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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 865 records · Page 48

SuperLab 2.0 Showcase: Connecting Five Labs to Tackle Grid Complexity and Unlock Unique Grid Asset Potential

SuperLab 2.0 (5-Lab Demo) is a collaborative, national-scale experiment showcasing the coordination of geographically distributed energy assets in real time. The demonstration integrates 25 physical and digital assets, spanning wind, PV, batteries, electrolyzers, DC fast chargers, microgrid controllers, building automation systems, small modular reactor (SMR), control centers, and gas turbines, across five DOE national laboratories-NLR, INL, NETL, LBNL, and SNL. These assets are unified using Energy Sciences Network (ESnet), a low-latency, high-performance U.S. Department of Energy's (DOE) network, and controlled via a centralized energy controller hosted at NLR's ARIES facility. The demonstration validates the ability to stress-test hybrid energy systems under dynamic scenarios to de-risk advanced control strategies for greater resilience and flexibility. SuperLab 2.0 (5-Lab Demo) showcased a major advancement in federated national laboratory collaboration, enabling real-time, cross-laboratory experimentation to coordinate geographically dispersed distributed energy resources (DERs) using various communication protocols and networks. SuperLab 2.0 (5-Lab Demo) built on previous demonstrations conducted between NLR-PNNL and NLR-INL connecting diverse assets including distant protection devices, a SMR simulator, and a high temperature electrolyzer (HTE). Previous demos were based on a single connection between two labs with minimal coordination challenges. The 5-Lab demo with a centralized controller, distributed testbeds across different geographical locations, and use of protocols-based communication represents a scenario closer to real-world grid operations that coordinate resources across a region to meet system needs. This experiment studied how local DER controllers interact with a centralized energy controller during normal and abnormal events to maintain reliability. The SuperLab team across the five labs implemented a notional power system model equivalent of transmission and distribution lines, represented by the data networks interconnecting the labs. Each lab continuously exchanged local parameters (such as P and Q) from its Hardware-In-Loop (CHIL) and Power Hardware-In-Loop (PHIL) assets through centralized energy controller at NLR, enabling real-time interaction and coordination across sites. By leveraging ESnet as the communication backbone, the team successfully operated the distributed assets as a unified power system, with each bus represented by a different laboratory. This setup mirrors how assets interact in real-world power systems across dispersed locations with various protocols and latencies. At each lab site, assets were operated using their own local controllers which were coordinated through an overarching operation and control layer of centralized energy controller, equivalent to how an energy management system (EMS) orchestrates assets across a regional or national grid. SuperLab's federated connectivity utilized a Digital Real-Time Simulators (DRTS)-type gateway to connect Controller Hardware-In-Loop (CHIL) and PHIL assets between labs. To enable this federated connection through ESnet, a deterministic network was established where latency variations were consistent. This consistency allowed the development of digital filters for the power system assets across CHIL and PHIL interfaces to avoid unstable and unreliable grid conditions. This report provides an overview of the cross-laboratory configuration and offers insights into interconnecting geographically distributed research assets to test them as if they were co-located. This experiment represents a step toward linking nine DOE national laboratories, enabling nation-wide simulations that can address utility-driven challenges with grid resilience, flexibility, and modernization.

24 POWER TRANSMISSION AND DISTRIBUTION↗

Method of improving contact bonds in silicon integrated circuits

Fabrication method produces stable and reliable metallic systems for interconnections, contact pads, and bonded leads in silicon planar integrated circuits. The method is based on substrate isolation of the interconnection metal from the contact pad and bonded wire.

Lytle, W. J.↗

Breakaway electrical connector

One-shot, breakaway multiwire cable connector is fabricated by using a number of small-diameter interconnecting wires, each of which, differing incrementally in length, is welded to neighboring pin and cable terminations. This design eliminates frictional binding and provides highly reliable cable interconnections until the connector is disengaged.

Katzin, L.↗

Ceramic wiring board increases packaging density of electronic modules

Ceramic multilayer wiring board interconnects large scale integration /LSI/ modules which dissipate nearly 2W/cc. Extremely high packaging density is possible by application of alumina cover hermetically sealed to board. Signal interconnections are completely dependent on transfer heat between layers.

Hamley, L. D.↗

Development of chip passivated monolithic complementary MISFET circuits with beam leads

Fabrication method is described for alumina passivated silicon MISFET arrays. Technique involves total passivation beam-lead approach and provides completely sealed chip with double level interconnect capability. Refractory metal alloy is used to form interconnect system and obtain metal contacts that withstand temperatures of 873 K for short periods of time.

Ragonese, L. J.↗

Flat conductor cable design, manufacture, and installation

Pertinent information for hardware selection, design, manufacture, and quality control necessary for flat conductor cable interconnecting harness application is presented. Comparisons are made between round wire cable and flat conductor cable. The flat conductor cable interconnecting harness systems show major cost, weight, and space savings, plus increased system performance and reliability. The design application section includes electrical characteristics, harness design and development, and a full treatise on EMC considerations. Manufacturing and quality control sections pertain primarily to the developed conductor-contact connector system and special flat conductor cable to round wire cable transitions.

Angele, W.↗

Development of a lightweight body-mounted solar cell array with a high power to weight ratio.

Three lightweight solar cell arrays have been fabricated with a high power-to-weight ratio. These arrays incorporate resistance welded interconnections, improved antireflection coating on the solar cell and lightweight substrates. Two of the substrates were constructed of magnesium with different structural geometry, while the third substrate was conventional aluminum honeycomb. All arrays utilized thin solar cells having a titanium-palladium-silver contact system and an antireflection coating of titanium oxide. The cells were welded with silver plated molybdenum interconnections. The two arrays having magnesium substrates exhibited a power/weight of 70.4 W/kg (32 W/lb.) and 81 W/kg (36.8 W/lb.), while the conventional array demonstrated a power/weight of 45.2 W/kg (20.6 W/lb.).

Somberg, H.↗

Advanced On-Board Processor (AOP)

Advanced On-board Processor the (AOP) uses large scale integration throughout and is the most advanced space qualified computer of its class in existence today. It was designed to satisfy most spacecraft requirements which are anticipated over the next several years. The AOP design utilizes custom metallized multigate arrays (CMMA) which have been designed specifically for this computer. This approach provides the most efficient use of circuits, reduces volume, weight, assembly costs and provides for a significant increase in reliability by the significant reduction in conventional circuit interconnections. The required 69 CMMA packages are assembled on a single multilayer printed circuit board which together with associated connectors constitutes the complete AOP. This approach also reduces conventional interconnections thus further reducing weight, volume and assembly costs.

Source record↗

Decomposition-aggregation stability analysis

This report presents the development and description of the decomposition aggregation approach to stability investigations of high dimension mathematical models of dynamic systems. The high dimension vector differential equation describing a large dynamic system is decomposed into a number of lower dimension vector differential equations which represent interconnected subsystems. Then a method is described by which the stability properties of each subsystem are aggregated into a single vector Liapunov function, representing the aggregate system model, consisting of subsystem Liapunov functions as components. A linear vector differential inequality is then formed in terms of the vector Liapunov function. The matrix of the model, which reflects the stability properties of the subsystems and the nature of their interconnections, is analyzed to conclude over-all system stability characteristics. The technique is applied in detail to investigate the stability characteristics of a dynamic model of a hypothetical spinning Skylab.

Siljak, D. D.↗

Structure and function of an inorganic-organic separator for electrochemical cells: Preliminary study

The structure of a new separator material for electrochemical cells has been investigated. Investigation into details of the separator structure showed it to be multilayered and to consist mainly of a quasi-impervious organic skin, a porous region of mixed organic and inorganic material, and an area of nonuniformly treated substrate. The essential feature of the coating (slurry) is believed to be interconnected pores which allow ionic conductivity. The interconnected pores are believed to be formed by the interaction of the plasticizer and inorganic fibers. The major failure mode of silver zinc cells using such a separator (zinc nodules shorting adjacent plates) was investigated.

Bozek, J. M.↗

Digital communication system

A digital communication system is reported for parallel operation of 16 or more transceiver units with the use of only four interconnecting wires. A remote synchronization circuit produces unit address control words sequentially in data frames of 16 words. Means are provided in each transceiver unit to decode calling signals and to transmit calling and data signals. The transceivers communicate with each other over one data line. The synchronization unit communicates the address control information to the transceiver units over an address line and further provides the timing information over a clock line. A reference voltage level or ground line completes the interconnecting four wire hookup.

Monford, L. G., Jr.↗

Asymptotic stability and instability of large-scale systems

The purpose of this paper is to develop new methods for constructing vector Lyapunov functions and broaden the application of Lyapunov's theory to stability analysis of large-scale dynamic systems. The application, so far limited by the assumption that the large-scale systems are composed of exponentially stable subsystems, is extended via the general concept of comparison functions to systems which can be decomposed into asymptotically stable subsystems. Asymptotic stability of the composite system is tested by a simple algebraic criterion. By redefining interconnection functions among the subsystems according to interconnection matrices, the same mathematical machinery can be used to determine connective asymptotic stability of large-scale systems under arbitrary structural perturbations.

Grujic, L. T.↗

Exponential stability of large-scale discrete systems

The concept of vector Liapunov functions is used to obtain conditions for the exponential stability of large-scale discrete systems which can be decomposed into a number of interconnected subsystems with the same stability property. Both the structurally invariant composite systems and the large-scale systems under structural perturbations are considered. Connective absolute stability of a large-scale system composed of the interconnected Lur'e-type subsystems is defined and resolved in this context, resulting in a computationally and conceptually attractive alternative to a straightforward stability analysis of the system by frequency-domain criteria.

Grujic, L. T.↗

The influence of engine/transmission/governor on tilting proprotor aircraft dynamics

An analytical model is developed for the dynamics of a tilting proprotor aircraft engine and drive train, including a rotor speed governor and interconnect shaft. The dynamic stability of a proprotor and cantilever wing is calculated, including the engine-transmission-governor model. It is concluded that the rotor behaves much as if windmilling as far as its dynamic behavior is concerned, with some influence of the turboshaft engine inertia and damping. The interconnect shaft has a significant influence on the antisymmetric dynamics of proprotor aircraft. The proprotor aerodynamics model is extended to include reverse flow, and a refinement on the method used to calculate the kinematic pitch-bending coupling of the blade is developed.

Johnson, W.↗

SEM evaluation of metallization on semiconductors

A test method for the evaluation of metallization on semiconductors is presented and discussed. The method has been prepared in MIL-STD format for submittal as a proposed addition to MIL-STD-883. It is applicable to discrete devices and to integrated circuits and specifically addresses batch-process oriented defects. Quantitative accept/reject criteria are given for contact windows, other oxide steps, and general interconnecting metallization. Figures are provided that illustrate typical types of defects. Apparatus specifications, sampling plans, and specimen preparation and examination requirements are described. Procedures for glassivated devices and for multi-metal interconnection systems are included.

Fresh, D. L.↗

Guidelines for multiple LSI packaging

Handbook provides specific guidelines related to ceramic multilayer circuit fabrication in terms of packaging density and interconnection methods, guiding the designer from initial stages of ceramic multilayer interconnection and artwork generation through test pattern utilization, assembly operations, and final inspection and test procedures.

Peckinpaugh, C. J.↗

Simulator study of the effectiveness of an automatic control system designed to improve the high-angle-of-attack characteristics of a fighter airplane

A piloted, fixed-base simulation was conducted to study the effectiveness of some automatic control system features designed to improve the stability and control characteristics of fighter airplanes at high angles of attack. These features include an angle-of-attack limiter, a normal-acceleration limiter, an aileron-rudder interconnect, and a stability-axis yaw damper. The study was based on a current lightweight fighter prototype. The aerodynamic data used in the simulation were measured on a 0.15-scale model at low Reynolds number and low subsonic Mach number. The simulation was conducted on the Langley differential maneuvering simulator, and the evaluation involved representative combat maneuvering. Results of the investigation show the fully augmented airplane to be quite stable and maneuverable throughout the operational angle-of-attack range. The angle-of-attack/normal-acceleration limiting feature of the pitch control system is found to be a necessity to avoid angle-of-attack excursions at high angles of attack. The aileron-rudder interconnect system is shown to be very effective in making the airplane departure resistant while the stability-axis yaw damper provided improved high-angle-of-attack roll performance with a minimum of sideslip excursions.

Gilbert, W. P.↗

Printed wiring board system programmer's manual

The printed wiring board system provides automated techniques for the design of printed circuit boards and hybrid circuit boards. The system consists of four programs: (1) the preprocessor program combines user supplied data and pre-defined library data to produce the detailed circuit description data; (2) the placement program assigns circuit components to specific areas of the board in a manner that optimizes the total interconnection length of the circuit; (3) the organizer program assigns pin interconnections to specific board levels and determines the optimal order in which the router program should attempt to layout the paths connecting the pins; and (4) the router program determines the wire paths which are to be used to connect each input pin pair on the circuit board. This document is intended to serve as a programmer's reference manual for the printed wiring board system. A detailed description of the internal logic and flow of the printed wiring board programs is included.

Brinkerhoff, C. D.↗