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At least 883 records · Page 49

Effect of work of adhesion on deep bed filtration process

Collection of aerosol particles in the particular steps of the technology of their production, and purification of the air at the workplace and atmospheric environment, requires the efficient method of separation of particulate matter from the carrier gas. There are many papers published in last few years in which the deposition of particles on fibrous collectors is considered, Most of them assume that collisions between particle and collector surface is 100% effective. In this work we study the influence of particles and fiber properties on the deposition efficiency. For the purpose of this work the lattice-Boltzmann model describes fluid dynamics, while the solid particle motion is modeled by the Brownian dynamics. The interactions between particles and surface are modelled using energy balanced oscillatory model. The work of adhesion was estimated using Atomic Force Microscopy.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗

The Src Homology 3 Domain Is Required for Junctional Adhesion Molecule Binding to the Third PDZ Domain of the Scaffolding Protein ZO-1

Tight junctions are cell-cell contacts that regulate the paracellular flux of solutes and prevent pathogen entry across cell layers. The assembly and permeability of this barrier are dependent on the zonula occludens (ZO) membrane-associated guanylate kinase (MAGUK) proteins ZO-1, -2, and -3. MAGUK proteins are characterized by a core motif of protein-binding domains that include a PDZ domain, a Src homology 3 (SH3) domain, and a region of homology to guanylate kinase (GUK); the structure of this core motif has never been determined for any MAGUK. To better understand how ZO proteins organize the assembly of protein complexes we have crystallized the entire PDZ3-SH3-GUK core motif of ZO-1. We have also crystallized this core motif in complex with the cytoplasmic tail of the ZO-1 PDZ3 ligand, junctional adhesion molecule A (JAM-A) to determine how the activity of different domains is coordinated. Our study shows a new feature for PDZ class II ligand binding that implicates the two highly conserved Phe{sup -2} and Ser{sup -3} residues of JAM. Our x-ray structures and NMR experiments also show for the first time a role for adjacent domains in the binding of ligands to PDZ domains in the MAGUK proteins family.

59 BASIC BIOLOGICAL SCIENCES↗

Microfabrication of plastic-PDMS microfluidic devices using polyimide release layer and selective adhesive bonding

In this study, we present an improved method to bond poly(dimethylsiloxane) (PDMS) with polyimide (PI) to develop flexible substrate microfluidic devices. The PI film was separately fabricated on a silicon wafer by spin coating followed by thermal treatment to avoid surface unevenness of the flexible substrate. In this way, we could also integrate flexible substrate into standard micro-electromechanical systems (MEMS) fabrication. Meanwhile, the adhesive epoxy was selectively transferred to the PDMS microfluidic device by a stamp-and-stick method to avoid epoxy clogging the microfluidic channels. To spread out the epoxy evenly on the transferring substrate, we used superhydrophilic vanadium oxide film coated glass as the transferring substrate. After the bonding process, the flexible substrate could easily be peeled off from the rigid substrate. Contact angle measurement was used to characterize the hydrophicity of the vanadium oxide film. X-ray photoelectron spectroscopy analysis was conducted to study the surface of the epoxy. We further evaluated the bonding quality by peeling tests, which showed a maximum bonding strength of 100 kPa. By injecting with black ink, the plastic microfluidic device was confirmed to be well bonded with no leakage for a day under 1 atm. Finally, this proposed versatile method could bond the microfluidic device and plastic substrate together and be applied in the fabrication of some biosensors and lab-on-a-chip systems.

42 ENGINEERING↗

Development and First Results of the Width-Tapered Beam Method for Adhesion Testing of Photovoltaic Material Systems

A fracture mechanics based approach for quantifying adhesion at every interface within the PV module laminate is presented. The common requirements of monitoring crack length and specimen compliance are circumvented through development of a width-tapered cantilever beam method. This technique may be applied at both the module and coupon level to yield a similar, quantitative, measurement. Details of module and sample preparation are described and first results on field-exposed modules deployed for over 27 years presented.

14 SOLAR ENERGY↗

Conductive Adhesives for Metallization of Interdigitated Back Contact Solar Cells

The metallization and interconnection of Si solar cells to form a module is usually a multi-step process: cells are metallized individually, soldered into strings, and subsequently assembled into a module. Furthermore, the metallization process for individual cells must be compatible with the doped surfaces being contacted, which creates additional challenges when moving from diffused junctions to heterojunctions and/or passivated contact structures. To mitigate these problems and streamline module manufacturing for the case of interdigitated back contact (IBC) cell modules, we developed an approach wherein unmetallized IBC cells are bonded directly to a circuitized backsheet using a conductive adhesive (CA) that only conducts out-of-plane. The metal/CA/silicon stack is bonded by hot-pressing at 100-200 degrees C.For a CA consisting of ethylene vinyl acetate (EVA) filled with Ag-coated spheres or indium powder we find that contact resistivities in the range of 1-10 Wcm 2 are obtained, regardless of which conductive filler and which hot pressing parameters are used. XPS revealed that about 1-2 nm EVA residue bonds to the Si in these samples, suggesting the formation of an insulating barrier that is responsible for the high contact resistance. Using indium powder alone, improved contact resistivities <0.6 Wcm 2 , high shunt resistances, and an implied open-circuit voltage loss below 10 mV were obtained. Furthermore, a cost estimate is presented, indicating that substantial cost savings of up to $10/m 2 , or about $0.05/W DC , are possible through CA-based IBC module manufacturing.

14 SOLAR ENERGY↗

Adhesion at the interfaces between BCC metals and {alpha}-Al{sub 2}O{sub 3}

Ab initio calculations of the atomic and electronic structures of Me(111)/{alpha}-Al{sub 2}O{sub 3}(0001) interfaces (Me = V, Cr, Nb, Mo, Ta, W) in the framework of density functional theory are reported. The energies of separation of metal films from oxide surfaces have been calculated. The structural and electronic factors responsible for the strong adhesion of bcc metal films on the oxygen termination of the surface of aluminum oxide have been analyzed.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗

Influence of Cobalt on the Adhesion Strength of Polycrystalline Diamond Coatings on WC–Co Hard Alloys

The influence of cobalt on the phase composition and adhesion strength of polycrystalline diamond coatings has been studied using scanning electron microscopy, Raman spectroscopy, and X-ray microanalysis. The coatings have been deposited on WC–Co hard alloy substrates in glow discharge plasma. It has been found that the catalytic amorphization of carbon only takes place during the direct synthesis of the diamond coating, when the cobalt vapor pressure over the substrate is high and the cobalt-related degradation of the synthesized diamond is absent.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗

Adhesion at the Ta(Mo)/NiTi Interface

The atomic and electronic structures of Me(110)/NiTi(110) and TiO{sub 2}(100)/Me(110) interfaces (where Me = Ta, Mo) have been studied by the projector augmented-wave method in the framework of the density functional theory. It is established that the formation of intermediate oxide layers at the metal–oxide interface can lead to decreased adhesion at the interface.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗

Two Models of Adhesive Debonding of Sylgard

This report begins with a brief summary of the range of modeling methods used to simulate adhesive debonding. Then the mechanical simulation of the blister debonding test, and the thermomechanical simulation of the potted hemisphere problem are described. For both simulations, details of the chosen modeling techniques, and the reasons for choosing them (and rejecting alternate modeling approaches) will be discussed.

36 MATERIALS SCIENCE↗

Modeling adhesive debonding using the shim layer modeling approach

There are multiple possible methods for modeling adhesive debonding in finite element simulations. However, many of these techniques are incapable of meeting all of the requirements of a thermomechanical simulation involving assemblies with thin layers of elastomeric potting materials. In this paper, these requirements are first identified, then one particular method, termed the “shim layer” modeling approach, is described. This modeling approach is capable of meeting all of the modeling requirements.

36 MATERIALS SCIENCE↗

Atmospheric Cold Plasma Jet Coating and Surface Treatment for Improved Adhesive Bonding Performance of Dissimilar Material Joints Subject to Harsh Environmental Exposure

The program goal was the development and demonstration of a novel material coating system using an innovative atmospheric cold microwave plasma jet to enable surface functionalization for corrosion protection, wear resistance and improved bonding strength. The technical approach was directed towards proof-of-concept demonstration of advanced point-of-manufacturing material bonding to improve adhesive joint performance subject to harsh environmental exposure. The assembled team, consisting of the researchers at the University of Illinois, end-users at General Motors and small business manufacturer Starfire Industries, successfully demonstrated a single, cost-effective, high-volume production process that meets the requirements of multi-material combinations relevant to the energy-intensive transportation industry (e.g. Al-steel, Mg-steel, Al-Mg and Al-CFRP joints for body-in-white structures) while eliminating offline pretreatment for Al and Mg alloy substrates that are energy intensive, have chemical waste disposal issues, and add cost. Technical demonstration of dissimilar material joining while maintaining bonding strength and cohesion after long-duration environmental exposure was accomplished for all materials of interest. This novel approach has broad applicability for manufacturing in automotive, aerospace, marine, railcar, and specialty consumer goods, etc.

36 MATERIALS SCIENCE↗

Mechanistic Insights into Peptide Binding and Deactivation of an Adhesion G Protein-Coupled Receptor

Adhesion G protein-coupled receptors (ADGRGs) play critical roles in the reproductive, neurological, cardiovascular, and endocrine systems. In particular, ADGRG2 plays a significant role in Ewing sarcoma cell proliferation, parathyroid cell function, and male fertility. In 2022, a cryo-EM structure was reported for the active ADGRG2 bound by an optimized peptide agonist IP15 and the Gs protein. The IP15 peptide agonist was also modified to antagonists 4PH-E and 4PH-D with mutations of the 4PH residue to Glu and Asp, respectively. However, experimental structures of inactive antagonist-bound ADGRs remain to be resolved, and the activation mechanism of ADGRs such as ADGRG2 is poorly understood. Here, we applied Gaussian accelerated molecular dynamics (GaMD) simulations to probe conformational dynamics of the agonist- and antagonist-bound ADGRG2. By performing GaMD simulations, we were able to identify important low-energy conformations of ADGRG2 in the active, intermediate, and inactive states, as well as explore the binding conformations of each peptide. Moreover, our simulations revealed critical peptide-receptor residue interactions during the deactivation of ADGRG2. In conclusion, through GaMD simulations, we uncovered mechanistic insights into peptide (agonist and antagonist) binding and deactivation of the ADGRG2. These findings will potentially facilitate rational design of new peptide modulators of ADGRG2 and other ADGRs.

59 BASIC BIOLOGICAL SCIENCES↗

Lignin-Based Polyurethanes: Opportunities for Bio-Based Foams, Elastomers, Coatings and Adhesives

Polyurethane chemistry can yield diverse sets of polymeric materials exhibiting a wide range of properties for various applications and market segments. Utilizing lignin as a polyol presents an opportunity to incorporate a currently underutilized renewable aromatic polymer into these products. In this work, we will review the current state of technology for utilizing lignin as a polyol replacement in different polyurethane products. This will include a discussion of lignin structure, diversity, and modification during chemical pulping and cellulosic biofuels processes, approaches for lignin extraction, recovery, fractionation, and modification/functionalization. We will discuss the potential of incorporation of lignins into polyurethane products that include rigid and flexible foams, adhesives, coatings, and elastomers. Finally, we will discuss challenges in incorporating lignin in polyurethane formulations, potential solutions and approaches that have been taken to resolve those issues.

36 MATERIALS SCIENCE↗

Smart Adhesive Joint with High-Definition Fiber-Optic Sensing for Automotive Applications

Structural health monitoring of fiber-reinforced composite-based joints for automotive applications during their manufacturing and on-demand assessment for its durability in working environments is critically needed. High-definition fiber-optic sensing is an effective method to measure internal strain/stress development using minimally invasive continuous sensors. The sensing fiber diameters are in the same order of magnitude when compared to reinforcement (glass, basalt, or carbon fibers) used in polymer composites. They also offer a unique ability to monitor the evolution of residual stresses after repeated thermal exposure with varying temperatures for automotive components/joints during painting using an electrophoretic painting process. In this paper, a high-definition fiber-optic sensor utilizing Rayleigh scattering is embedded within an adhesive joint between a carbon fiber-reinforced thermoset composite panel and an aluminum panel to measure spatially resolved strain development, residual strain, and thermal expansion properties during the electrophoretic paint process-simulated conditions. The strain measured by the continuous fiber-optic sensor was compared with an alternate technique using thermal digital image correlation. The fiber-optic sensor was able to identify the spatial variation of residual strains for a discontinuous carbon fiber-reinforced composite with varying local fiber orientations and resin content.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

Investigation of Failure Modes, Mechanisms and Driving Forces for Electrically Conductive Adhesives as Interconnects in PV Modules

In this work we describe our current progress into investigating the reliability of ECA interconnects for PV modules. Preliminary thermal cycling experiments demonstrated that both cohesive and adhesive failure of the ECA joint are relevant failure modes that result in an increase of the joints electrical resistance. A thorough viscoelastic characterization of the candidate ECA was conducted to enable accurate numerical modeling of the joint’s response to thermal cycling. Combined with critical and subcritical fracture measurements, the numerical model elucidates that an additional fatigue mechanism exists which can result in fracture well below subcritical debonding threshold values. It is also demonstrated that fracture of the ECA is more sensitive to humidity than temperature and subcritical debonding mechanisms do exist which are again more sensitive to humidity.

41 EE - Solar Energy Technologies Office (EE-4S)↗