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At least 865 records · Page 48

Column Grid Array Rework for High Reliability

Due to requirements for reduced size and weight, use of grid array packages in space applications has become common place. To meet the requirement of high reliability and high number of I/Os, ceramic column grid array packages (CCGA) were selected for major electronic components used in next MARS Rover mission (specifically high density Field Programmable Gate Arrays). ABSTRACT The probability of removal and replacement of these devices on the actual flight printed wiring board assemblies is deemed to be very high because of last minute discoveries in final test which will dictate changes in the firmware. The questions and challenges presented to the manufacturing organizations engaged in the production of high reliability electronic assemblies are, Is the reliability of the PWBA adversely affected by rework (removal and replacement) of the CGA package? and How many times can we rework the same board without destroying a pad or degrading the lifetime of the assembly? To answer these questions, the most complex printed wiring board assembly used by the project was chosen to be used as the test vehicle, the PWB was modified to provide a daisy chain pattern, and a number of bare PWB s were acquired to this modified design. Non-functional 624 pin CGA packages with internal daisy chained matching the pattern on the PWB were procured. The combination of the modified PWB and the daisy chained packages enables continuity measurements of every soldered contact during subsequent testing and thermal cycling. Several test vehicles boards were assembled, reworked and then thermal cycled to assess the reliability of the solder joints and board material including pads and traces near the CGA. The details of rework process and results of thermal cycling are presented in this paper.

high reliability↗

Reliability of PWB Microvias for High Density Package Assembly

High density PWB (printed wiring board) with microvia technology is required for implementation of high density and high I/O area array packages (AAP). COTS (commercial off-the-shelf) AAP packaging technologies in high reliability versions with 1.27 mm pitch are now being considered for use in a number of NASA systems including Space Shuttle and Mars Rovers. NASA functional system designs are requiring more and more dense AAP packages and board space, which makes board microvia technology very attractive for effectively routing a large number of package inputs/outputs. However, the reliability of the fine feature microvias including via in pads is unknown for space applications. Understanding process and QA (quality assurance) indicators for reliability are important for low risk insertion of these newly available packages and PWBs. This paper presents literature search as well as test results for a high density board subjected to various thermal cycle and reflow profiles representative of tin-lead and lead-free solder reflow. Microvias sizes ranged from two to six mil with and without filling. Daisy chain microvias monitored during the test and PWBs were cross-sectioned to determine failure and locations. Optical and SEM photographs as well as resistance changes during cycling and Tg/Td (glass transition/decomposition temperature) characterisations are presented.

fill via↗

Performance of High Temperature Operational Amplifier, Type LM2904WH, under Extreme Temperatures

Operation of electronic parts and circuits under extreme temperatures is anticipated in NASA space exploration missions as well as terrestrial applications. Exposure of electronics to extreme temperatures and wide-range thermal swings greatly affects their performance via induced changes in the semiconductor material properties, packaging and interconnects, or due to incompatibility issues between interfaces that result from thermal expansion/contraction mismatch. Electronics that are designed to withstand operation and perform efficiently in extreme temperatures would mitigate risks for failure due to thermal stresses and, therefore, improve system reliability. In addition, they contribute to reducing system size and weight, simplifying its design, and reducing development cost through the elimination of otherwise required thermal control elements for proper ambient operation. A large DC voltage gain (100 dB) operational amplifier with a maximum junction temperature of 150 C was recently introduced by STMicroelectronics [1]. This LM2904WH chip comes in a plastic package and is designed specifically for automotive and industrial control systems. It operates from a single power supply over a wide range of voltages, and it consists of two independent, high gain, internally frequency compensated operational amplifiers. Table I shows some of the device manufacturer s specifications.

Patterson, Richard↗

Local Debonding and Fiber Breakage in Composite Materials Modeled Accurately

A prerequisite for full utilization of composite materials in aerospace components is accurate design and life prediction tools that enable the assessment of component performance and reliability. Such tools assist both structural analysts, who design and optimize structures composed of composite materials, and materials scientists who design and optimize the composite materials themselves. NASA Glenn Research Center's Micromechanics Analysis Code with Generalized Method of Cells (MAC/GMC) software package (http://www.grc.nasa.gov/WWW/LPB/mac) addresses this need for composite design and life prediction tools by providing a widely applicable and accurate approach to modeling composite materials. Furthermore, MAC/GMC serves as a platform for incorporating new local models and capabilities that are under development at NASA, thus enabling these new capabilities to progress rapidly to a stage in which they can be employed by the code's end users.

Bednarcyk, Brett A.↗

The Assurance Challenges of Advanced Packaging Technologies for Electronics

Advances in microelectronic parts performance are driving towards finer feature sizes, three-dimensional geometries and ever-increasing number of transistor equivalents that are resulting in increased die sizes and interconnection (I/O) counts. The resultant packaging necessary to provide assemble-ability, environmental protection, testability and interconnection to the circuit board for the active die creates major challenges, particularly for space applications, Traditionally, NASA has used hermetically packaged microcircuits whenever available but the new demands make hermetic packaging less and less practical at the same time as more and more expensive, Some part types of great interest to NASA designers are currently only available in non-hermetic packaging. It is a far more complex quality and reliability assurance challenge to gain confidence in the long-term survivability and effectiveness of nonhermetic packages than for hermetic ones. Although they may provide more rugged environmental protection than the familiar Plastic Encapsulated Microcircuits (PEMs), the non-hermetic Ceramic Column Grid Array (CCGA) packages that are the focus of this presentation present a unique combination of challenges to assessing their suitability for spaceflight use. The presentation will discuss the bases for these challenges, some examples of the techniques proposed to mitigate them and a proposed approach to a US MIL specification Class for non-hermetic microcircuits suitable for space application, Class Y, to be incorporated into M. IL-PRF-38535. It has recently emerged that some major packaging suppliers are offering hermetic area array packages that may offer alternatives to the nonhermetic CCGA styles but have also got their own inspectability and testability issues which will be briefly discussed in the presentation,

Sampson, Michael J.↗

Additively Manufactured Ink-based Cell Batteries for Flexible Conformational Applications

With the rise of additively manufactured electronics, the importance of thin, flexible printed batteries has increased for shape-conformal electronics. Traditionally, battery cells such as industry-standard lithium-ion batteries, have been rigid and therefore unable to conform to time-variant surfaces such as smart cards/RFID devices, disposable battery-powered skin patches, foldable electronic devices, and IoT nodes. Aligned with the effort to advance technologies on printed electronics for habitat systems and advanced manufacturing, this proof-of-concept will focus on printing a 50 mAh Zn-Ag battery implementing a DIW Technique. After prototype manufacturing, electrical and environmental testing on the flexible battery cell will be conducted to the evaluate energy and power density over 50 charge cycles under standard atmosphere conditions. The project aims to provide PCB designers, fabricators, and assemblers an integrated battery package to eliminate external batteries, external wiring and connectors, and conformational complexity. Potential end uses of the printed battery process will be within Martian and lunar habitat systems, Gateway, and surface vehicles, or aerial robots where space and geometry is a restriction.

Printed Electronics↗

Near Earth Asteroid Scout Solar Sail Engineering Development Unit Test Suite

The Near Earth Asteroid (NEA) Scout project is a 6U reconnaissance mission to investigate a near Earth asteroid utilizing an 86m(sub 2) solar sail as the primary propulsion system. This will be the largest solar sail NASA has launched to date. NEA Scout is currently manifested on the maiden voyage of the Space Launch System in 2018. In development of the solar sail subsystem, design challenges were identified and investigated for packaging within a 6U form factor and deployment in cis-lunar space. Analysis was able to capture understanding of thermal, stress, and dynamics of the stowed system as well as mature an integrated sail membrane model for deployed flight dynamics. Full scale system testing on the ground is the optimal way to demonstrate system robustness, repeatability, and overall performance on a compressed flight schedule. To physically test the system, the team developed a flight sized engineering development unit with design features as close to flight as possible. The test suite included ascent vent, random vibration, functional deployments, thermal vacuum, and full sail deployments. All of these tests contributed towards development of the final flight unit. This paper will address several of the design challenges and lessons learned from the NEA Scout solar sail subsystem engineering development unit. Testing on the component level all the way to the integrated subsystem level. From optical properties of the sail material to fold and spooling the single sail, the team has developed a robust deployment system for the solar sail. The team completed several deployments of the sail system in preparation for flight at half scale (4m) and full scale (6.8m): boom only, half scale sail deployment, and full scale sail deployment. This paper will also address expected and received test results from ascent vent, random vibration, and deployment tests.

Lockett, Tiffany Russell↗

JTEC Panel report on microelectromechanical systems in Japan

This report summarizes recent activities in the development of microelectromechanical systems (MEMS) in Japan. For the purposes of this study, 'MEMS' means batch-fabricated miniature devices that convert physical parameters to or from electrical signals and that depend on mechanical structures or parameters in important ways for their operation. The report covers advanced materials and process technology; sensors and sensing microstructures; microactuators and actuation mechanisms; sensor-circuit integration and system partitioning; advanced packaging, microassembly, and testing technologies; and MEMS design techniques, applications, and infrastructure. The panel found that Japanese industry is emphasizing approaches to MEMS that are similar to those taken by U.S. industry (i.e., approaches based on silicon integrated-circuit technology); these efforts are comparable in their level of development to those in the United States. However, the ten-year, $250 million, MITI-sponsored program in micromachines emphasizes the miniaturization of more traditional (nonlithographic) machining processes, an area in which there is no comparable U.S. effort. Packaging technology and applications for batch-fabricated MEMS devices is considered a major challenge in both countries. The panel concluded that these and other issues will require global leadership and international cooperation to realize the benefits of MEMS in a timely way.

Wise, Kensall D.↗

Concepts for manned lunar habitats

The design philosophy that will guide the design of early lunar habitats will be based on a compromise between the desired capabilities of the base and the economics of its development and implantation. Preferred design will be simple, make use of existing technologies, require the least amount of lunar surface preparation, and minimize crew activity. Three concepts for an initial habitat supporting a crew of four for 28 to 30 days are proposed. Two of these are based on using Space Station Freedom structural elements modified for use in a lunar-gravity environment. A third concept is proposed that is based on an earlier technology based on expandable modules. The expandable modules offer significant advantages in launch mass and packaged volume reductions. It appears feasible to design a transport spacecraft lander that, once landed, can serve as a habitat and a stand-off for supporting a regolith environmental shield. A permanent lunar base habitat supporting a crew of twelve for an indefinite period can be evolved by using multiple initial habitats. There appears to be no compelling need for an entirely different structure of larger volume and increased complexity of implantation.

Hypes, W. D.↗

Photovoltaic module bypass diode encapsulation

The design and processing techniques necessary to incorporate bypass diodes within the module encapsulant are presented. The Semicon PN junction diode cells were selected. Diode junction to heat spreader thermal resistance measurements, performed on a variety of mounted diode chip types and sizes, have yielded values which are consistently below 1 deg C per watt, but show some instability when thermally cycled over the temperature range from -40 to 150 deg C. Three representative experimental modules, each incorporating integral bypass diode/heat spreader assemblies of various sizes, were designed. Thermal testing of these modules enabled the formulation of a recommended heat spreader plate sizing relationship. The production cost of three encapsulated bypass diode/heat spreader assemblies were compared with similarly rated externally mounted packaged diodes. It is concluded that, when proper designed and installed, these bypass diode devices will improve the overall reliability of a terrestrial array over a 20 year design lifetime.

Shepard, N. J., Jr.↗

Design and development of the Cassini main engine assembly Gimbal mechanism

Cassini is an international cooperative effort between NASA, which is producing the orbiter spacecraft, the European Space Agency, which is providing the Huygens Probe, and the Italian Space Agency, which is responsible for the spacecraft radio antenna and portions of three scientific experiments. In the U.S., the mission is managed by NASA's Jet Propulsion Laboratory (JPL) in Pasadena, California. Lockheed-Martin successfully bid on the contract to build the PMS (Propulsion Module Subsystem) for this project. The Cassini spacecraft will be launched on an expedition to Saturn in October, 1997. Its mission is to enter orbit around Saturn in July, 2004, and to explore its moons, rings, and magnetic environment for four years. Cassini will carry the Huygens probe, an instrument package equipped with a parachute, which is designed to study the atmosphere and surface of Saturn's largest moon, Titan.

Rudolph, Dale↗

Retrofitting a fine-pointing system to satellite optics

This paper describes a system added to an existing satellite-borne telescope design for the purpose of compensating the boresight errors that had been observed in earlier flights of similar instruments. Those errors had been found to be caused by thermal distortion of the spaceframe. This retrofit design was subjected to severe volume restrictions because it was fitted into an already tightly-packaged instrument envelope. It was found practical to improve the basic design by converting a redundant structure into a statically-determinate one. It was also possible to use portions of the mechanical actuation system to facilitate the position encoding needed for computer interfacing.

Woods, Robert O.↗

Design, building and test of one prototype and four final position sensor assemblies: Hall effect position sensors

This report covers the development of a three channel Hall effect position sensing system for the commutation of a three phase dc torquer motor. The effort consisted of the evaluation, modification and re-packaging of a commercial position sensor and the design of a target configuration unique to this application. The resulting design meets the contract requirements and, furthermore, the test results indicate not only the practicality and versatility of the design, but also that there may be higher limits of resolution and accuracy achievable.

Source record↗

An Overview of NASA's Integrated Design and Engineering Analysis (IDEA) Environment

Historically, the design of subsonic and supersonic aircraft has been divided into separate technical disciplines (such as propulsion, aerodynamics and structures), each of which performs design and analysis in relative isolation from others. This is possible, in most cases, either because the amount of interdisciplinary coupling is minimal, or because the interactions can be treated as linear. The design of hypersonic airbreathing vehicles, like NASA's X-43, is quite the opposite. Such systems are dominated by strong non-linear interactions between disciplines. The design of these systems demands that a multi-disciplinary approach be taken. Furthermore, increased analytical fidelity at the conceptual design phase is highly desirable, as many of the non-linearities are not captured by lower fidelity tools. Only when these systems are designed from a true multi-disciplinary perspective, can the real performance benefits be achieved and complete vehicle systems be fielded. Toward this end, the Vehicle Analysis Branch at NASA Langley Research Center has been developing the Integrated Design and Engineering Analysis (IDEA) Environment. IDEA is a collaborative environment for parametrically modeling conceptual and preliminary designs for launch vehicle and high speed atmospheric flight configurations using the Adaptive Modeling Language (AML) as the underlying framework. The environment integrates geometry, packaging, propulsion, trajectory, aerodynamics, aerothermodynamics, engine and airframe subsystem design, thermal and structural analysis, and vehicle closure into a generative, parametric, unified computational model where data is shared seamlessly between the different disciplines. Plans are also in place to incorporate life cycle analysis tools into the environment which will estimate vehicle operability, reliability and cost. IDEA is currently being funded by NASA?s Hypersonics Project, a part of the Fundamental Aeronautics Program within the Aeronautics Research Mission Directorate. The environment is currently focused around a two-stage-to-orbit configuration with a turbine-based combined cycle (TBCC) first stage and a reusable rocket second stage. IDEA will be rolled out in generations, with each successive generation providing a significant increase in capability, either through increased analytic fidelity, expansion of vehicle classes considered, or by the inclusion of advanced modeling techniques. This paper provides the motivation behind the current effort, an overview of the development of the IDEA environment (including the contents and capabilities to be included in Generation 1 and Generation 2), and a description of the current status and detail of future plans.

Robinson, Jeffrey S.↗

CEO Sites Mission Management System (SMMS)

Late in fiscal year 2011, the Crew Earth Observations (CEO) team was tasked to upgrade its science site database management tool, which at the time was integrated with the Automated Mission Planning System (AMPS) originally developed for Earth Observations mission planning in the 1980s. Although AMPS had been adapted and was reliably used by CEO for International Space Station (ISS) payload operations support, the database structure was dated, and the compiler required for modifications would not be supported in the Windows 7 64-bit operating system scheduled for implementation the following year. The Sites Mission Management System (SMMS) is now the tool used by CEO to manage a heritage Structured Query Language (SQL) database of more than 2,000 records for Earth science sites. SMMS is a carefully designed and crafted in-house software package with complete and detailed help files available for the user and meticulous internal documentation for future modifications. It was delivered in February 2012 for test and evaluation. Following acceptance, it was implemented for CEO mission operations support in April 2012. The database spans the period from the earliest systematic requests for astronaut photography during the shuttle era to current ISS mission support of the CEO science payload. Besides logging basic image information (site names, locations, broad application categories, and mission requests), the upgraded database management tool now tracks dates of creation, modification, and activation; imagery acquired in response to requests; the status and location of ancillary site information; and affiliations with studies, their sponsors, and collaborators. SMMS was designed to facilitate overall mission planning in terms of site selection and activation and provide the necessary site parameters for the Satellite Tool Kit (STK) Integrated Message Production List Editor (SIMPLE), which is used by CEO operations to perform daily ISS mission planning. The CEO team uses the SMMS for three general functions - database queries of content and status, individual site creation and updates, and mission planning. The CEO administrator of the science site database is able to create or modify the content of sites and activate or deactivate them based on the requirements of the sponsors. The administrator supports and implements ISS mission planning by assembling, reporting, and activating mission-specific site selections for management; deactivating sites as requirements are met; and creating new sites, such as International Charter sites for disasters, as circumstances warrant. In addition to the above CEO internal uses, when site planning for a specific ISS mission is complete and approved, the SMMS can produce and export those essential site database elements for the mission into XML format for use by onboard Earth-location systems, such as Worldmap. The design, development, and implementation of the SMMS resulted in a superior database management system for CEO science sites by focusing on the functions and applications of the database alone instead of integrating the database with the multipurpose configuration of the AMPS. Unlike the AMPS, it can function and be modified within the existing Windows 7 environment. The functions and applications of the SMMS were expanded to accommodate more database elements, report products, and a streamlined interface for data entry and review. A particularly elegant enhancement in data entry was the integration of the Google Earth application for the visual display and definition of site coordinates for site areas defined by multiple coordinates. Transfer between the SMMS and Google Earth is accomplished with a Keyhole Markup Language (KML) expression of geographic data (see figures 3 and 4). Site coordinates may be entered into the SMMS panel directly for display in Google Earth, or the coordinates may be defined on the Google Earth display as a mouse-controlled polygonal definition and transferred back into the SMMS as KML input. This significantly reduces the possibility of errors in coordinate entries and provides visualization of the scale of the site being defined. CEO now has a powerful tool for managing and defining sites on the Earth's surface for both targets of astronaut photography or other onboard remote sensing systems. It can also record and track results by sponsor, collaborator, or type of study.

Trenchard, Mike↗

Managing Mobile/Satellite Propagation Data

"Data Management System for Mobile Satellite Propagation" software package collection of FORTRAN programs and UNIX shell scripts designed to handle huge amounts of data resulting from mobile/satellite radio-propagation experiments. Data from experiments converted into standard and more useful forms. Software package contains program to convert binary format of data into standard ASCII format suitable for use with wide variety of computing-machine architectures. Written in either FORTRAN 77 or UNIX shell scripts.

Kantak, Anil V.↗

Design and verification of mechanisms for a large foldable antenna

The characteristics of the Synthetic Aperture Radar (SAR) antenna aboard the ESA Remote Sensing Satellite (ERS-1) are presented. The antenna is folded into a dense package for launch and is deployed in orbit. The design requirements and constraints, their impact on the design, and the resulting features of the mechanisms are discussed.

Luhmann, Hans Jurgen↗

Expert System Architecture for Rocket Engine Numerical Simulators: A Vision

Simulation of any complex physical system like rocket engines involves modeling the behavior of their different components using mostly numerical equations. Typically a simulation package would contain a set of subroutines for these modeling purposes and some other ones for supporting jobs. A user would create an input file configuring a system (part or whole of a rocket engine to be simulated) in appropriate format understandable by the package and run it to create an executable module corresponding to the simulated system. This module would then be run on a given set of input parameters in another file. Simulation jobs are mostly done for performance measurements of a designed system, but could be utilized for failure analysis or a design job such as inverse problems. In order to use any such package the user needs to understand and learn a lot about the software architecture of the package, apart from being knowledgeable in the target domain. We are currently involved in a project in designing an intelligent executive module for the rocket engine simulation packages, which would free any user from this burden of acquiring knowledge on a particular software system. The extended abstract presented here will describe the vision, methodology and the problems encountered in the project. We are employing object-oriented technology in designing the executive module. The problem is connected to the areas like the reverse engineering of any simulation software, and the intelligent systems for simulation.

Mitra, D.↗