Impact of thermal stress on the piezoelectric and dielectric properties of PbTiO{sub 3} thick films on various substrates
The impact of thermal stress on the polarization, as well as dielectric and piezoelectric properties of (001) oriented PbTiO{sub 3} (PTO) thick films deposited on various substrates was investigated based on Landau-Devonshire thermodynamic model. The results showed that dielectric and piezoelectric properties of PTO films depend strongly on the thermal stress in PTO films decided by the deposition temperature T{sub G} and the thermal expansion coefficients' difference between PTO films and substrates. For IC-compatible substrates such as Si, c-sapphire, and a-sapphire that induce tensile in-plane thermal stresses, the dielectric and piezoelectric responses and tunabilities of PTO films were enhanced. Whereas for PTO films on MgO, compressive thermal in-plane stresses can degraded the dielectric and piezoelectric responses and tunabilities of the films.