TREETRAN - A FORTRAN 4 subroutine package for manipulation of rooted trees
TREETRAN subroutine package in FORTRAN 4 for manipulation of tree structured data
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TREETRAN subroutine package in FORTRAN 4 for manipulation of tree structured data
Modal analysis computer program package for finding frequencies and mode shapes of any linear discrete system governed by generalized eigenvalue equation
Study program to develop packaging techniques for space electrical power assemblies
Familiarization manual for Apollo Lunar Surface Experiments Package describing mission, equipment, subsystems, maintenance, and operations
Technology utilization briefs on packaging and containers
Vacuum packaged titanium bulk sublimator/ion pump combination for reducing tritium hazard in neutron accelerator
Si solar cell cover glass assembly and packaging improvements using Teflon
HF microcircuits packaging inside magnetic cores, discussing inherent advantages of RF interference and radiation shielding and heat transfer properties
Vacuum package with Ti bulk sublimator/ion pump combination for 150 kv neutron generator tritium decontamination
Development of packaging system for mounting beam lead integrated chip circuit on lead frame is discussed. Process for fabricating large scale integration circuits is described. Diagrams illustrating method of construction are included.
Flexible input schemes for digital programs are described. No card format or special order of cards is required. Read package is controlled by small set of parameters which can be changed to account for differences in computers and digital programs.
The ground tracks and S190 swaths are presented of selected revolutions over areas containing earth resources experiment package (EREP) sites. The following eight EREP disciplines are shown: sensor performance evaluation, forestry, geology, hydrology, land use mapping, oceanography, pollution, and weather. Most of the data reported consists of passes over the continental United States.
The balloon interrogation package (BIP), an integral part of the overall interrogation, recording, and location subsystems (IRLS) for the Nimbus 4 program, is described. The BIP is a self-contained, integrated transponder designed to be carried aloft by a constant altitude, superpressure balloon to an altitude of 67,000 or 78,000 feet. After launch the BIP senses high-altitude balloon overpressure and temperature, and upon receipt of an interrogated command from the IRLS aboard the Nimbus 4 satellite, the BIP enodes the data on a real-time basis into a pulse-code modulation (PCM) format and transmits this data to the satellite. A summary of the program activity to produce 30 BIP systems and to support balloon launches from Ascension Island is presented.
A 200 watt SHF transmitter experiment package is discussed that incorporates a traveling wave tube utilizing a multistage depressed collector for efficiency enhancement. This experiment is being developed for flight testing on the CTS (Communications Technology Satellite).
The package design and assembly techniques for the IMP-F and IMP-G space-physics experiments, provided for the NASA Interplanetary Monitoring Platform Program are described. Thin-film, hybrid, integrated circuits used in these instruments to increase component density and reliability, and special procedures and precautions for the fabrication of space hardware are described.
The continued useful operation of the OAO-2 Wisconsin Experiment Package (WEP) for almost three years after its December 1968 launch is evidence of a superior engineering accomplishment. Reliability features of the experiment concept and design which have contributed to its long life are presented. Data anomalies and partial failures are summarized along with conclusions regarding their causes. The thermal, vacuum and radiation effects of the space environment are shown to be minimal and quite localized within the WEP.
Maintainability must be designed into long-duration spacecraft and equipment to provide the required high probability of mission success with the least cost and weight. The ability to perform repairs quickly and easily in a space environment can be achieved by imposing specific maintainability design criteria on spacecraft equipment design and installation. A study was funded to investigate and define design criteria for electronic equipment that would permit rapid removal and replacement in a space environment. The results of the study are discussed together with subsequent simulated zero-g demonstration tests of a mockup with new concepts for packaging.
The feasibility of a scientific instrument package (SIP) that will satisfy the requirements of the large space telescope was established. A reference configuration serving as a study model and data which will aid in the trade-off studies leading to the final design configuration are reported.