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At least 847 records · Page 47

Retinal Light Processing Using Carbon Nanotubes

Method and system for processing light signals received by the eye of a human or other animal, where the eye may be compromised or non-functioning. Incident light is received at first and second pixels in a photodetector array and provides a pixel electrical signal representing the received light. Each of an array of carbon nanotube (CNT) towers is connected to a pixel, has a first tower end penetrating a retinal active layer of the animal and has a second tower end positioned to receive to receive and transport the pixel electrical signal to the retinal active layer. The CNT tower may be coated with a biologically active substance or chemically modified to promote neurite connections with the tower. The photoreceptor array can be provide with a signal altering mechanism that alters at least one of light intensity and wavelength intensity sensed by a first pixel relative to a second pixel, to correct for one or more selected eye problems.

David J Loftus↗

Background Count Rates and the Anti-Coincidence Detector on the Instrument on Astro-E2

Minimum ionizing particles incident on the XRS microcalorimeter array will deposit energy in the pixels on the same scale as an x-ray photon and would be confused with x-rays without an anti-coincidence detector. The XRS anti-coincidence detector is a silicon ionization detector placed directly behind the calorimeter array. Given an isotropic particle flux, 98% of those particles that pass through a calorimeter pixel will also deposit energy in the anti-coincidence detector. Particle events that are not rejected by coincidence are those that pass through at small angles relative to the plane of the array, and thus deposit more energy. Modeling with GEANT4 showed that only 0.1% of all protons incident on the array miss the anti-coincidence detector yet deposit less than 10 keV in a pixel. The unrejected background will thus be dominated by secondary events; we will provide an estimate of this rate. Protons incident on the thick silicon frame around the active area of the array deposit enough energy t o heat the whole chip slightly. This results in small simultaneous pulses on multiple pixels. These can be easily rejected by pixel-to-pixel coincidence. We will discuss the impact of these events on the instrument dead time and will present the expected rate. We will present laboratory background data demonstrating the performance of the anti-coincidence detector and the effectiveness of coincidence analysis in the laboratory environment.

Kilbourne, C. A.↗

Dynamically re-configurable CMOS imagers for an active vision system

A vision system is disclosed. The system includes a pixel array, at least one multi-resolution window operation circuit, and a pixel averaging circuit. The pixel array has an array of pixels configured to receive light signals from an image having at least one tracking target. The multi-resolution window operation circuits are configured to process the image. Each of the multi-resolution window operation circuits processes each tracking target within a particular multi-resolution window. The pixel averaging circuit is configured to sample and average pixels within the particular multi-resolution window.

Yang, Guang↗

Image Segmentation Analysis for NASA Earth Science Applications

NASA collects large volumes of imagery data from satellite-based Earth remote sensing sensors. Nearly all of the computerized image analysis of this data is performed pixel-by-pixel, in which an algorithm is applied directly to individual image pixels. While this analysis approach is satisfactory in many cases, it is usually not fully effective in extracting the full information content from the high spatial resolution image data that s now becoming increasingly available from these sensors. The field of object-based image analysis (OBIA) has arisen in recent years to address the need to move beyond pixel-based analysis. The Recursive Hierarchical Segmentation (RHSEG) software developed by the author is being used to facilitate moving from pixel-based image analysis to OBIA. The key unique aspect of RHSEG is that it tightly intertwines region growing segmentation, which produces spatially connected region objects, with region object classification, which groups sets of region objects together into region classes. No other practical, operational image segmentation approach has this tight integration of region growing object finding with region classification This integration is made possible by the recursive, divide-and-conquer implementation utilized by RHSEG, in which the input image data is recursively subdivided until the image data sections are small enough to successfully mitigat the combinatorial explosion caused by the need to compute the dissimilarity between each pair of image pixels. RHSEG's tight integration of region growing object finding and region classification is what enables the high spatial fidelity of the image segmentations produced by RHSEG. This presentation will provide an overview of the RHSEG algorithm and describe how it is currently being used to support OBIA or Earth Science applications such as snow/ice mapping and finding archaeological sites from remotely sensed data.

Tilton, James C.↗

The OMPS Limb Profiler Instrument: An Alternative Data Analysis and Retrieval Algorithm

The upcoming Ozone Mapper and Profiler Suite (OMPS), which will be launched on the NPOESS Preparatory Project (NPP) platform in early 2011, will continue monitoring the global distribution of the Earth's middle atmosphere ozone and aerosol. OMPS is composed of three instruments, namely the Total Column Mapper (heritage: TOMS, OMI), the Nadir Profiler (heritage: SBUV) and the Limb Profiler (heritage: SOLSE/LORE, OSIRIS, SCIAMACHY, SAGE III). The ultimate goal of the mission is to better understand and quantify the rate of stratospheric ozone recovery. The focus of the paper will be on the Limb Profiler (LP) instrument. The LP instrument will measure the Earth fs limb radiance (which is due to the scattering of solar photons by air molecules, aerosol and Earth surface) in the ultra-violet (UV), visible and near infrared, from 285 to 1000 nm. The LP simultaneously images the whole vertical extent of the Earth's limb through three vertical slits, each covering a vertical tangent height range of 100 km and each horizontally spaced by 250 km in the cross-track direction. The focal plane of the LP spectrometer is a two ]dimensional CCD array comprised of 340 x 740 pixels. Several data analysis tools are presently being constructed and tested to retrieve ozone and aerosol vertical distribution from limb radiance measurements. The primary NASA algorithm is based on earlier algorithms developed for the SOLSE/LORE and SAGE III limb scatter missions. The paper will describe an alternative algorithm which will retrieve ozone density and aerosol extinction directly from radiance data collected on individual CCD pixels. This alternative method uses an optimal estimation approach to retrieve ozone and aerosol in the 10-60 km range from the information contained within an ensemble of about 50000 down-linked pixels. Tangent height registration is performed using the Rayleigh Scattering Attitude Sensor (RSAS) technique applied to columns of pixels in the 340-360 nm range. Cloud height is determined by analyzing the radiance first derivative along pixel columns at longer wavelengths. Wavelength registration is performed using rows of pixels and identifying Fraunhofer solar lines within the measured spectra. Special attention is given to stray-light decontamination and modeling of the measured finite spectral/spatial line shape functions.

Rault, Didier F.↗

Kilopixel X-Ray Microcalorimeter Arrays for Astrophysics: Device Performance and Uniformity

We are developing kilo-pixel arrays of TES microcalorimeters to enable high-resolution X-ray imaging spectrometers for future X-ray observatories and laboratory astrophysics experiments. Our current array design was targeted as a prototype for the X-ray Microcalorimeter Spectrometer proposed for the International X-ray Observatory, which calls for a 40x40-pixel core array of 300 micron devices with 2.5 e V energy resolution (at 6 keV). Here we present device characterization of our 32x32 arrays, including X-ray spectral performance of individual pixels within the array. We present our results in light of the understanding that our Mo/Au TESs act as weak superconducting links, causing the TES critical current (Ic) and transition shape to oscillate with applied magnetic field (B). We show Ic(B) measurements and discuss the uniformity of these measurements across the array, as well as implications regarding the uniformity of device noise and response. In addition, we are working to reduce pixel-to-pixel electrical and thermal crosstalk; we present recent test results from an array that has microstrip wiring and an angle-evaporated Cu backside heatsinking layer, which provides Cu coverage on the four sidewalls of the silicon wells beneath each pixel.

Eckart, M. E.↗

Toward Unified Satellite Climatology of Aerosol Properties. 3. MODIS Versus MISR Versus AERONET

We use the full duration of collocated pixel-level MODIS-Terra and MISR aerosol optical thickness (AOT) retrievals and level 2 cloud-screened quality-assured AERONET measurements to evaluate the likely individual MODIS and MISR retrieval accuracies globally over oceans and land. We show that the use of quality-assured MODIS AOTs as opposed to the use of all MODIS AOTs has little effect on the resulting accuracy. The MODIS and MISR relative standard deviations (RSTDs) with respect to AERONET are remarkably stable over the entire measurement record and reveal nearly identical overall AOT performances of MODIS and MISR over the entire suite of AERONET sites. This result is used to evaluate the likely pixel-level MODIS and MISR performances on the global basis with respect to the (unknown) actual AOTs. For this purpose, we use only fully compatible MISR and MODIS aerosol pixels. We conclude that the likely RSTDs for this subset of MODIS and MISR AOTs are 73% over land and 30% over oceans. The average RSTDs for the combined [AOT(MODIS)+AOT(MISR)]/2 pixel-level product are close to 66% and 27%, respectively, which allows us to recommend this simple blend as a better alternative to the original MODIS and MISR data. These accuracy estimates still do not represent the totality of MISR and quality-assured MODIS pixel-level AOTs since an unaccounted for and potentially significant source of errors is imperfect cloud screening. Furthermore, many collocated pixels for which one of the datasets reports a retrieval, whereas the other one does not may also be problematic.

Mishchenko, Michael I.↗

ASIC Readout Circuit Architecture for Large Geiger Photodiode Arrays

The objective of this work was to develop a new class of readout integrated circuit (ROIC) arrays to be operated with Geiger avalanche photodiode (GPD) arrays, by integrating multiple functions at the pixel level (smart-pixel or active pixel technology) in 250-nm CMOS (complementary metal oxide semiconductor) processes. In order to pack a maximum of functions within a minimum pixel size, the ROIC array is a full, custom application-specific integrated circuit (ASIC) design using a mixed-signal CMOS process with compact primitive layout cells. The ROIC array was processed to allow assembly in bump-bonding technology with photon-counting infrared detector arrays into 3-D imaging cameras (LADAR). The ROIC architecture was designed to work with either common- anode Si GPD arrays or common-cathode InGaAs GPD arrays. The current ROIC pixel design is hardwired prior to processing one of the two GPD array configurations, and it has the provision to allow soft reconfiguration to either array (to be implemented into the next ROIC array generation). The ROIC pixel architecture implements the Geiger avalanche quenching, bias, reset, and time to digital conversion (TDC) functions in full-digital design, and uses time domain over-sampling (vernier) to allow high temporal resolution at low clock rates, increased data yield, and improved utilization of the laser beam.

Vasile, Stefan↗

Terahertz Array Receivers with Integrated Antennas

Highly sensitive terahertz heterodyne receivers have been mostly single-pixel. However, now there is a real need of multi-pixel array receivers at these frequencies driven by the science and instrument requirements. In this paper we explore various receiver font-end and antenna architectures for use in multi-pixel integrated arrays at terahertz frequencies. Development of wafer-level integrated terahertz receiver front-end by using advanced semiconductor fabrication technologies has progressed very well over the past few years. Novel stacking of micro-machined silicon wafers which allows for the 3-dimensional integration of various terahertz receiver components in extremely small packages has made it possible to design multi-pixel heterodyne arrays. One of the critical technologies to achieve fully integrated system is the antenna arrays compatible with the receiver array architecture. In this paper we explore different receiver and antenna architectures for multi-pixel heterodyne and direct detector arrays for various applications such as multi-pixel high resolution spectrometer and imaging radar at terahertz frequencies.

direct detector arrays↗

Image Correlation Pattern Optimization for Micro-Scale In-Situ Strain Measurements

The accuracy and precision of digital image correlation (DIC) is a function of three primary ingredients: image acquisition, image analysis, and the subject of the image. Development of the first two (i.e. image acquisition techniques and image correlation algorithms) has led to widespread use of DIC; however, fewer developments have been focused on the third ingredient. Typically, subjects of DIC images are mechanical specimens with either a natural surface pattern or a pattern applied to the surface. Research in the area of DIC patterns has primarily been aimed at identifying which surface patterns are best suited for DIC, by comparing patterns to each other. Because the easiest and most widespread methods of applying patterns have a high degree of randomness associated with them (e.g., airbrush, spray paint, particle decoration, etc.), less effort has been spent on exact construction of ideal patterns. With the development of patterning techniques such as microstamping and lithography, patterns can be applied to a specimen pixel by pixel from a patterned image. In these cases, especially because the patterns are reused many times, an optimal pattern is sought such that error introduced into DIC from the pattern is minimized. DIC consists of tracking the motion of an array of nodes from a reference image to a deformed image. Every pixel in the images has an associated intensity (grayscale) value, with discretization depending on the bit depth of the image. Because individual pixel matching by intensity value yields a non-unique scale-dependent problem, subsets around each node are used for identification. A correlation criteria is used to find the best match of a particular subset of a reference image within a deformed image. The reader is referred to references for enumerations of typical correlation criteria. As illustrated by Schreier and Sutton and Lu and Cary systematic errors can be introduced by representing the underlying deformation with under-matched shape functions. An important implication, as discussed by Sutton et al., is that in the presence of highly localized deformations (e.g., crack fronts), error can be reduced by minimizing the subset size. In other words, smaller subsets allow the more accurate resolution of localized deformations. Contrarily, the choice of optimal subset size has been widely studied and a general consensus is that larger subsets with more information content are less prone to random error. Thus, an optimal subset size balances the systematic error from under matched deformations with random error from measurement noise. The alternative approach pursued in the current work is to choose a small subset size and optimize the information content within (i.e., optimizing an applied DIC pattern), rather than finding an optimal subset size. In the literature, many pattern quality metrics have been proposed, e.g., sum of square intensity gradient (SSSIG), mean subset fluctuation, gray level co-occurrence, autocorrelation-based metrics, and speckle-based metrics. The majority of these metrics were developed to quantify the quality of common pseudo-random patterns after they have been applied, and were not created with the intent of pattern generation. As such, it is found that none of the metrics examined in this study are fit to be the objective function of a pattern generation optimization. In some cases, such as with speckle-based metrics, application to pixel by pixel patterns is ill-conditioned and requires somewhat arbitrary extensions. In other cases, such as with the SSSIG, it is shown that trivial solutions exist for the optimum of the metric which are ill-suited for DIC (such as a checkerboard pattern). In the current work, a multi-metric optimization method is proposed whereby quality is viewed as a combination of individual quality metrics. Specifically, SSSIG and two auto-correlation metrics are used which have generally competitive objectives. Thus, each metric could be viewed as a constraint imposed upon the others, thereby precluding the achievement of their trivial solutions. In this way, optimization produces a pattern which balances the benefits of multiple quality metrics. The resulting pattern, along with randomly generated patterns, is subjected to numerical deformations and analyzed with DIC software. The optimal pattern is shown to outperform randomly generated patterns.

Bomarito, G. F.↗

Fabrication of a Hybrid Transition Edge Sensor Array for Lynx

Lynx is a proposed NASA X-Ray telescope flight mission aimed at achieving state-of-the-art angular and energy resolution with a 100 kilopixel array to probe the hot energetic young universe in unprecedented detail. To achieve these goals, our team plans on leveraging our current work in development of the focal plane for the Athena X-Ray Integral Field Unit (X-IFU) while advancing the state-of-the-art in transition edge sensor (TES) X-ray detector technology. The TES is an optimal technology for achieving both high energy and fine angular resolution at the same time because pixel features can be made extremely small and the absorber which dominates the heat capacity can be tuned to meet resolution requirements. Specifically, the proposed mission concept calls for a hybrid detector of three different arrays fabricated in the same planar process in one focal plane and optimized for different science goals. The main arrays consist of 5x5 hydras, 25 pixels of 4 micron thick Au absorbers each with a different thermal link to one common TES. The outer array has absorbers on a 50-micron pitch for most of the 5 arc-minute field-of-view, and the inner array has 25-micron absorbers for the central 1 arc-minute region. A high resolution array consisting of single pixel 1 micron thick Au absorbers on 50-micron pitch will lie off to the side. Reading out an array of this magnitude will likely require improvements in indium bump bonding to superconducting flexible wiring. Fabrication of absorbers of two different sizes requires electroplating through a photoresist mold by careful tuning of the current density to achieve uniform flat absorbers on a fine pitch scale, followed by ion milling to yield narrow streets separating the pixels while preserving high quantum efficiency. We report on progress made at fabricating the hybrid array with different absorber sizes and thicknesses. Further, we also report on ongoing work to adequately heat sink the pixels with backside wire bonding and copper coating. We also report on work to improve detector pixel yield and top side indium bump bonding to flexible wiring.

Focal plane array↗

Prototype Magnetic Calorimeter Arrays with Buried Wiring for the Lynx X-Ray Microcalorimeter

Metallic magnetic calorimeter (MMC) technology is a leading contender for detectors for the Lynx X-ray Microcalorimeter, which is an imaging spectrometer consisting of an array of greater than 100,000 pixels. The fabrication of such large arrays presents a challenge when attempting to route the superconducting wiring from the pixels to the multiplexed readout. If the wiring is designed to be planar, then an aggressive, submicron scale wiring pitch has to be employed, which is technically challenging to design and fabricate on account of the requirements of low inductance, low cross-talk, high critical currents and high yield. An alternative way to achieve large scale, high density wiring is through the use of multiple buried metal layers, planarized by Chemical Mechanical Planarization. This approach is well-suited for connecting thousands of pixels on a large focal plane to readout chips, and also for fabricating sensor meander coils with narrow line widths, which helps in increasing the sensor inductance and thus alleviates stray inductance issues associated with the wiring in large size arrays. In this work we describe the fabrication of high sensor inductance MMC arrays implementing Lynx concepts and incorporating multiple layers of buried Nb wiring. The detector array is composed of three sub-arrays with pixels optimized to meet the different science driven performance requirements of Lynx. In two of the sub-arrays we adopt a thermal multiplexing scheme to read out pixels by coupling 25 absorbers to a single sensor through thermal links of varied thermal conductance. We demonstrate the successful fabrication of multi-absorber MMCs with fine pitch pixels in very large size arrays.

Solid-State Physics↗

Target Optimal Aperture Selection

This document describes the computation of optimal pixels for planetary transit targets. The method we describe is based on that used in the End-to-End Model (ETEM), which simulates Kepler science output. An optimal aperture for a target is defined as the set of pixels which maximizes the signal-to-noise ratio (SNR) for that target. The optimal aperture for a target is determined by using catalog data to generate, for that target, a synthetic image with all background stars and signals and a second synthetic image with the target star's flux only. These images are incorporated into a noise model, from which the SNR of each pixel is computed. The pixels around a target are summed in an order that maximizes the SNR with each term. As dimmer and dimmer pixels contribute to this sum, the SNR reaches a maximum and further terms decrease the SNR. The set of pixels whose SNR sums to this maximum value defines the optimal aperture.

Bryson, Stephen↗

Measuring Electron Temperature Using a Linear Polarizer Versus a Polarization Camera

Polarized K-coronal brightness (pB) of the solar corona can be measured by taking four successive coronal brightness images through a linear polarizer, by turning it through four successive angles in intervals of 45∘ and using a standard formula to measure pB from the total coronal brightness (TB) that contains both the polarized K- and the unpolarized F-coronal brightness. The question is: will the time-dependent, highly dynamic corona illuminate each pixel with the same brightness during the time it takes to take the four successive images? To mitigate this problem we now have the polarization camera, in which, each super-pixel is made up of four sub-pixels, and built in to these four sub-pixels is a polarization mask that contains four linear polarizers orientated at four angles 45∘ apart. This allows the measurement of pB to be made in a single exposure. Here, the question is: will the variations of the coronal brightness in the four adjacent sub-pixels in a super-pixel be sufficiently negligible to assume that they observe the same part of the corona? This article looks for answers to these two questions by conducting two synthetic experiments to measure the electron temperature in the plane of the sky on a spherically asymmetric model (SAM) corona by first using a linear polarizer, and then replacing it with a polarization camera and use statistical analyses to determine how well the measured temperature matched the true temperature for the two cases.

Reginald, Nelson↗

Detecting Nighttime Fire Combustion Phase by Hybrid Application of Visible and Infrared Radiation from Suomi NPP VIIRS

An accurate estimation of biomass burning emissions is 1 partially limited by the lack of knowledge of fire burning phase (smoldering vs. flaming). In recent years, several fire detection products have been developed to provide information of fire radiative power (FRP), location, size, and temperature of fire pixels, but no information regarding fire burning phase is retrieved. The Day-Night band (DNB) aboard Visible Infrared Imaging Radiometer Suite (VIIRS) is sensitive to visible light from flaming fires in nighttime scenes. In contrast, VIIRS 4 m moderate resolution band #13 (M13), though capable of detecting fires at all phases, has no direct sensitivity for discerning fire phase. However, the hybrid usage of VIIRS DNB and M-bands data is hampered by their different scanning technology and spatial resolution. In this study, we present a novel method to rapidly and accurately resample DNB pixel radiances to the footprint of M-band pixels, accounting for onboard detector aggregation schemes and bowtie effect removals. The visible energy fraction (VEF) is subsequently introduced as an indicator of fire burning phase VEF is calculated as the ratio of visible light power (VLP) to FRP for each fire pixel retrieved from the VIIRS 750 m active fire product. A global distribution of VEF values, and thereby the fire phase, is quantitatively obtained, showing smaller VEF values in regions with mostly smoldering wildfires, such as peatland fires in Indonesia, larger VEF values in regions with flaming wildfires over grasslands and savannas in the sub-Sahelian region, and the largest VEF values associated with gas flaring in the Middle East. Mean VEF for different land cover types or regions is highly correlated with modified combustion efficiency (MCE). These results, together with a case study of the 2018 California Camp Fire, show that the VEF has the potential to be an indicator of fire combustion phase for each fire pixel, appropriate for estimating emission factors at the satellite pixel level.

Jun Wang↗

Sensor Chip Assembly (SCA) Test Report

This report summarizes the measured performance for the Sensor Chip Assembly (SCA), which is identified in Table 1. The SCA architecture is a substrate-removed HgCdTe detector with an area of 4096x4096 pixels (with a reference pixel area of four pixels deep around all four sides, available to substitute corresponding image pixels) and a pixel pitch of 10 μm. This SCA has been tested at the Goddard Space Flight Center (GSFC/NASA) Detector Characterization Laboratory (DCL). Teledyne (the vendor) classifies its detectors into different grades based on testing performed at its facility. The classification of this SCA and the tested dates are included in Table 1 below. The tests performed on this array are derived from the document WFIRST-PROC-09220_WFIRST-SCA-ATP_-.docx. A summary of the test parameters, requirements, and test results is presented in Table 2. The details of each test are subsequently described in the report. In the Summary (Table 2), SCA results are reported at an operating temperature of 95K, and 1.0 V bias voltage. In the detailed section of each test, the results for 90 K (1.0V bias voltage) and 95 K (0.5V bias voltage) are also reported. For all cases, the frame time used is 2.764 seconds. Reference pixel correction was applied to every raw frame.

WFIRST SCA TEST REPORT↗

SCA Test Report: H4RG-20828 WFIRST

This report summarizes the measured performance for the Sensor Chip Assembly (SCA), which is identified in Table 1. The SCA architecture is a substrate-removed HgCdTe detector with an area of4096x4096 pixels (with a reference pixel area of four pixels deep around all four sides, available to substitute corresponding image pixels) and a pixel pitch of 10 μm. This SCA has been tested at the Goddard Space Flight Center (GSFC/NASA) Detector Characterization Laboratory (DCL). Teledyne (the vendor) classifies its detectors into different grades based on testing performed at its facility. The classification of this SCA and the tested dates are included in Table 1 below.The tests performed on this array are derived from the document WFIRST-PROC-09220_WFIRST-SCA-ATP_-.docx. A summary of the test parameters, requirements, and test results is presented in Table 2. The details of each test are subsequently described in the report. In the Summary (Table 2), SCA results are reported at an operating temperature of 95K, and 1.0 V bias voltage. In the detailed section of each test, the results for 90 K (1.0V bias voltage) and 95 K (0.5V bias voltage) are also reported. For all cases, the frame time used is 2.764 seconds. Reference pixel correction was applied to every raw frame.

Laddawan Miko↗

SCA Test Report, H4RG-20829 WFIRST

This report summarizes the measured performance for the Sensor Chip Assembly (SCA), which is identified in Table 1. The SCA architecture is a substrate-removed HgCdTe detector with an area of 4096x4096 pixels (with a reference pixel area of four pixels deep around all four sides, available to substitute corresponding image pixels) and a pixel pitch of 10 μm. This SCA has been tested at the Goddard Space Flight Center (GSFC/NASA) Detector Characterization Laboratory (DCL). Teledyne (the vendor) classifies its detectors into different grades based on testing performed at its facility. The classification of this SCA and the tested dates are included in Table 1 below. The tests performed on this array are derived from the document WFIRST-PROC-09220_WFIRST-SCA-ATP_-.docx. A summary of the test parameters, requirements, and test results is presented in Table 2. The details of each test are subsequently described in the report. In the Summary (Table 2), SCA results are reported at an operating temperature of 95K, and 1.0 V bias voltage. In the detailed section of each test, the results for 90 K (1.0V bias voltage) and 95 K (0.5V bias voltage) are also reported. For all cases, the frame time used is 2.764 seconds. Reference pixel correction was applied to every raw frame.

Laddawan R Miko↗