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At least 847 records · Page 47

The Development of a GaAs MMIC Reliability and Space Qualification Guide

NASA, JPL, and DOD are collaborating with GaAs MMIC users, manufacturers, and international space agencies to develop the “GaAs MMIC Reliability and Space Qualification Guide.” This paper discusses the need for a space qualification guide, provides a brief description of some common GaAs failure mechanisms, the approach that the NASA MMIC Reliability Assurance Program is following to develop the guide, and the status of the program.

exploration↗

Investigation of low glass transition temperature on COTS PEMs reliability

Many factors influence PEM component reliability.One of the factors that can affect PEM performance and reliability is the glass transition temperature (Tg) and the coefficient of thermal expansion (CTE) of the encapsulant or underfill. JPL/NASA is investigating how the Tg and CTE for PEMs affect device reliability under different temperature and aging conditions. Other issues with Tg are also being investigated. Some preliminary data will be presented on glass transition temperature test results conducted at JPL.

Glass transition temperature PEMs↗

An Approach to Reliability Testing of Microcircuits at Cryogenic Conditions

This viewgraph presentation reviews an approach to testing microcircuits at cryogenic temperatures. Standard testing procedures are not adequate to test microcircuits that are to operate at cryogenic temperatures. It is therefore necessary to perform analysis of operation conditions and reliability conditions for planning qualification testing of microcircuits at cryogenic temperatures. The major degradations for microcircuits operating at low temperatures depend on the number of switching cycles rather than on the duration of part operation. Therefore instead of accelerating degradation of the parts by increasing the level of stress, the possibility of which is very limited at cryogenic temperatures, the reliability testing can be based on the number of switching cycles.

Teverovsky, Alexander↗

Probabilistic Methods for Structural Reliability and Risk

A formal method is described to quantify structural reliability and risk in the presence of a multitude of uncertainties. The method is based on the materials behavior level where primitive variables with their respective scatters are used to describe that behavior. Computational simulation is then used to propagate those uncertainties to the structural scale where reliability and risk are usually specified. A sample case is described to illustrate the effectiveness, versatility, and maturity of the method. Typical results from this method demonstrate that the method is mature and that it can be used for future strategic projections and planning to assure better, cheaper, faster products for competitive advantages in world markets. The results also indicate that the methods are suitable for predicting remaining life in aging or deteriorating structures.

Chamis, Christos C.↗

Integrated circuit reliability testing

A technique is described for use in determining the reliability of microscopic conductors deposited on an uneven surface of an integrated circuit device. A wafer containing integrated circuit chips is formed with a test area having regions of different heights. At the time the conductors are formed on the chip areas of the wafer, an elongated serpentine assay conductor is deposited on the test area so the assay conductor extends over multiple steps between regions of different heights. Also, a first test conductor is deposited in the test area upon a uniform region of first height, and a second test conductor is deposited in the test area upon a uniform region of second height. The occurrence of high resistances at the steps between regions of different height is indicated by deriving the measured length of the serpentine conductor using the resistance measured between the ends of the serpentine conductor, and comparing that to the design length of the serpentine conductor. The percentage by which the measured length exceeds the design length, at which the integrated circuit will be discarded, depends on the required reliability of the integrated circuit.

Buehler, Martin G.↗

Reliability Effects of Surge Current Testing of Solid Tantalum Capacitors

Solid tantalum capacitors are widely used in space applications to filter low-frequency ripple currents in power supply circuits and stabilize DC voltages in the system. Tantalum capacitors manufactured per military specifications (MIL-PRF-55365) are established reliability components and have less than 0.001% of failures per 1000 hours (the failure rate is less than 10 FIT) for grades D or S, thus positioning these parts among electronic components with the highest reliability characteristics. Still, failures of tantalum capacitors do happen and when it occurs it might have catastrophic consequences for the system. This is due to a short-circuit failure mode, which might be damaging to a power supply, and also to the capability of tantalum capacitors with manganese cathodes to self-ignite when a failure occurs in low-impedance applications. During such a failure, a substantial amount of energy is released by exothermic reaction of the tantalum pellet with oxygen generated by the overheated manganese oxide cathode, resulting not only in destruction of the part, but also in damage of the board and surrounding components. A specific feature of tantalum capacitors, compared to ceramic parts, is a relatively large value of capacitance, which in contemporary low-size chip capacitors reaches dozens and hundreds of microfarads. This might result in so-called surge current or turn-on failures in the parts when the board is first powered up. Such a failure, which is considered as the most prevalent type of failures in tantalum capacitors [I], is due to fast changes of the voltage in the circuit, dV/dt, producing high surge current spikes, I(sub sp) = Cx(dV/dt), when current in the circuit is unrestricted. These spikes can reach hundreds of amperes and cause catastrophic failures in the system. The mechanism of surge current failures has not been understood completely yet, and different hypotheses were discussed in relevant literature. These include a sustained scintillation breakdown model [1-3]; electrical oscillations in circuits with a relatively high inductance [4-6]; local overheating of the cathode [5,7, 8]; mechanical damage to tantalum pentoxide dielectric caused by the impact of MnO2 crystals [2,9, 10]; or stress-induced-generation of electron traps caused by electromagnetic forces developed during current spikes [11]. A commonly accepted explanation of the surge current failures is that at unlimited current supply during surge current conditions, the self-healing mechanism in tantalum capacitors does not work, and what would be a minor scintillation spike if the current were limited, becomes a catastrophic failure of the part [l, 12]. However, our data show that the scintillation breakdown voltages are significantly greater that the surge current breakdown voltages, so it is still not clear why the part, which has no scintillations, would fail at the same voltage during surge current testing (SCT).

Teverovsky, Alexander↗

Sensor Selection and Data Validation for Reliable Integrated System Health Management

For new access to space systems with challenging mission requirements, effective implementation of integrated system health management (ISHM) must be available early in the program to support the design of systems that are safe, reliable, highly autonomous. Early ISHM availability is also needed to promote design for affordable operations; increased knowledge of functional health provided by ISHM supports construction of more efficient operations infrastructure. Lack of early ISHM inclusion in the system design process could result in retrofitting health management systems to augment and expand operational and safety requirements; thereby increasing program cost and risk due to increased instrumentation and computational complexity. Having the right sensors generating the required data to perform condition assessment, such as fault detection and isolation, with a high degree of confidence is critical to reliable operation of ISHM. Also, the data being generated by the sensors needs to be qualified to ensure that the assessments made by the ISHM is not based on faulty data. NASA Glenn Research Center has been developing technologies for sensor selection and data validation as part of the FDDR (Fault Detection, Diagnosis, and Response) element of the Upper Stage project of the Ares 1 launch vehicle development. This presentation will provide an overview of the GRC approach to sensor selection and data quality validation and will present recent results from applications that are representative of the complexity of propulsion systems for access to space vehicles. A brief overview of the sensor selection and data quality validation approaches is provided below. The NASA GRC developed Systematic Sensor Selection Strategy (S4) is a model-based procedure for systematically and quantitatively selecting an optimal sensor suite to provide overall health assessment of a host system. S4 can be logically partitioned into three major subdivisions: the knowledge base, the down-select iteration, and the final selection analysis. The knowledge base required for productive use of S4 consists of system design information and heritage experience together with a focus on components with health implications. The sensor suite down-selection is an iterative process for identifying a group of sensors that provide good fault detection and isolation for targeted fault scenarios. In the final selection analysis, a statistical evaluation algorithm provides the final robustness test for each down-selected sensor suite. NASA GRC has developed an approach to sensor data qualification that applies empirical relationships, threshold detection techniques, and Bayesian belief theory to a network of sensors related by physics (i.e., analytical redundancy) in order to identify the failure of a given sensor within the network. This data quality validation approach extends the state-of-the-art, from red-lines and reasonableness checks that flag a sensor after it fails, to include analytical redundancy-based methods that can identify a sensor in the process of failing. The focus of this effort is on understanding the proper application of analytical redundancy-based data qualification methods for onboard use in monitoring Upper Stage sensors.

Garg, Sanjay↗

Reliability Block Diagram (RBD) Analysis of NASA Dryden Flight Research Center (DFRC) Flight Termination System and Power Supply

In order to perform public risk analyses for vehicles containing Flight Termination Systems (FTS), it is necessary for the analyst to know the reliability of each of the components of the FTS. These systems are typically divided into two segments; a transmitter system and associated equipment, typically in a ground station or on a support aircraft, and a receiver system and associated equipment on the target vehicle. This analysis attempts to analyze the reliability of the NASA DFRC flight termination system ground transmitter segment for use in the larger risk analysis and to compare the results against two established Department of Defense availability standards for such equipment.

Morehouse, Dennis V.↗

Product Reliability Trends, Derating Considerations and Failure Mechanisms with Scaled CMOS

As microelectronics is scaled into the deep sub-micron regime, space and aerospace users of advanced technology CMOS are reassessing how scaling effects impact long-term product reliability. The effects of electromigration (EM), time-dependent-dielectric-breakdown (TDDB) and hot carrier degradation (HCI and NBTI) wearout mechanisms on scaled technologies and product reliability are investigated, accelerated stress testing across several technology nodes is performed, and FA is conducted to confirm the failure mechanism(s).

CMOS integrated circuits↗

Reliability Assessment of Advanced Flip-clip Interconnect Electronic Package Assemblies under Extreme Cold Temperatures (-190 and -120 C)

Flip-chip interconnect electronic package boards have been assembled, underfilled, non-destructively evaluated and subsequently subjected to extreme temperature thermal cycling to assess the reliability of this advanced packaging interconnect technology for future deep space, long-term, extreme temperature missions. In this very preliminary study, the employed temperature range covers military specifications (-55 C to 100 C), extreme cold Martian (-120 C to 115 C) and asteroid Nereus (-180 C to 25 C) environments. The resistance of daisy-chained, flip-chip interconnects were measured at room temperature and at various intervals as a function of extreme temperature thermal cycling. Electrical resistance measurements are reported and the tests to date have not shown significant change in resistance as a function of extreme temperature thermal cycling. However, the change in interconnect resistance becomes more noticeable with increasing number of thermal cycles. Further research work has been carried out to understand the reliability of flip-chip interconnect packages under extreme temperature applications (-190 C to 85 C) via continuously monitoring the daisy chain resistance. Adaptation of suitable diagnostic techniques to identify the failure mechanisms is in progress. This presentation will describe the experimental test results of flip-chip testing under extreme temperatures.

thermal cycling↗

Thermal Cycle Reliability and Failure Mechanisms of CCGA and PBGA Assemblies with and without Corner Staking

Area array packages (AAPs) with 1.27 mm pitch have been the packages of choice for commercial applications; they are now starting to be implemented for use in military and aerospace applications. Thermal cycling characteristics of plastic ball grid array (PBGA) and chip scale package assemblies, because of their wide usage for commercial applications, have been extensively reported on in literature. Thermal cycling represents the on-off environmental condition for most electronic products and therefore is a key factor that defines reliability.However, very limited data is available for thermal cycling behavior of ceramic packages commonly used for the aerospace applications. For high reliability applications, numerous AAPs are available with an identical design pattern both in ceramic and plastic packages. This paper compares assembly reliability of ceramic and plastic packages with the identical inputs/outputs(I/Os) and pattern. The ceramic package was in the form of ceramic column grid array (CCGA) with 560 I/Os peripheral array with the identical pad design as its plastic counterpart.

plastic ball grid array (PBGA)↗

Model-Driven Development of Reliable Avionics Architectures for Lunar Surface Systems

This paper discusses a method used for the systematic improvement of NASA s Lunar Surface Systems avionics architectures in the area of reliability and fault-tolerance. This approach utilizes an integrated system model to determine the effects of component failure on the system s ability to provide critical functions. A Markov model of the potential degraded system modes is created to characterize the probability of these degraded modes, and the system model is run for each Markov state to determine its status (operational or system loss). The probabilistic results from the Markov model are first produced from state transition rates based on NASA data for heritage failure rate data of similar components. An additional set of probabilistic results are created from a representative set of failure rates developed for this study, for a variety of component quality grades (space-rated, mil-spec, ruggedized, and commercial). The results show that careful application of redundancy and selected component improvement should result in Lunar Surface Systems architectures that exhibit an appropriate degree of fault-tolerance, reliability, performance, and affordability.

Borer, Nicholas↗

Investing American Recovery and Reinvestment Act Funds to Advance Capability, Reliability, and Performance in NASA Wind Tunnels

The National Aeronautics and Space Administration's (NASA) Aeronautics Test Program (ATP) is implementing five significant ground-based test facility projects across the nation with funding provided by the American Recovery and Reinvestment Act (ARRA). The projects were selected as the best candidates within the constraints of the ARRA and the strategic plan of ATP. They are a combination of much-needed large scale maintenance, reliability, and system upgrades plus creating new test beds for upcoming research programs. The projects are: 1.) Re-activation of a large compressor to provide a second source for compressed air and vacuum to the Unitary Plan Wind Tunnel at the Ames Research Center (ARC) 2.) Addition of high-altitude ice crystal generation at the Glenn Research Center Propulsion Systems Laboratory Test Cell 3, 3.) New refrigeration system and tunnel heat exchanger for the Icing Research Tunnel at the Glenn Research Center, 4.) Technical viability improvements for the National Transonic Facility at the Langley Research Center, and 5.) Modifications to conduct Environmentally Responsible Aviation and Rotorcraft research at the 14 x 22 Subsonic Tunnel at Langley Research Center. The selection rationale, problem statement, and technical solution summary for each project is given here. The benefits and challenges of the ARRA funded projects are discussed. Indirectly, this opportunity provides the advantages of developing experience in NASA's workforce in large projects and maintaining corporate knowledge in that very unique capability. It is envisioned that improved facilities will attract a larger user base and capabilities that are needed for current and future research efforts will offer revenue growth and future operations stability. Several of the chosen projects will maximize wind tunnel reliability and maintainability by using newer, proven technologies in place of older and obsolete equipment and processes. The projects will meet NASA's goal of integrating more efficient, environmentally safer, and less energy consuming hardware and processes into existing tunnel systems. These include Environmental Protection Agency-approved refrigerants, energy efficient motors, and faster, flexible tunnel data systems.

Sydnor, Goerge H.↗

Working with Consortia - Advanced Packaging Reliability

Description: Support the responsible NASA official for lead-free solder evaluation. Serve as the NASA technical liaison to the NASA/DoD Pb-free Project. Assure NASA areas of interest are included in JG-PP follow-on work. Support NASA/DoD telcons and face-to-face meetings. Update MSFC lead-free solder lessons learned report. FY10 plans: - Reliability data on lead-free solder applications for various part lead finishes and board finishes. - Update lead-free solder risks and risk mitigation strategies for NASA. - Evaluate lead-free alloy/lead-free finish reliability in design application. - Status CAVE project on Pb-free solder aging effects. - Compile the LTESE flight and bench data.

Blanche, Jim↗

Shuttle Risk Progression: Use of the Shuttle Probabilistic Risk Assessment (PRA) to Show Reliability Growth

It is important to the Space Shuttle Program (SSP), as well as future manned spaceflight programs, to understand the early mission risk and progression of risk as the program gains insights into the integrated vehicle through flight. The risk progression is important to the SSP as part of the documentation of lessons learned. The risk progression is important to future programs to understand reliability growth and the first flight risk. This analysis uses the knowledge gained from 30 years of operational flights and the current Shuttle PRA to calculate the risk of Loss of Crew and Vehicle (LOCV) at significant milestones beginning with the first flight. Key flights were evaluated based upon historical events and significant re-designs. The results indicated that the Shuttle risk tends to follow a step function as opposed to following a traditional reliability growth pattern where risk exponentially improves with each flight. In addition, it shows that risk can increase due to trading safety margin for increased performance or due to external events. Due to the risk drivers not being addressed, the risk did not improve appreciably during the first 25 flights. It was only after significant events occurred such as Challenger and Columbia, where the risk drivers were apparent, that risk was significantly improved. In addition, this paper will show that the SSP has reduced the risk of LOCV by almost an order of magnitude. It is easy to look back afte r 30 years and point to risks that are now obvious, however; the key is to use this knowledge to benefit other programs which are in their infancy stages. One lesson learned from the SSP is understanding risk drivers are essential in order to considerably reduce risk. This will enable the new program to focus time and resources on identifying and reducing the significant risks. A comprehensive PRA, similar to that of the Shuttle PRA, is an effective tool quantifying risk drivers if support from all of the stakeholders is given.

Hamlin, Teri L.↗

Reliable Multicore Processors for NASA Space Missions

The current trend in commercial processors of moving to many cores (30 to100 and beyond) on a single die poses both an opportunity and a challenge for space based processing. 1 2 The opportunity is to leverage this trend for space application and thus provide an order of magnitude increase in onboard processing capability. The challenge is to provide the requisite reliability in an extremely challenging environment. In this paper, we will discuss the requirements for reliable space based multicore computing and approaches being explored to deliver this capability within NASA's extremely tight power, mass, and cost constraints.

radiation hardening↗

History of Reliability and Quality Assurance at Kennedy Space Center

This Kennedy Historical Document (KHD) provides a unique historical perspective of the organizational and functional responsibilities for the manned and un-manned programs at Kennedy Space Center, Florida. As systems become more complex and hazardous, the attention to detailed planning and execution continues to be a challenge. The need for a robust reliability and quality assurance program will always be a necessity to ensure mission success. As new space missions are defined and technology allows for continued access to space, these programs cannot be compromised. The organizational structure that has provided the reliability and quality assurance functions for both the manned and unmanned programs has seen many changes since the first group came to Florida in the 1950's. The roles of government and contractor personnel have changed with each program and organizational alignment has changed based on that responsibility. The organizational alignment of the personnel performing these functions must ensure independent assessment of the processes.

Childers, Frank M.↗

Accounting for Proof Test Data in a Reliability Based Design Optimization Framework

This paper investigates the use of proof (or acceptance) test data during the reliability based design optimization of structural components. It is assumed that every component will be proof tested and that the component will only enter into service if it passes the proof test. The goal is to reduce the component weight, while maintaining high reliability, by exploiting the proof test results during the design process. The proposed procedure results in the simultaneous design of the structural component and the proof test itself and provides the designer with direct control over the probability of failing the proof test. The procedure is illustrated using two analytical example problems and the results indicate that significant weight savings are possible when exploiting the proof test results during the design process.

Ventor, Gerharad↗