Nondestructive testing techniques for multilayer printed wiring boards.
Nondestructive testing techniques for multilayer printed wiring boards stressing axial transverse laminography and mutual coupling
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Nondestructive testing techniques for multilayer printed wiring boards stressing axial transverse laminography and mutual coupling
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Application of the microhm measuring circuit to measurement of plated-through hole resistances, when combined with appropriate probes, provides data that can be related to the quality of copper plating on printed wiring boards. Acceptance limits can be established and continuous inspection performed, with plating defects causing abnormal readings.
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