical spacers, each of which is coated with a resistive layer using atomic layer deposition (ALD). The three glass grid spacers and the two MCPs form a continuous resistive path between cathode and anode, with the voltages across the MCPs and the spacers determined by the resistance of each. High voltage is applied on an external tab on the top glass window that connects to the photocathode through the metal seal. The DC ground is supplied by microstrips on the bottom glass plate that form the high-bandwidth anode. The microstrips exit the package through the glass-frit seal of the anode base-plate and the package sidewall. The divider is thus completely internal, with no HV pins penetrating the low-profile flat glass package. Measurements of the performance of the divider are presented for the 8 in.-square MCP and spacer package in a custom test fixture and for an assembled externally pumped LAPPD (TM) prototype with an aluminum photocathode. (C) 2015 Elsevier B.V. All rights reserved.

Adams, Bernhard W.↗
DOE OSTI2015

Silicon-nitride photonic circuits interfaced with monolayer MoS 2

Herein we report integration of monolayer molybdenum disulphide with silicon nitride microresonators assembled by visco-elastic layer transfer techniques. Evanescent coupling from the resonator mode to the monolayer is confirmed through measurements of cavity transmission. The absorption of the monolayer semiconductor flakes in this geometry is determined to be 850 dB/cm, which is larger than that of graphene and black phosphorus with the same thickness. This technique can be applied to diverse monolayer semiconductors for assembling hybrid optoelectronic devices such as photodetectors and modulators operating over a wide spectrum range.

36 MATERIALS SCIENCE↗
DOE OSTI2016

The impact of ultra-thin titania interlayers on open circuit voltage and carrier lifetime in thin film solar cells

We study the effects of modifying indium tin oxide electrodes with ultrathin titania (TiO 2 ) layers grown via plasma-enhanced atomic layer deposition (PE-ALD). We find an optimal thickness of PE-ALD-grown titania by tracking performance, which initially increases, peaks, and eventually decreases with increasing TiO 2 thickness. We use scanning Kelvin probe microscopy (SKPM) to measure both the local work function and its distribution as a function of TiO 2 thickness. We find that the variance in contact potential difference across the surface of the film is related to either the amorphous or anatase TiO 2 form. Finally, we use local SKPM recombination rate experiments, supported by bulk transient photovoltage and charge extraction measurements. Here, we show that the optimum TiO 2 thickness is the one for which the carrier lifetime is the longest and the charge carrier density is the highest, when the TiO 2 is amorphous, in agreement with the device measurements.

14 SOLAR ENERGY↗