SEARCH · Engineering Papers
Results for “interconnects”
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.
IRPS 2013 tutorial: Reliability of Low-k Interconnect Dielectrics in Advanced CMOS Technologies.
Abstract not provided.
Integrated Energy-Water Planning in the Western and Texas Interconnections.
Abstract not provided.
FleX-3D Wafer Processing for Chip Stacking and Interconnect
Explore the source record for details and available documents.
Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics
In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.
Predicting the Reliability Of Package-on-Package Interconnections Using Computational Modeling.
Abstract not provided.
Power module packaging with double sided planar interconnection and heat exchangers
A double sided cooled power module package having a single phase leg topology includes two IGBT and two diode semiconductor dies. Each IGBT die is spaced apart from a diode semiconductor die, forming a switch unit. Two switch units are placed in a planar face-up and face-down configuration. A pair of DBC or other insulated metallic substrates is affixed to each side of the planar phase leg semiconductor dies to form a sandwich structure. Attachment layers are disposed on outer surfaces of the substrates and two heat exchangers are affixed to the substrates by rigid bond layers. The heat exchangers, made of copper or aluminum, have passages for carrying coolant. The power package is manufactured in a two-step assembly and heating process where direct bonds are formed for all bond layers by soldering, sintering, solid diffusion bonding or transient liquid diffusion bonding, with a specially designed jig and fixture.
Optical interconnect assembly
An optical assembly includes a substrate with a first row of apertures and a second row of apertures. A first optical die includes a first plurality of optical transducer elements and is mounted on the substrate such that an optical signal interface of each transducer element is aligned with an aperture of the first row of optical apertures. A second optical die includes a second plurality of optical transducer elements and is mounted on the substrate such that an optical signal interface of each of the second plurality of optical transducer elements is aligned with an aperture of the second row of optical apertures. A connector configured to mate with the optical assembly supports a plurality of optical fibers. A terminal end of each optical fiber protrudes from the connector and extends into one of the apertures when the connector is coupled with the optical assembly.
Low cost spray-on coatings for protection of SOFC interconnects and BOP components
Explore the source record for details and available documents.
Software Defined Networking for HPC Interconnect and its Extension across Domains
Explore the source record for details and available documents.
Design Methodology for Optimizing Optical Interconnection Networks in High Performance Systems.
Abstract not provided.
Low-cost optical fiber interconnects for networks and high-performance computing
Explore the source record for details and available documents.
Utility Interconnection Standard Revisions and Electric Power System Support Function Development.
Abstract not provided.
Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics
The present invention relates to novel diacylglycerol acyltransferase genes and proteins, and methods of their use. In particular, the invention describes genes encoding proteins having diacylglycerol acetyltransferase activity, specifically for transferring an acetyl group to a diacylglycerol substrate to form acetyl-Triacylglycerols (ac-TAGS), for example, a 3-acetyl-1,2-diacyl-sn-glycerol. The present invention encompasses both native and recombinant wild-type forms of the transferase, as well as mutants and variant forms. The present invention also relates to methods of using novel diacylglycerol acyltransferase genes and proteins, including their expression in transgenic organisms at commercially viable levels, for increasing production of 3-acetyl-1,2-diacyl-sn-glycerols in plant oils and altering the composition of oils produced by microorganisms, such as yeast, by increasing ac-TAG production. Additionally, oils produced by methods of the present inventions comprising genes and proteins are contemplated for use as biodiesel fuel, in polymer production and as naturally produced food oils with reduced calories.
Method to Determine Maximum Allowable Sinterable Silver Interconnect Size
Explore the source record for details and available documents.
Technical Evaluation of the 15% of Peak Load PV Interconnection Screen.
Abstract not provided.