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All sourcesNASA NTRSDOE OSTI
NASA NTRS2013

Packaging Technologies for High Temperature Electronics and Sensors

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500degC silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chiplevel packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550degC. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500degC for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500degC are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Electronic packaging↗
NASA NTRS2017

TESS Lens-Bezel Assembly Modal Testing

The Transiting Exoplanet Survey Satellite (TESS) program, led by the Kavli Institute for Astrophysics and Space Research at the Massachusetts Institute of Technology (MIT) will be the first-ever spaceborne all-sky transit survey. MIT Lincoln Laboratory is responsible for the cameras, including the lens assemblies, detector assemblies, lens hoods, and camera mounts. TESS is scheduled to be launched in August of 2017 with the primary goal to detect small planets with bright host starts in the solar neighborhood, so that detailed characterizations of the planets and their atmospheres can be performed. The TESS payload consists of four identical cameras and a data handling unit. Each camera consists of a lens assembly with seven optical elements and a detector assembly with four charge-coupled devices (CCDs) including their associated electronics. The optical prescription requires that several of the lenses are in close proximity to a neighboring element. A finite element model (FEM) was developed to estimate the relative deflections between each lens-bezel assembly under launch loads to predict that there are adequate clearances preventing the lenses from making contact. Modal tests using non-contact response measurements were conducted to experimentally estimate the modal parameters of the lens-bezel assembly, and used to validate the initial FEM assumptions. Key Words Non-contact measurements, modal analysis, model validation

Modal Testing↗
NASA NTRS1997

The Diagnostics of the External Plasma for the Plasma Rocket

The plasma rocket is located at NASA Johnson Space Center. To produce a thrust in space. an inert gas is ionized into a plasma and heated in the linear section of a tokamak fusion device to 1 x 10(exp 4) - 1.16 x 10(exp 6)K(p= 10(exp 10) - 10(exp 14)/cu cm ). The magnetic field used to contain the plasma has a magnitude of 2 - 10k Gauss. The plasma plume has a variable thrust and specific impulse. A high temperature retarding potential analyzer (RPA) is being developed to characterize the plasma in the plume and at the edge of the magnetically contained plasma. The RPA measures the energy and density of ions or electrons entering into its solid angle of collection. An oscilloscope displays the ion flux versus the collected current. All measurements are made relative to the facility ground. A RPA is being developed in a process which involves the investigation of several prototypes. The first prototype has been tested on a thermal plasma. The knowledge gained from its development and testing were applied to the development of a RPA for collimated plasma. The prototypes consist of four equally spaced grids and an ion collector. The outermost grid is a ground. The second grid acts as a bias to repel electrons. The third is a variable v voltage ion suppressor. Grid four (inner grid) acts to repel secondary electrons, being biased equal to the first. Knowledge gained during these two stages are being applied to the development of a high temperature RPA Testing of this device involves the determination of its output parameters. sensitivity, and responses to a wide range of energies and densities. Each grid will be tested individually by changing only its voltage and observing the output from the RPA. To verify that the RPA is providing proper output. it is compared to the output from a Langmuir or Faraday probe.

Karr, Gerald R.↗
NASA NTRS2017

Implementation and Integration of a Finite Element Model into the Bone Remodeling Model to Characterize Skeletal Loading

NASA's Digital Astronaut Project is developing a bone physiology model to predict changes in bone mineral density over the course of a space mission. The model intends to predict bone loss due to exposure in microgravity as well as predicting bone maintenance due to mechanical stimulus generated by exercise countermeasures. These predictions will be used to inform exercise device efficacy and to help design exercise protocols that will maintain bone mineral density during long exposures to microgravity during spaceflight. The mechanical stimulus and the stresses that are exhibited on the bone are important factors for bone remodeling. These stresses are dependent on the types of exercise that are performed and vary throughout the bone due to the geometry. A primary area of focus for bone health is the proximal femur. This location is critical in transmitting loads between the upper and lower body and have been known to be a critical failure point in older individuals with conditions like osteoporosis.

bone mineral content↗
NASA NTRS1992

Multiple dataset water-quality analyses in the vicinity of an ocean wastewater plume

The White's Point ocean outfall is the method of disposal for approximately 374 million gallons of treated wastewater per day from Los Angeles County. The photosynthetic characteristics and particle distributions have well-defined properties that can be exploited to yield information on transport of the plume, mixing dynamics, and resuspension of bottom sediments during periods of bottom current velocity in excess of ca. 0.1 m/s. This plume of particles serves as a conservative tracer, which was studied using a number of sampling platforms and strategies, including underway sawtooth, or 'tow-yo' sampling, moored arrays of instruments, stationary profiling, and now for the first time with remotely-sensed multispectral color imagery. Research in this area previously focused on examination of the plume as it relates to the local current field and transport of particles, and on the resuspension of bottom sediments during periods of increased currents. In addition, Wu et al elucidated techniques for separating the particle signal into photosynthetic and nonphotosynthetic components, based on the beam attenuation to chlorophyll fluorescence ratio. High-frequency time series measurements of the current field and bio-optical characteristics at a site close to the waste diffusers were also collected. These are being analyzed for the spectral characteristics of the longer-timescale variability, in order to predict particle transport through simple meteorological measurements. With the advent of high spectral and spatial resolution imaging spectrometers such as AVIRIS, it is now possible to construct causal relationships between particle distributions and signature of the upwelled radiance from the surface. The availability of a constant and well-characterized source of material lends itself well to models which predict upwelled radiance from the surface. The availability of a constant and well-characterized source of material lends itself well to models which predict upwelled light as a function of particle distributions, photosynthetic pigments, colored dissolved organic material, and detrital and degradation products of photosynthesis. In addition, the spatial coverage provided by the tow-yo sampling device, combined with the profile measurements of the light field, should facilitate the best inverse modeling attempts possible thus far.

Hamilton, Michael↗
NASA NTRS1993

Gas-grain simulation experiment module conceptual design and gas-grain simulation facility breadboard development

This report delineates the Option portion of the Phase A Gas-Grain Simulation Facility study. The conceptual design of a Gas-Grain Simulation Experiment Module (GGSEM) for Space Shuttle Middeck is discussed. In addition, a laboratory breadboard was developed during this study to develop a key function for the GGSEM and the GGSF, specifically, a solid particle cloud generating device. The breadboard design and test results are discussed and recommendations for further studies are included. The GGSEM is intended to fly on board a low earth orbit (LEO), manned platform. It will be used to perform a subset of the experiments planned for the GGSF for Space Station Freedom, as it can partially accommodate a number of the science experiments. The outcome of the experiments performed will provide an increased understanding of the operational requirements for the GGSF. The GGSEM will also act as a platform to accomplish technology development and proof-of-principle experiments for GGSF hardware, and to verify concepts and designs of hardware for GGSF. The GGSEM will allow assembled subsystems to be tested to verify facility level operation. The technology development that can be accommodated by the GGSEM includes: GGSF sample generation techniques, GGSF on-line diagnostics techniques, sample collection techniques, performance of various types of sensors for environmental monitoring, and some off-line diagnostics. Advantages and disadvantages of several LEO platforms available for GGSEM applications are identified and discussed. Several of the anticipated GGSF experiments require the deagglomeration and dispensing of dry solid particles into an experiment chamber. During the GGSF Phase A study, various techniques and devices available for the solid particle aerosol generator were reviewed. As a result of this review, solid particle deagglomeration and dispensing were identified as key undeveloped technologies in the GGSF design. A laboratory breadboard version of a solid particle generation system was developed and characterization tests performed. The breadboard hardware emulates the functions of the GGSF solid particle cloud generator in a ground laboratory environment, but with some modifications, can be used on other platforms.

Zamel, James M.↗
NASA NTRS1995

Thruster momentum transfer studies and magnetoplasmadynamic (MPD) thruster use in materials/surface modification

This research project involves the systematic study of the MPD thruster for dual uses. Though it was designed as a thruster for space vehicles, the characteristics of the plasma make it an excellent candidate for industrial applications. This project will seek to characterize the system for use in materials processing and characterization. Crystals grown at Fisk University for use with solid state detectors will be studied. Surface modification on ZnCdTe, CdTe, and ZnTe will be studied using AFM, XPS and SAES. In addition to the surface modification studies, design work on a momentum transfer measurement device has been completed. The design and limitations of the device will be presented.

Thompson, E.↗
NASA NTRS1996

Superconductivity Devices: Commercial Use of Space

The work described in this report covers various aspects of the Rainbow solid-state actuator and sensor technologies. It is presented in five parts dealing with sensor applications, nonlinear properties, stress-optic and electrooptic properties, stacks and arrays, and publications. The Rainbow actuator technology is a relatively new materials development which had its inception in 1992. It involves a new processing technique for preparing pre-stressed, high lead containing piezoelectric and electrostrictive ceramic materials. Ceramics fabricated by this method produce bending-mode actuator devices which possess several times more displacement and load bearing capacity than present-day benders. Since they can also be used in sensor applications, Rainbows are part of the family of materials known as smart ceramics. During this period, PLZT Rainbow ceramics were characterized with respect to their piezoelectric properties for potential use in stress sensor applications. Studies of the nonlinear and stress-optic/electrooptic birefringent properties were also initiated during this period. Various means for increasing the utility of stress-enhanced Rainbow actuators are presently under investigation.

Haertling, Gene↗
NASA NTRS2002

Particle Segregation in a Flowing Suspension Subject to High-Gradient Strong Electric Fields

The widespread use of electro-hydrodynamic devices and processes emphasizes a critical need for developing a comprehensive predictive theory capable of improving our fundamental understanding of the behavior of a suspension subject to an AC electric field and shear, and of facilitating the design and optimization of such devices. The currently favored approach to the qualitative interpretation of the AC field driven manipulation of suspensions is based on a model which considers only the force exerted on a single particle by an external field and neglects the field-induced and hydrodynamic interparticle interactions both being inversely proportional to the interparticle distance raised to the power three. On the other hand, the purpose of the field-induced separation is to concentrate particles in certain regions of a device. This clearly raises the fundamental question regarding the extent to which we can neglect these slow decaying electrical and hydrodynamic collective interactions and rely on the predictions of a single-particle model. Another important issue that still remains open is how to characterize the polarization of a particle exposed to a strong electric field. The presentation will address both these questions. Experiments were conducted in a parallel-plate channel in which a 10(exp -3) (v/v) suspension of heavy, positively polarized Al2O3 spheres was exposed to an AC field under conditions such that the field lines were arranged in the channel cross-section perpendicular to the streamlines of the main flow. To reduce the effects of the gravitational settling of the particles, the channel was slowly rotated (4 rpm) around a horizontal axis. Following the application of a high-gradient strong AC field (approx. kV/mm), the particles were found to move towards both the high-voltage (HV) and grounded (GR) electrodes and to form 'bristles' along their edges.

Acrivos, Andreas↗
NASA NTRS2013

Packaging Technologies for High Temperature Electronics and Sensors

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500 C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550 C. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500 C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500 C are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Chen, Liang-Yu↗
NASA NTRS2005

Electrical Characterization of Defects in SiC Schottky Barriers

We have been investigating the effect of screw dislocation and other structural defects on the electrical properties of SiC. SiC is a wide-bandgap semiconductor that is currently received much attention due to its favorable high temperature behavior and high electric field breakdown strength. Unfortunately, the current state-of-the-art crystal growth and device processing methods produce material with high defect densities, resulting in a limited commercial viability

Schnabel, C. M.↗
NASA NTRS2009

Characterization of 6H-SiC JFET Integrated Circuits Over A Broad Temperature Range from -150 C to +500 C

The NASA Glenn Research Center has previously reported prolonged stable operation of simple prototype 6H-SiC JFET integrated circuits (logic gates and amplifier stages) for thousands of hours at +500 C. This paper experimentally investigates the ability of these 6H-SiC JFET devices and integrated circuits to also function at cold temperatures expected to arise in some envisioned applications. Prototype logic gate ICs experimentally demonstrated good functionality down to -125 C without changing circuit input voltages. Cascaded operation of gates at cold temperatures was verified by externally wiring gates together to form a 3-stage ring oscillator. While logic gate output voltages exhibited little change across the broad temperature range from -125 C to +500 C, the change in operating frequency and power consumption of these non-optimized logic gates as a function of temperature was much larger and tracked JFET channel conduction properties.

Neudeck, Philip G.↗
NASA NTRS1994

Characterization of spacecraft and environmental disturbances on a SmallSat

The objective of this study is to model the on-orbit vibration environment encountered by a SmallSat. Vibration control issues are common to the Earth observing, imaging, and microgravity communities. A spacecraft may contain dozens of support systems and instruments each a potential source of vibration. The quality of payload data depends on constraining vibration so that parasitic disturbances do not affect the payload's pointing or microgravity requirement. In practice, payloads are designed incorporating existing flight hardware in many cases with nonspecific vibration performance. Thus, for the development of a payload, designers require a thorough knowledge of existing mechanical devices and their associated disturbance levels. This study evaluates a SmallSat mission and seeks to answer basic questions concerning on-orbit vibration. Payloads were considered from the Earth observing, microgravity, and imaging communities. Candidate payload requirements were matched to spacecraft bus resources of present day SmallSats. From the set of candidate payloads, the representative payload GLAS (Geoscience Laser Altimeter System) was selected. The requirements of GLAS were considered very stringent for the 150 - 500 kg class of payloads. Once the payload was selected, a generic SmallSat was designed in order to accommodate the payload requirements (weight, size, power, etc.). This study seeks to characterize the on-orbit vibration environment of a SmallSat designed for this type of mission and to determine whether a SmallSat can provide the precision pointing and jitter control required for earth observing payloads.

Johnson, Thomas A.↗
NASA NTRS2000

Correlation Between Material Properties of Ferroelectric Thin Films and Design Parameters for Microwave Device Applications: Modeling Examples and Experimental Verification

The application of thin ferroelectric films for frequency and phase agile components is the topic of interest of many research groups worldwide. Consequently, proof-of-concepts (POC) of different tunable microwave components using either (HTS, metal)/ferroelectric thin film/dielectric heterostructures or (thick, thin) film "flip-chip" technology have been reported. Either as ferroelectric thin film characterization tools or from the point of view of circuit implementation approach, both configurations have their respective advantages and limitations. However, we believe that because of the progress made so far using the heterostructure (i.e., multilayer) approach, and due to its intrinsic features such as planar configuration and monolithic integration, a study on the correlation of circuit geometry aspects and ferroelectric material properties could accelerate the insertion of this technology into working systems. In this paper, we will discuss our study performed on circuits based on microstrip lines at frequencies above 10 GHz, where the multilayer configuration offers greater ease of insertion due to circuit's size reduction. Modeled results of relevant circuit parameters such as the characteristic impedance, effective dielectric constant, and attenuation as a function of ferroelectric film's dielectric constant, tans, and thickness, will be presented for SrTiO3 and Ba(x)Sr(1-x)TiO3 ferroelectric films. A comparison between the modeled and experimental data for some of these parameters will be presented.

Miranda, Felix A.↗
NASA NTRS1981

Fabrication and high temperature characteristics of ion-implanted GaAs bipolar transistors and ring-oscillators

Ion implantation techniques that permit the reproducible fabrication of bipolar GaAs integrated circuits are studied. A 15 stage ring oscillator and discrete transistor were characterized between 25 and 400 C. The current gain of the transistor was found to increase slightly with temperature. The diode leakage currents increase with an activation energy of approximately 1 eV and dominate the transistor leakage current 1 sub CEO above 200 C. Present devices fail catastrophically at about 400 C because of Au-metallization.

Doerbeck, F. H.↗
NASA NTRS1991

Classification of posture maintenance data with fuzzy clustering algorithms

Sensory inputs from the visual, vestibular, and proprioreceptive systems are integrated by the central nervous system to maintain postural equilibrium. Sustained exposure to microgravity causes neurosensory adaptation during spaceflight, which results in decreased postural stability until readaptation occurs upon return to the terrestrial environment. Data which simulate sensory inputs under various conditions were collected in conjunction with JSC postural control studies using a Tilt-Translation Device (TTD). The University of West Florida proposed applying the Fuzzy C-Means Clustering (FCM) Algorithms to this data with a view towards identifying various states and stages. Data supplied by NASA/JSC were submitted to the FCM algorithms in an attempt to identify and characterize cluster substructure in a mixed ensemble of pre- and post-adaptational TTD data. Following several unsuccessful trials with FCM using a full 11 dimensional data set, a set of two channels (features) were found to enable FCM to separate pre- from post-adaptational TTD data. The main conclusions are that: (1) FCM seems able to separate pre- from post-TTD subject no. 2 on the one trial that was used, but only in certain subintervals of time; and (2) Channels 2 (right rear transducer force) and 8 (hip sway bar) contain better discrimination information than other supersets and combinations of the data that were tried so far.

Bezdek, James C.↗
NASA NTRS1997

Process-Induced Morphological Defects in Epitaxial CVD Silicon Carbide

Silicon carbide (SiC) semiconductor technology has been advancing rapidly, but there are numerous crystal growth problems that need to be solved before SiC can reach its full potential. Among these problems is a need for an improvement in the surface morphology of epitaxial films that are grown to produce device structures. Various processes before and during epilayer growth lead to the formation of morphological defects observed in SiC epilayers grown on SiC substrates. In studies of both 6H and 4H-SiC epilayers, atomic force microscopy (AFM) and other techniques have been used to characterize SiC epilayer surface morphology. In addition to the well-known micropipe defect, SiC epilayers contain growth pits, triangular features (primarily) in 4H-SiC, and macro step due to step bunching. In work at NASA Lewis, it has been found that factors contributing to the formation of some morphological defects include: defects in the substrate bulk, defects in the substrate surface caused by cutting and polishing the wafer, the tilt angle of the wafer surface relative to the basal plane, and growth conditions. Some of these findings confirm results of other research groups. This paper presents a review of published and unpublished investigations into processes that are relevant to epitaxial film morphology.

Powell, J. A.↗
NASA NTRS2014

A Reliability Model for Ni-BaTiO3-Based (BME) Ceramic Capacitors

The evaluation of multilayer ceramic capacitors (MLCCs) with base-metal electrodes (BMEs) for potential NASA space project applications requires an in-depth understanding of their reliability. The reliability of an MLCC is defined as the ability of the dielectric material to retain its insulating properties under stated environmental and operational conditions for a specified period of time t. In this presentation, a general mathematic expression of a reliability model for a BME MLCC is developed and discussed. The reliability model consists of three parts: (1) a statistical distribution that describes the individual variation of properties in a test group of samples (Weibull, log normal, normal, etc.), (2) an acceleration function that describes how a capacitors reliability responds to external stresses such as applied voltage and temperature (All units in the test group should follow the same acceleration function if they share the same failure mode, independent of individual units), and (3) the effect and contribution of the structural and constructional characteristics of a multilayer capacitor device, such as the number of dielectric layers N, dielectric thickness d, average grain size r, and capacitor chip size S. In general, a two-parameter Weibull statistical distribution model is used in the description of a BME capacitors reliability as a function of time. The acceleration function that relates a capacitors reliability to external stresses is dependent on the failure mode. Two failure modes have been identified in BME MLCCs: catastrophic and slow degradation. A catastrophic failure is characterized by a time-accelerating increase in leakage current that is mainly due to existing processing defects (voids, cracks, delamination, etc.), or the extrinsic defects. A slow degradation failure is characterized by a near-linear increase in leakage current against the stress time; this is caused by the electromigration of oxygen vacancies (intrinsic defects). The two identified failure modes follow different acceleration functions. Catastrophic failures follow the traditional power-law relationship to the applied voltage. Slow degradation failures fit well to an exponential law relationship to the applied electrical field. Finally, the impact of capacitor structure on the reliability of BME capacitors is discussed with respect to the number of dielectric layers in an MLCC unit, the number of BaTiO3 grains per dielectric layer, and the chip size of the capacitor device.

reliability↗