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The current program status reviewed by this viewgraph presentation includes: 1) New Evaluation Results; 2) Algorithm Improvement Investigations; 3) Electronic Hardware Design; 4) Software Hardware Interface Design.
Brushlike arrays of electrodes packaged with application-specific integrated circuits (ASICs) are undergoing development for use as electronic implants especially as neuro-prosthetic devices that might be implanted in brains to detect weak electrical signals generated by neurons. These implants partly resemble the ones reported in Integrated Electrode Arrays for Neuro-Prosthetic Implants (NPO-21198), NASA Tech Briefs, Vol. 27, No. 2 (February 2003), page 48. The basic idea underlying both the present and previously reported implants is that the electrodes would pick up signals from neurons and the ASICs would amplify and otherwise preprocess the signals for monitoring by external equipment. The figure presents a simplified and partly schematic view of an implant according to the present concept. Whereas the electrodes in an implant according to the previously reported concept would be microscopic wires, the electrodes according to the present concept are in the form of microscopic needles. An even more important difference would be that, unlike the previously reported concept, the present concept calls for the inclusion of microelectromechanical actuators for adjusting the depth of penetration of the electrodes into brain tissue. The prototype implant now under construction includes an array of 100 electrodes and corresponding array of electrode contact pads formed on opposite faces of a plate fabricated by techniques that are established in the art of microelectromechanical systems (MEMS). A mixed-signal ASIC under construction at the time of reporting the information for this article will include 100 analog amplifier channels (one amplifier per electrode). On one face of the mixed-signal ASIC there will be a solder-bump/micro-pad array that will have the same pitch as that of the electrode array, and that will be used to make the electrical and mechanical connections between the electrode array and the ASIC. Once the electrode array and the ASIC are soldered together, the remaining empty space between them will be filled with a biocompatible epoxy, the remaining exposed portions of the ASIC will be covered with micromachined plates for protection against corrosive bodily fluids, and then the ASIC and its covering micromachined plates will be coated with parylene
The last few years have seen a surge in technology, device, and architecture introductions in commercial memories such as SDRAM and NAND driven by the explosion of handheld and portable electronics. Some of the resultant devices provide high density in very small and light packages, which may be possible to leverage for the miniaturization of future GN&C systems in addition to providing considerable memory capacity to enable advanced capabilities such as image-based navigation or adaptive/autonomous operations. We will show that these advanced SDRAM and NAND technologies are worth serious consideration for the next generation of GN&C needs by highlighting reliability and radiation effects results from some of these devices.
Recent innovations are producing a multitude of advanced commercial satellite communications (COMSATCOM) systems that could deliver massive amounts of SATCOM capacity at a fraction of current cost while also offering reliability and availability that is critical to achieving mission success for orbiting assets. Recognizing the alignment of commercial capabilities with the National Aeronautics and Space Administration's (NASA) diverse mission requirements, the agency is proactively engaging industry to formulate strategies leading towards a NASA communications architecture that includes advanced commercial capabilities. To fully leverage the expanded space resources, NASA must also address the integration of commercial waveforms into its space terminals. In pursuit of similar goals, the United States Department of Defense (DoD) is leading the standardization of the flexible modem interface (FMI) to address service integration for their tactical terminals in pursuit of a DoD Wideband SATCOM Enterprise.This paper describes how NASA is adapting this FMI standard to work with the Space Telecommunications Radio System (STRS) software-defined radio (SDR) framework to address the challenging size, weight, and power resource requirements for terminals in space. A full adaptation would include waveform compatibility with modular baseband processing, frequency compatibility with a wideband front end, and radiated beam control with an electronically steerable antenna to enable multi-provider commercial service capability in a feasible package for space terminals. Security is also a key aspect to be addressed for this integration since data will flow through commercial networks, commercial service providers have their own security mechanisms, and space terminals must be able to securely load proprietary software and firmware needed to access the commercial networks on demand. Success of this effort means commercial partners will be able to allow network-compliant implementations to be hosted on STRS-compliant SDRs in space for reliable and capable network access.
A scalable, compact oven testbed system for simultaneously evaluating a multitude of high temperature integrated circuits (ICs) for prolonged operating times of up to 600 °C has been prototyped. The new testbed system enables long-duration high temperature testing in sufficient statistical quantities consistent with standard aerospace electronics engineering standards. This setup is comprised of multiple compact ovens housing chips or packages mounted to ceramic circuit boards. Each oven is a compact 15.2 cm length by 15.2 cm width by 12.7 cm depth with a maximum 400 Watts of heating power. The custom-made silicon oxide ceramic heating block inside each oven is based on a 3D printed design adapted for the easy insertion of the IC device under test (DUT). This innovative design provides the quick insertion of ICs with or without a ceramic package into a 600 °C environment by utilizing a movable 11.43 cm long ceramic substrate with electrical traces extending from the oven hot zone to external standard plastic-based board connectors. Another key oven design feature is the minimization of the DUT exposure to electromagnetic interference (EMI) by utilizing a filtered DC power source to reduce heating element noise. Additionally, the ovens can be configured in a parallel arrangement allowing global data monitoring over a single industrial RS422 serial port. This feature is important for scaling up to test multiple ICs semi-simultaneously. A USB serial port is provided to independently control the operating parameters of each oven such as the oven target temperature and oven ramp rate. The oven temperature can reach up to 600 °C with a confirmed +/- 4 °C maximum deviation across the test zone region. The ramp rate can be programmed from 1 °C/minute up to 10 °C/minute. Furthermore, a programmable switchboard is used to interface with the DUT. This switchboard comprises a National Instruments Peripheral Component Interconnect eXtension for Instrumentation (NI PXI) system and a breakout board to send and receive power, analog or digital test signals. By using this unique oven testbed system, a variety of ICs can now be tested in parallel using the same test components configured for a diverse set of requirements.
Here we present a workflow of practical calculations of electron-phonon (e-ph) coupling with many-electron correlation effects included using the GW perturbation theory (GWPT). This workflow combines BerkeleyGW, ABINIT, and EPW software packages to enable accurate e-ph calculations at the GW self-energy level, going beyond standard calculations based on density functional theory (DFT) and density-functional perturbation theory (DFPT). This workflow begins with DFT and DFPT calculations (ABINIT) as starting point, followed by GW and GWPT calculations (BerkeleyGW) for the quasiparticle band structures and e-ph matrix elements on coarse electron k- and phonon q-grids, which are then interpolated to finer grids through Wannier interpolation (EPW) for computations of various e-ph coupling determined physical quantities such as the electron self-energies or solutions of anisotropic Eliashberg equations, among others. A gauge-recovering symmetry unfolding technique is developed to reduce the computational cost of GWPT (as well as DFPT) while fulfilling the gauge consistency requirement for Wannier interpolation.
Thermal density functional theory is commonly used in simulations of warm dense matter, a highly energetic phase characterized by substantial thermal effects and by correlated electrons demanding quantum mechanical treatment. Methods that account for temperature dependence, such as Mermin–Kohn–Sham finite-temperature density functional theory and free energy density functional theory, are now employed with more regularity and available in many standard code packages. However, approximations from zero-temperature density functional theory are still often used in temperature-dependent simulations using thermally weighted electronic densities as an input to exchange–correlation functional approximations, a practice known to miss temperature-dependent effects in the exchange–correlation free energy of these systems. Here, in this work, the temperature-dependent adiabatic connection is demonstrated and analyzed using a well-known parameterization of the uniform electron gas free energy. Useful tools based on this formalism for analyzing and constraining approximations of the exchange–correlation at zero temperature are leveraged for the finite-temperature case. Inspired by the Lieb–Oxford inequality, which provides a lower bound for the ground-state exchange–correlation energy, bounds for the exchange–correlation at finite temperatures are approximated for various degrees of electronic correlation.
Here, we conduct systematic simulations of single-electron packet durations in the electron-gun region of a Thermo Fisher/FEI TecnaiFemto UEM. Furthermore, we conducted particle tracing simulations with the General Particle Tracer software package and using field maps generated from the precise Tecnai Femto gun architecture with the Poisson Superfish code.
Silicon carbide (SiC) and other wide bandgap semiconductors offer great promise of high power rating, high operating temperature, simple thermal management, and ultrahigh power density for both space and commercial power electronic systems. However, this great potential is seriously limited by the lack of reliable high-temperature device packaging technology. This Phase II project developed an ultracompact hybrid power module packaging technology based on the use of double lead frames and direct lead frame-to-chip transient liquid phase (TLP) bonding that allows device operation up to 450 degC. The new power module will have a very small form factor with 3-5X reduction in size and weight from the prior art, and it will be capable of operating from 450 degC to -125 degC. This technology will have a profound impact on power electronics and energy conversion technologies and help to conserve energy and the environment as well as reduce the nation's dependence on fossil fuels.
NASAs future exploration missions focus on the manned exploration of the Moon, Mars, and beyond, which will rely heavily on the development of a reliable communications infrastructure from planetary surface-to-surface, surface-to-orbit, and back to Earth. Flexible antennas are highly desired in many scenarios. Active phased array antennas (active PAAs) with distributed control and processing electronics at the surface of an antenna aperture offer numerous advantages for radar communications. Large-area active PAAs on flexible substrates are of particular interest in NASA s space radars due to their efficient inflatable package that can be rolled up during transportation and deployed in space. Such an inflatable package significantly reduces stowage volume and mass. Because of these performance and packaging advantages, large-area inflatable active PAAs are highly desired in NASA s surface-to-orbit and surface-to-relay communications. To address the issues of flexible electronics, a room-temperature printing process of active phased-array antennas on a flexible Kapton substrate was developed. Field effect transistors (FETs) based on carbon nanotubes (CNTs), with many unique physical properties, were successfully proved feasible for the PAA system. This innovation is a new type of fully inkjet-printable, two-dimensional, high-frequency PAA on a flexible substrate at room temperature. The designed electronic circuit components, such as the FET switches in the phase shifter, metal interconnection lines, microstrip transmission lines, etc., are all printed using a special inkjet printer. Using the developed technology, entire 1x4, 2x2, and 4x4 PAA systems were developed, packaged, and demonstrated at 5.3 GHz. Several key solutions are addressed in this work to solve the fabrication issues. The source/drain contact is developed using droplets of silver ink printed on the source/drain areas prior to applying CNT thin-film. The wet silver ink droplets allow the silver to wet the CNT thin-film area and enable good contact with the source and drain contact after annealing. A passivation layer to protect the device channel is developed by bonding a thin Kapton film on top of the device channel. This film is also used as the media for transferring the aligned CNT thin-film on the device substrate. A simple and cost-effective technique to form multilayer metal interconnections on flexible substrate is developed and demonstrated. Contact vias are formed on the second substrate prior to bonding on the first substrate. Inkjet printing is used to fill the silver ink into the via structure. The printed silver ink penetrates through the vias to contact with the contact pads on the bottom layer. It is then annealed to form a good connection. One-dimensional and two-dimensional PAAs were fabricated and characterized. In these circuits, multilayer metal interconnects were used to make a complete PAA system.
Modeling complex materials using high-fidelity, ab initio methods at low cost is a fundamental goal for quantum chemical software packages. The GW approximation and random phase approximation (RPA) provide a unified description of both electronic structure and total energies using the same physics in a many-body perturbative approach that can be more accurate than generalized-gradient density functional theory (DFT) methods. However, GW/RPA implementations have historically been limited to either specific materials classes or application toward small chemical systems. Here, the static subspace approximation allows for reduced cost full-frequency GW/RPA calculations and has previously been benchmarked thoroughly for GW calculations. Here, we describe our approach to including partial occupations of electronic orbitals in full-frequency GW and RPA calculations for the study of electrocatalysts. We benchmarked RPA total energy calculations using the subspace approximation across a diverse test suite of materials for a variety of computational parameters. The benchmarking quantifies the impact of different extrapolation procedures for representing the static polarizability at infinite screened cutoff, and shows that using screened cutoffs above 20-25 Ryd result in diminishing accuracy returns for predicting RPA total energies. Additionally, for moderately sized electrocatalytic models, 2-3 times fewer computational resources are used to compute RPA total energies by representing the static polarizability with 20-30% of the static subspace basis, with an error of approximately 0.01 eV or better in RPA adsorption energy calculations. Finally, we show that for these electrochemical models RPA can shift DFT adsorption energy shifts by up to 0.5 eV and that GW can frequently shift DFT eigenvalues of surface and adsorbate states by approximately 0.5-1 eV.
An engineering model opto-mechanical subsystem for a 10.6-micrometer laser heterodyne receiver is developed, and a CO2 waveguide local oscillator and servo electronics are provided for the receiver. Design goals are presented for the subsystems and overall package design is described. Thermal and mechanical distortion loading tests were performed and the results are included.
Those factors affecting the cost of electronic subsystems utilizing LSI microcircuits were determined and the most efficient methods for low cost packaging of LSI devices as a function of density and reliability were developed.
New methods to advance the state-of-the-art of pressure sensors for the Space Shuttle Main Engine were demonstrated. The results of the feasibility and breadboard demonstration phase and the current status of the research development prototype follow-on phase are presented. A technology breakthrough utilizing silicon piezoresistive technology was achieved in the first phase. A transducer design concept for the SSME application utilizes packaging materials with similar thermal coefficients of expansion and maintains the transducer seals primarily in compression. The silicon chip design will provide dual sensing outputs with laser trimmable integrated compensating electronics. The silicon resistor ion implant dose was customized for the SSME temperature requirement. A basic acoustic modeling software program was developed to evaluate the frequency response characteristics for the package design.
The electronic engineering notebook (EEN) consists of a free form research notebook, implemented in a commercial package for distributed hypermedia, which includes utilities for graphics capture, formatting and display of LaTex constructs, and interfaces to the host operating system. The latter capability consists of an information computer-aided software engineering (CASE) tool and a means to associate executable scripts with source objects. The EEN runs on Sun and HP workstations. The EEN, in day-to-day use can be used in much the same manner as the sort of research notes most researchers keep during development of projects. Graphics can be pasted in, equations can be entered via LaTex, etc. In addition, the fact that the EEN is hypermedia permits easy management of 'context', e.g., derivations and data can contain easily formed links to other supporting derivations and data. The CASE tool also permits development and maintenance of source code directly in the notebook, with access to its derivations and data.
Optical spectrometers, and mass spectrometers to a lesser extent, have a long and rich history of use aboard spacecraft. Space mission applications include deep space science spacecraft, earth orbiting satellites, atmospheric probes, and surface landers, rovers, and penetrators. The large size of capable instruments limited their use to large, expensive spacecraft. Because of the novel application of micro-fabrication technologies, compact optical and mass spectrometers are now available. The new compact devices are especially attractive for spacecraft because of their small mass and volume, as well as their low power consumption. Dispersive optical multi-channel analyzers which cover the 0.4-1.1 micrometer wavelength are now commercially available in packages as small as 3 x 6 x 18 mm exclusive of drive and recording electronics. Mass spectrometers as small as 3 x 3 mm, again without electronics, are under development. A variety of compact optical and mass spectrometers are reviewed in this paper. A number of past space applications are described, along with some upcoming opportunities that are likely candidate missions to fly this new class of compact spectrometers.
NASA Glenn Research Center's Direct Data Distribution (D3) project will demonstrate an advanced, high-performance communications system that transmits information from an advanced technology payload carried by a NASA spacecraft in low Earth orbit (LEO) to a small receiving terminal on Earth. The space-based communications package will utilize a solid-state, K-band phased-array antenna that electronically steers the radiated energy beam toward a low-cost, tracking ground terminal, thereby providing agile, vibration-free, electronic steering at reduced size and weight with increased reliability. The array-based link will also demonstrate new digital processing technology that will allow the transmission of substantially increased amounts of latency-tolerant data collected from the LEO spacecraft directly to NASA field centers, principal investigators, or into the commercial terrestrial communications network. The technologies demonstrated by D3 will facilitate NASA's transition from using Government-owned communication assets to using commercial communication services. The hardware for D3 will incorporate advanced technology components developed under the High Rate Data Delivery (HRDD) Thrust Area of NASA's Office of Aerospace Technology Space Base Program at Glenn's Communications Technology Division. The flight segment components will include the electrically steerable phased-array antenna, which is being built by the Raytheon System Corporation and utilizes monolithic microwave integrated circuit (MMIC) technology operating at 19.05 GHz; and the digital encoder/modulator chipset, which uses four-channel orthogonal frequency division multiplexing (OFDM). The encoder/modulator will use a chipset developed by SICOM, Inc., which is both bandwidth and power efficient. The ground segment components will include a low-cost, open-loop tracking ground terminal incorporating a cryoreceiver to minimize terminal size without compromising receiver capability. The project is planning to hold a critical design review in the second quarter of fiscal year 2002.
Simultaneous measurements of the energy spectrum of precipitating electrons and the resulting bremsstrahlung X-ray spectrum were carried out during an auroral event on March 3, 1971, at the Churchill Research Range, Manitoba, Canada. The electron data were obtained with detectors on a Black Brant VB sounding rocket (275-km apogee), while the X-ray flux was measured by an instrument package that was boosted to 60 km on an Arcas rocket. The X-ray package was deployed on a parachute at apogee to provide a slow descent through the atmosphere. Thick-target bremsstrahlung theory is used to calculate the X-ray flux produced by the incident electrons, and a Monte Carlo method is used to predict the X-ray spectrum at various altitudes appropriate for comparison with the measured X-ray data. Satisfactory agreement between theory and experiment is obtained, and the value of the constant in the thick target theory has been estimated to be about 0.00002.