Engineering Papers⌕ Search

SEARCH · Engineering Papers

Results for “wire”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 883 records · Page 49

Ceramic wiring board increases packaging density of electronic modules

Ceramic multilayer wiring board interconnects large scale integration /LSI/ modules which dissipate nearly 2W/cc. Extremely high packaging density is possible by application of alumina cover hermetically sealed to board. Signal interconnections are completely dependent on transfer heat between layers.

Hamley, L. D.↗